Post exposure processing apparatus

Patent metadata

Field	Value
Publication number	US-2021026257-A1
Application number	US-202017062326-A
Country	US
Kind code	A1
Filing date	Oct 2, 2020
Priority date	Dec 20, 2016
Publication date	Jan 28, 2021
Grant date	—

Abstract

Implementations described herein relate to apparatus for post exposure processing. More specifically, implementations described herein relate to field-guided post exposure process chambers and cool down/development chambers used on process platforms. In one implementation, a plurality of post exposure process chamber and cool/down development chamber pairs are positioned on a process platform in a stacked arrangement and utilize a shared plumbing module. In another implementation, a plurality of post exposure process chamber and cool down/development chambers are positioned on a process platform in a linear arrangement and each of the chambers utilize an individually dedicated plumbing module.

First claim

What is claimed is:

1 . A platform apparatus, comprising:
a plumbing module; and a process module comprising:
a central region having a robot disposed therein; and
a plurality of process stations disposed about the central region and sharing the plumbing module, wherein each process station includes a process chamber and a post process chamber in a stacked arrangement, the process chamber further comprising:
a chamber body defining a process volume;
a door coupled to the chamber body;
a first electrode coupled to the door; and
a power source communicatively coupled to the first electrode.

2 . The platform apparatus of claim 1 , wherein a major axis of the process volume is oriented vertically and a minor axis of the process volume is oriented horizontally.

3 . The platform apparatus of claim 1 , wherein the power source is configured to provide power ranging between about 1 V and about 20 kV to the first electrode.

4 . The platform apparatus of claim 3 , wherein the power source is configured to provide power with a frequency between about 0.1 Hz and about 1 MHz to the first electrode.

5 . The platform apparatus of claim 4 , wherein the power source is configured to generate an electric field ranging between about 1 kV/m and about 2 MV/m within the process volume.

6 . The platform apparatus of claim 4 , wherein the power source is configured to operate in a voltage-controlled mode.

7 . The platform apparatus of claim 4 , wherein the power source is configured to operate in a current-controlled mode.

8 . The platform apparatus of claim 4 , wherein the power source is configured to generate AC, DC, and pulsed DC waveforms.

9 . The platform apparatus of claim 8 , wherein the power source is configured to generate AC and pulsed DC power having a duty cycle between about 5% and about 95%.

10 . The platform apparatus of claim 9 , wherein the power source is configured to generate AC and pulsed DC power having a rise and fall time between about 1 ns and about 1000 ns.

11 . The platform apparatus of claim 1 , wherein the process chamber further comprises:
a second electrode coupled to the chamber body, the second electrode disposed opposite the first electrode; a first plurality of fluid ports formed in a sidewall of the chamber body adjacent the process volume; and a second plurality of fluid ports formed in the sidewall of the chamber body adjacent the process volume opposite the first plurality of fluid ports.

12 . A platform apparatus, comprising:
a factory interface; a plumbing module; and a process module coupled to the factory interface and the plumbing module, the process module comprising:
a central region having a robot disposed therein; and
a plurality of process stations disposed about the central region and sharing the plumbing module, wherein each process station includes a process chamber and a post process chamber in a stacked arrangement, the process chamber further comprising:
a chamber body defining a process volume, wherein a major axis of the process volume is oriented vertically and a minor axis of the process volume is oriented horizontally;
a door coupled to the chamber body;
a first electrode coupled to the door;
a plurality of fluid ports formed in a sidewall of the chamber body adjacent the process volume; and
a power source communicatively coupled to the first electrode.

13 . The platform apparatus of claim 12 , wherein the power source is configured to provide a power ranging between about 1 V and about 20 kV to the first electrode.

14 . The platform apparatus of claim 12 , wherein the power source is configured to provide a power with a frequency between about 0.1 Hz and about 1 MHz to the first electrode.

15 . The platform apparatus of claim 12 , wherein the power source is configured to generate an electric field ranging between about 1 kV/m and about 2 MV/m within the process volume.

16 . The platform apparatus of claim 12 , wherein the power source is configured to operate in a voltage-controlled mode.

17 . The platform apparatus of claim 12 , wherein the power source is configured to operate in a current-controlled mode.

18 . The platform apparatus of claim 12 , wherein the power source is configured to generate AC, DC, and pulsed DC waveforms to the first electrode.

19 . The platform apparatus of claim 18 , wherein the power source is configured to generate AC and pulsed DC power having a duty cycle between about 20% and about 60%.

20 . A substrate processing method, comprising:
positioning a substrate on a first electrode within a process volume; moving the first electrode to a process position adjacent a second electrode disposed within the process volume; introducing a process fluid into the process volume between the first electrode and the second electrode, the process fluid introduced at a rate between 5 L/min and 10 L/min; and generating an electric field between the first electrode and the second electrode and applying the electric field to the substrate via the process fluid, the electric field having a strength between about 1 kV/m and about 2 MV/m.

Assignees

• Applied Materials Inc

Inventors

• Babayan Viachslav
• Godet Ludovic
• Hanson Kyle M
• Moore Robert B

Classifications

• H10P72/0602

  Temperature monitoring · CPC title

• H10P72/0462

  characterised by the construction of the processing chambers, e.g. modular processing chambers · CPC title

• H10P72/0458

  vertical arrangement · CPC title

• H10P72/0454

  surrounding a central transfer chamber · CPC title

• H10P72/0441

  Apparatus for sealing, encapsulating, glassing, decapsulating or the like · CPC title