Mi sensor and method for manufacturing mi sensor

Patent metadata

Field	Value
Publication number	US-2021109169-A1
Application number	US-201917043768-A
Country	US
Kind code	A1
Filing date	May 21, 2019
Priority date	Jun 27, 2018
Publication date	Apr 15, 2021
Grant date	—

Abstract

An MI sensor includes: an amorphous wire; an insulator layer formed on an outer peripheral surface of the amorphous wire; and an X-axis coil, a Y-axis coil, and a Z-axis coil which are formed, in a spiral shape, on an outer peripheral surface of the insulator layer. The X-axis coil, the Y-axis coil, and the Z-axis coil are formed of a conductive layer, and the X-axis coil, the Y-axis coil, and the Z-axis coil are arranged in directions orthogonal to each other.

First claim

What is claimed is:

1 . An MI sensor comprising:
a linear magnetic conductor; an insulator layer formed on an outer peripheral surface of the magnetic conductor; and a first coil, a second coil, and a third coil which are formed, in a spiral shape, on an outer peripheral surface of the insulator layer, wherein the first coil, the second coil, and the third coil are formed of a conductive layer, and the first coil, the second coil, and the third coil are arranged in directions orthogonal to each other.

2 . The MI sensor according to claim 1 , wherein
the first coil, the second coil, and the third coil are fixed by a fixing portion.

3 . The MI sensor according to claim 1 , wherein
both ends of the first coil, the second coil, and the third coil are formed as annular coil electrodes, each of the annular coil electrodes surrounding the insulator layer.

4 . A method for manufacturing an MI sensor comprising:
an insulation step of forming an insulator layer on an outer peripheral surface of a linear magnetic conductor; a conductive layer formation step of forming a conductive layer on an outer peripheral surface of the insulator layer; a resist step of forming a resist layer on an outer peripheral surface of the conductive layer; an exposure step of exposing the resist layer with a laser to form a first groove strip, a second groove strip, and a third groove strip each having a spiral shape on an outer peripheral surface of the resist layer, form a first gap that surrounds the resist layer between the first groove strip and the second groove strip on the outer peripheral surface of the resist layer, and form a second gap that surrounds the resist layer between the second groove strip and the third groove strip on the outer peripheral surface of the resist layer; an etching step of performing etching using the resist layer as a masking material and removing the conductive layer in the first groove strip, the second groove strip, the third groove strip, the first gap, and the second gap to form a first coil with the conductive layer remaining around the first groove strip, form a second coil with the conductive layer remaining around the second groove strip, and form a third coil with the conductive layer remaining around the third groove strip; and a bending step of bending the magnetic conductor and the insulator layer between the first coil and the second coil and between the second coil and the third coil to arrange the first coil, the second coil, and the third coil in directions orthogonal to each other.

5 . The method for manufacturing an MI sensor according to claim 4 , further comprising
a fixing step of fixing the first coil, the second coil, and the third coil, arranged in the bending step, with a fixing portion.

6 . The method for manufacturing the MI sensor according to claim 4 , wherein
in the exposure step, a first end that surrounds the resist layer is formed on a side closer to an outer end than the first groove strip is, on the outer peripheral surface of the resist layer; a second end that surrounds the resist layer is formed on a side closer to an outer end than the third groove strip is, on the outer peripheral surface of the resist layer; and the first end, the first groove strip, the first gap, the second groove strip, the second gap, the third groove strip, and the second end are formed separately from each other, and in the etching step, the conductive layers remaining at both ends of the first coil, the second coil, and the third coil are formed as annular coil electrodes each of which surrounds the insulator layer.

7 . The MI sensor according to claim 2 , wherein
both ends of the first coil, the second coil, and the third coil are formed as annular coil electrodes, each of the annular coil electrodes surrounding the insulator layer.

8 . The method for manufacturing the MI sensor according to claim 5 , wherein
in the exposure step, a first end that surrounds the resist layer is formed on a side closer to an outer end than the first groove strip is, on the outer peripheral surface of the resist layer; a second end that surrounds the resist layer is formed on a side closer to an outer end than the third groove strip is, on the outer peripheral surface of the resist layer; and the first end, the first groove strip, the first gap, the second groove strip, the second gap, the third groove strip, and the second end are formed separately from each other, and in the etching step, the conductive layers remaining at both ends of the first coil, the second coil, and the third coil are formed as annular coil electrodes each of which surrounds the insulator layer.

Assignees

• Nidec Read Corp

Inventors

• Kusuda Tatsufumi

Classifications

• H01F41/046

  structurally combined with ferromagnetic material · CPC title

• H01F5/003

  Printed circuit coils · CPC title

• G01R33/063 Primary

  Magneto-impedance sensors; Nanocristallin sensors · CPC title

• G01R33/0052

  Manufacturing aspects; Manufacturing of single devices, i.e. of semiconductor magnetic sensor chips (devices based on galvano-magnetic effect or the like H10N50/85) · CPC title

• H01F27/28

  Coils; Windings; Conductive connections · CPC title