Masking pressure-sensitive adhesive tape

Patent metadata

Field	Value
Publication number	US-2016355703-A1
Application number	US-201615147044-A
Country	US
Kind code	A1
Filing date	May 5, 2016
Priority date	Jun 3, 2015
Publication date	Dec 8, 2016
Grant date	—

Abstract

Provided is a masking pressure-sensitive adhesive tape to be used in formation of a metal layer by a vacuum film formation method on part of a surface of an electronic part, which may prevent formation of a metal layer, by the vacuum film formation method, on a surface masked by the masking pressure-sensitive adhesive tape. The masking pressure-sensitive adhesive tape includes: a base material; and a pressure-sensitive adhesive layer arranged on one side of the base material, in which the pressure-sensitive adhesive layer has a thickness of 5 μm or more, and the masking pressure-sensitive adhesive tape has a 180° peeling adhesive strength at 23° C. with respect to a stainless-steel plate of 0.4 N/20 mm or more.

First claim

What is claimed is:

1 . A masking pressure-sensitive adhesive tape to be used in formation of a metal layer by a vacuum film formation method on part of a surface of an electronic part,
the masking pressure-sensitive adhesive tape comprising: a base material; and a pressure-sensitive adhesive layer arranged on one side of the base material, wherein the pressure-sensitive adhesive layer has a thickness of 5 μm or more, and wherein the masking pressure-sensitive adhesive tape has a 180° peeling adhesive strength at 23° C. with respect to a stainless-steel plate of 0.4 N/20 mm or more.

2 . The masking pressure-sensitive adhesive tape according to claim 1 , wherein the electronic part has an uneven surface, and the masking pressure-sensitive adhesive tape is used by being bonded onto the uneven surface.

3 . The masking pressure-sensitive adhesive tape according to claim 1 , wherein the masking pressure-sensitive adhesive tape has a 180° peeling adhesive strength at 23° C. with respect to a stainless-steel plate of 10 N/20 mm or less after the masking pressure-sensitive adhesive tape is bonded onto the stainless-steel plate and left to stand at 200° C. for 1 hour.

4 . A method of producing an electronic part, comprising using the masking pressure-sensitive adhesive tape of claim 1 .

Assignees

• Nitto Denko Corp

Inventors

• Okawa Yuji

Classifications

• C09J7/38

  Pressure-sensitive adhesives [PSA] · CPC title

• C09J133/02

  Homopolymers or copolymers of acids; Metal or ammonium salts thereof · CPC title

• C09J2203/326

  for bonding electronic components such as wafers, chips or semiconductors · CPC title

• C08L2205/025

  containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure · CPC title

• C09J2433/00

  Presence of (meth)acrylic polymer · CPC title