Curable adhesive composition as well as adhesive tapes and products produced therefrom

Patent metadata

Field	Value
Publication number	US-2020299553-A1
Application number	US-201516061614-A
Country	US
Kind code	A1
Filing date	Dec 18, 2015
Priority date	Dec 18, 2015
Publication date	Sep 24, 2020
Grant date	—

Abstract

UV curable adhesive compositions are provided that include 1) a UV curable poly(meth)acrylate copolymer containing monomeric units having an epoxy group wherein the poly(meth)acrylate copolymer has a glass transition temperature between −30° C. and −10° C., 2) a silsesquioxane polymer having epoxy-containing groups, and 3) a photocatalyst. UV cured adhesive compositions and adhesive tapes containing the cured adhesive compositions are also provided. The cured adhesive compositions are pressure sensitive adhesives.

First claim

1 . A curable adhesive composition comprising:
(1) a UV curable poly(meth)acrylate copolymer comprising a monomeric unit having a first epoxy-containing group, wherein the poly(meth)acrylate copolymer has a glass transition temperature between −30° C. and −10° C.; (2) a silsesquioxane polymer comprising a second epoxy-containing group, the silsesquioxane polymer comprising at least one three-dimensional branched network having at least three repeating units of the following formula (I)

wherein
R 1 is the second epoxy-containing group; and
* stands an attachment site to another group within the silsequioxane polymer; and
(3) a cationic photocatalyst.

2 . The curable adhesive composition of claim 1 , characterized in that, the first epoxy-containing group or the second epoxy-containing group have structures of the following formula (II) or formula (III):

wherein, R 2 is an alkylene group or a heteroalkylene group having at least one oxygen heteroatom.

3 . The curable adhesive composition of claim 1 , characterized in that, the silsesquioxane polymer comprising the second epoxy-containing group has the following formula (IV):

wherein,
Z is hydrogen or a group having a structure of —Si(R 3 ) (3−x) (R 4 ) x ;
R 3 is alkyl;
R 4 is hydroxy, or an oxygen-containing group linking group Z to second silicon atom in the silsesquioxane polymer;
x is an integer with a value of 0, 1, or 2;
and m is an integer greater than or equal to 3.

4 . The curable adhesive composition of claim 1 , characterized in that, the content of the monomeric unit having the first epoxy-containing group is greater than 0.1 and less than or equal to 1 wt. %, calculated based on the total weight of the poly(meth)acrylate copolymer as 100 wt. %.

5 . The curable adhesive composition of claim 1 , characterized in that, the poly(meth)acrylate copolymer has a glass transition temperature between −25° C. and −10° C.

6 . The curable adhesive composition of claim 1 , characterized in that, the poly(meth)acrylate copolymer has a weight average molecular weight between 300,000 and 450,000 Da.

7 . The curable adhesive composition of claim 1 , characterized in that, the silsesquioxane polymer has a content from 5 to 25 wt. %, calculated based on the total weight of the poly(meth)acrylate copolymer as 100 wt. %.

8 . The curable adhesive composition of claim 1 , characterized in that, the silsesquioxane polymer has a content from 5 to 15 wt. %, calculated based on the total weight of the poly(meth)acrylate copolymer as 100 wt. %.

9 . The curable adhesive composition of claim 1 , characterized in that, the silsesquioxane polymer has a weight average molecular weight from 1,000 to 50,000 Da and a glass transition temperature greater than −40° C. and less than or equal to 10° C.

10 . The curable adhesive composition of claim 1 , characterized in that, the cationic photocatalyst has a content from 1 to 3 wt. %, calculated based on the total weight of the poly(meth)acrylate copolymer as 100 wt. %.

11 . A cured adhesive composition comprising a reaction product obtained by exposing a curable composition of claim 1 to ultraviolet and/or visible radiation.

12 . An article comprising a substrate and the curable adhesive composition on at least one surface of the substrate, wherein the curable adhesive composition is according to claim 1 .

13 . An article comprising a substrate and the cured adhesive composition on at least one surface of the substrate, wherein the cured adhesive composition is according to claim 11 .

14 . A curable adhesive composition, including:
a UV curable poly(meth)acrylate copolymer comprising a monomeric unit having a first epoxy-containing group, wherein the content of the monomeric unit having the first epoxy-containing group is greater than 0.1 wt. % and less than or equal to 1 wt. %, calculated based on the total weight of the poly(meth)acrylate copolymer as 100 wt. %, and the poly(meth)acrylate copolymer has a glass transition temperature between −30° C. and −10° C.; a silsesquioxane polymer containing comprising a second epoxy-containing group, wherein the silsesquioxane polymer has a content from 0.5 to 32 wt. %, calculated based on the total weight of the poly(meth)acrylate copolymer as 100 wt. %; and a cationic photocatalyst, wherein the cationic photocatalyst has a content not exceeding 3 wt. %, calculated based on the total weight of the poly(meth)acrylate copolymer as 100 wt. %.

15 . A cured adhesive composition comprising a reaction product obtained by placing a curable adhesive composition under UV and/or visible radiation, wherein the curable adhesive composition is the curable adhesive composition is of claim 14 .

Assignees

• 3M Innovative Properties Co

Inventors

• Cui Wei
• Liu Hongbo
• Lin Weigang
• Yin Long
• Wu Qing
• Jin Zhou

Classifications

• C09J183/06

  containing silicon bound to oxygen-containing groups (C09J183/12 takes precedence) · CPC title

• C08K5/1515

  Three-membered rings · CPC title

• C09J133/068 Primary

  containing glycidyl groups · CPC title

• C09J183/10

  Block or graft copolymers containing polysiloxane sequences (obtained by polymerising a compound having a carbon-to-carbon double bond on to a polysiloxane C09J151/08, C09J153/00) · CPC title

• C08G77/42

  Block-or graft-polymers containing polysiloxane sequences (polymerising aliphatic unsaturated monomers on to a polysiloxane C08F283/12) · CPC title