Plating method and plating apparatus

Patent metadata

Field	Value
Publication number	US-2020232115-A1
Application number	US-202016842423-A
Country	US
Kind code	A1
Filing date	Apr 7, 2020
Priority date	Mar 14, 2017
Publication date	Jul 23, 2020
Grant date	—

Abstract

A plating method capable of saving a substrate in an event of a failure of a transporter, a plating tank, or other component when the substrate is being plated is disclosed. The plating method includes: transporting a plurality of substrates to a plurality of plating tanks, respectively, with a transporter; immersing the plurality of substrates in a plating solution held in the plurality of plating tanks to plate the plurality of substrates; detecting a failure that has occurred in the transporter or a post-processing tank; and replacing the plating solution in the plurality of plating tanks with a preservative liquid to thereby immerse the plurality of substrates in the preservative liquid.

First claim

What is claimed is:

1 . A plating method comprising:
transporting a plurality of substrates to a plurality of plating tanks, respectively, with a transporter; immersing the plurality of substrates in a plating solution held in the plurality of plating tanks to plate the plurality of substrates; detecting a failure that has occurred in any one of the plurality of plating tanks while the plurality of substrates are being plated; and replacing the plating solution in the plating tank, in which the failure has occurred, with a preservative liquid to thereby immerse a substrate in the preservative liquid.

2 . The plating method according to claim 1 , wherein replacing the plating solution comprises replacing the plating solution in the plating tank, in which the failure has occurred, with a preservative liquid to thereby immerse a substrate in the preservative liquid, while continuing plating substrates in other plating tanks.

3 . The plating method according to claim 1 , wherein the plating tank comprise a plating cell and an overflow tank, and
the plating method further comprises, after replacing the plating solution with the preservative liquid, causing the preservative liquid to overflow the plating cell into the overflow tank.

4 . The plating method according to claim 1 , further comprising:
delivering the plating solution in the plating tank to a plating-solution reservoir.

5 . The plating method according to claim 4 , further comprising:
draining the preservative liquid from the plating tank; and supplying the plating solution from the plating-solution reservoir to the plating tank.

6 . The plating method according to claim 1 , wherein the preservative liquid comprises pure water or deaerated pure water.

7 . The plating method according to claim 1 , wherein replacing the plating solution in the plating tank with the preservative liquid comprises:
discharging the plating solution from the plating tank in which the failure has occurred; and filling the plating tank with a preservative liquid to thereby immerse a substrate in the preservative liquid.

Assignees

• Ebara Corp

Inventors

• Koizumi Ryuya
• Shimoyama Masashi
• Nagai Mizuki

Classifications

• H10P72/0476

  comprising at least one plating chamber · CPC title

• H10P72/0456

  in-line arrangement · CPC title

• C25D17/02

  Tanks; Installations therefor · CPC title

• C23C18/1632

  Features specific for the apparatus, e.g. layout of cells and of its equipment, multiple cells · CPC title

• C25D3/38

  of copper · CPC title