Resistance soldering method and soldering device

Patent metadata

Field	Value
Publication number	US-2020331084-A1
Application number	US-202016851068-A
Country	US
Kind code	A1
Filing date	Apr 16, 2020
Priority date	Apr 17, 2019
Publication date	Oct 22, 2020
Grant date	—

Abstract

The present disclosure describes a resistance soldering method for producing a plate assembly including at least two basic elements that are materially bonded together via a soldering device, e.g., for producing a winding of an electrical machine. The method includes applying an output voltage to a first electrode and a second electrode, between which the at least two basic elements are arranged, to solder a solder element interposed therebetween; detecting a correct or incorrect position of the solder element in the plate assembly via a control unit; determining via the control unit a voltage between the solder element and one or more points on the electric circuit. The control unit detects the correct or incorrect position of the solder element through an evaluation and/or a comparison with reference to the voltage or voltages.

First claim

1 . A resistance soldering method for producing a plate assembly comprised of at least two basic elements that are materially bonded via a soldering device, comprising:
providing a first basic element and a second basic element spaced apart and, with respect to a mounting direction, arranged one above the other between a first electrode and a second electrode of the soldering device; arranging a solder element between and in contact with the first basic element and the second basic element; applying an output voltage to the first electrode and the second electrode to provide an electric circuit and solder the first basic element and the second basic element together via the solder element; detecting a correct or incorrect position of the solder element in the plate assembly via a control unit; determining via the control unit, upon the detection of the correct or incorrect position of the solder element in the plate assembly, a voltage between the solder element and one point on the electric circuit, or voltages between the solder element and mutually divergent points on the electric circuit, and wherein the control unit detects the correct or incorrect position of the solder element with reference to the voltage or voltages determined through at least one of an evaluation and a comparison.

2 . The resistance soldering method as claimed in claim 1 , wherein the control unit compares the determined voltage with a saved comparative value or the determined voltages with saved comparative values, and detects the correct or incorrect position of the solder element in the plate assembly.

3 . The resistance soldering method as claimed in claim 2 , wherein in the detection of the correct or incorrect position of the solder element in the plate assembly, the control unit determines at least one of (i) a first voltage that is constituted between the first electrode or the first basic element and the solder element, and (ii) a second voltage that is constituted between the second electrode or the second basic element and the solder element.

4 . The resistance soldering method as claimed in claim 3 , wherein at least one of:
in the event of the correct positioning of the solder element in the plate assembly, the first voltage is dependent upon a first electrical resistance, that is composed of at least one of the electrical resistance of the first electrode, the electrical resistance of the first basic element, the contact resistance between the first electrode and the first basic element, and of the electrical resistance of the solder element, and in the event of the correct positioning of the solder element in the plate assembly, the second voltage is dependent upon a second electrical resistance, that is composed of at least one of the electrical resistance of the second electrode, the electrical resistance of the second basic element, the contact resistance between the second electrode and the second basic element, and the electrical resistance of the solder element.

5 . The resistance soldering method as claimed in claim 1 , wherein:
upon the detection of the correct or incorrect position of the solder element in the plate assembly, the control unit determines the output voltage, a first voltage constituted between the first electrode or the first basic element and the solder element, and a second voltage constituted between the second electrode or the second basic element and the solder element; and the control unit, in accordance with the output voltage, the first voltage and the second voltage, detects the correct or incorrect position of the solder element in the plate assembly.

6 . The resistance soldering method as claimed in claim 5 , wherein:
the control unit calculates a first ratio between the first voltage and the output voltage, and a second ratio between the second voltage and the output voltage; and the control unit, by at least one of an evaluation and a comparison of the first ratio and the second ratio, detects the correct or incorrect position of the solder element in the plate assembly.

7 . The resistance soldering method as claimed in claim 5 , wherein:
in the event of the correct positioning of the solder element in the plate assembly, the first voltage is dependent upon a first electrical resistance that is composed of at least one of the electrical resistance of the first electrode, the electrical resistance of the first basic element, the contact resistance between the first electrode and the first basic element, and the electrical resistance of the solder element, and in the event of the correct positioning of the solder element in the plate assembly, the second voltage is dependent upon a second electrical resistance that is composed of at least one of the electrical resistance of the second electrode, the electrical resistance of the second basic element, the contact resistance between the second electrode and the second basic element, the electrical resistance of the solder element.

8 . The resistance soldering method as claimed in claim 1 , wherein:
the control unit, via an output voltage measuring device, continuously measures an output voltage signal during the resistance soldering process; and the control unit, from the output voltage signal, executes a read-off of the output voltage that correlates to a specified time point.

9 . The resistance soldering method as claimed in claim 8 , wherein the control unit integrates the output voltage signal prior to the read-off of the output voltage via an integrator.

10 . The resistance soldering method as claimed in claim 3 , wherein:
the control unit, via a first voltage measuring device, records a first voltage signal throughout the resistance soldering process with no interruption; and the control unit, from the first voltage signal, executes a read-off of the first voltage that correlates to a specified time point.

11 . The resistance soldering method as claimed in claim 10 , wherein the control unit, via an integrator, integrates the first voltage signal prior to the read-off of the first voltage.

12 . The resistance soldering method as claimed in claim 3 , wherein:
the control unit, via a second voltage measuring device, records a second voltage signal throughout the resistance soldering process with no interruption; and the control unit, from the second voltage signal, executes a read-off of the second voltage that correlates to a specified time point.

13 . The resistance soldering method as claimed in claim 12 , wherein the control unit, via an integrator, integrates the second voltage signal prior to the read-off of the second voltage.

14 . The resistance soldering method as claimed in claim 3 , wherein the control unit determines the output voltage, the first voltage and the second voltage at the same specified time point.

15 . The resistance soldering method as claimed in claim 1 , wherein at least one of:
at least one of the first basic element is a first electrical conductor and the second basic element is a second electrical conductor, and at least one of the first basic element and the second basic element are a plurality of electrical conductors that are soldered together by the resistance soldering method.

16 . A soldering device for the resistance soldering of two basic elements to constitute a plate assembly, comprising:
a first electrode and a second electrode, between which the two basic elements are compressed in a mounting direction, with a solder element interposed therebetween that is resistance soldered by the application of an output voltage, a control unit for de

Assignees

• Tavcar Matevz
• Mahle Int Gmbh

Inventors

• Tavcar Matevz

Classifications

• B23K1/0004 Primary

  Resistance soldering · CPC title

• B23K3/08

  Auxiliary devices therefor · CPC title