Plating apparatus and plating method

Patent metadata

Field	Value
Publication number	US-2020332430-A1
Application number	US-201816764008-A
Country	US
Kind code	A1
Filing date	Nov 27, 2018
Priority date	Nov 30, 2017
Publication date	Oct 22, 2020
Grant date	—

Abstract

The present invention relates to a plating apparatus and a plating method for partially forming a plating film on an object to be plated. The plating apparatus includes: a rotary electrode configured to be rotatable; a plating solution holding unit arranged to the rotary electrode and configured to hold a plating solution; and a power supply unit configured to apply a voltage between the portion to be plated and the rotary electrode.

First claim

1 . A plating apparatus, which is configured to form a plating film on a portion to be plated of an object to be plated,
the plating apparatus comprising: a rotary electrode configured to be rotatable; a plating solution holding unit arranged to the rotary electrode and configured to hold a plating solution; and a power supply unit configured to apply a voltage between the portion to be plated brought into contact with the plating solution holding unit and the rotary electrode under a state in which the object to be plated is placed on the rotary electrode through intermediation of the plating solution holding unit.

2 - 7 . (canceled)

8 . The plating apparatus according to claim 1 , wherein a mechanism for holding the object to be plated is configured to be able to adjust a contact pressure of the portion to be plated to the plating solution holding unit.

9 . The plating apparatus according to claim 1 ,
wherein the rotary electrode comprises: a flat surface portion; a first vertical portion extending in a vertical direction from an end portion of the flat surface portion; and a second vertical portion extending in the vertical direction from a center portion of the flat surface portion, and wherein the plating solution holding unit is held by the flat surface portion and the first vertical portion of the rotary electrode.

10 . The plating apparatus according to claim 1 ,
wherein the power supply unit comprises a control part configured to perform control of switching an anode and a cathode between the portion to be plated and the rotary electrode during plating treatment.

11 . The plating apparatus according to claim 1 , further comprising a plating solution supply unit configured to supply the plating solution to the plating solution holding unit.

12 . The plating apparatus according to claim 11 ,
wherein the rotary electrode is configured to be rotatable about a shaft, wherein the plating solution supply unit comprises an ejection port configured to eject the plating solution, and wherein the ejection port is arranged above the shaft.

13 . The plating apparatus according to claim 1 , wherein the rotary electrode is formed of any one of platinum, titanium-platinum, titanium-iridium oxide, stainless steel, and carbon.

14 . A plating method, comprising, under a state in which an object to be plated is placed on a rotary electrode through intermediation of a plating solution holding unit having held a plating solution, and a portion to be plated of the object to be plated is brought into contact with the plating solution holding unit, while rotating the rotary electrode having arranged thereto the plating solution holding unit, applying a voltage between the portion to be plated and the rotary electrode.

15 . The plating method according to claim 14 , wherein the rotary electrode has a size larger than a plating area of the object to be plated.

16 . The plating method according to claim 14 , wherein the object to be plated has a circular track with respect to the rotary electrode.

17 . The plating method according to claim 14 , further comprising, while applying a voltage between the portion to be plated and the rotary electrode, performing control of switching an anode and a cathode between the portion to be plated and the rotary electrode at least once or more times during plating treatment.

Assignees

• Mitsubishi Electric Corp

Inventors

• Takemoto Yohei
• Akami Yutaka

Classifications

• C25D17/005 Primary

  Contacting devices · CPC title

• C25D5/04 Primary

  Electroplating with moving electrodes · CPC title

• C25D5/08

  Electroplating with moving electrolyte e.g. jet electroplating {(using locally applied jets of electrolyte C25D5/026)} · CPC title

• C25D5/02

  Electroplating of selected surface areas · CPC title

• C25D21/10

  Agitating of electrolytes; Moving of racks · CPC title