Processing apparatus

US2020227293A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2020227293-A1
Application numberUS-202016737512-A
CountryUS
Kind codeA1
Filing dateJan 8, 2020
Priority dateJan 10, 2019
Publication dateJul 16, 2020
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A processing apparatus includes: a plurality of process modules concatenated with one another; and a loader module configured to receive a carrier accommodating a plurality of substrates to be processed by the plurality of process modules, wherein each of the plurality of process modules includes: a heat treatment unit including a processing container configured to accommodate the plurality of substrates and perform a heat treatment on the plurality of substrates; and a gas supply unit disposed on one side surface of the heat treatment unit and configured to supply a gas into the processing container.

First claim

Opening claim text (preview).

What is claimed is: 1 . A processing apparatus comprising: a plurality of process modules concatenated with one another; and a loader module configured to receive a carrier accommodating a plurality of substrates to be processed by the plurality of process modules, wherein each of the plurality of process modules comprises: a heat treatment unit including a processing container configured to accommodate the plurality of substrates and perform a heat treatment on the plurality of substrates; and a gas supply unit disposed on one side surface of the heat treatment unit and configured to supply a gas into the processing container. 2 . The processing apparatus of claim 1 , wherein the gas supply unit is spaced apart from a floor. 3 . The processing apparatus of claim 2 , wherein the heat treatment unit includes a gas introduction port disposed at a side of the gas supply unit and configured to introduce the gas into the processing container. 4 . The processing apparatus of claim 3 , wherein each of the plurality of process modules includes an exhaust duct facing the gas supply unit with the heat treatment unit interposed between the gas supply unit and the exhaust duct, and including an exhaust pipe configured to exhaust the gas in the processing container 5 . The processing apparatus of claim 4 , wherein the heat treatment unit includes an exhaust port disposed at a side of the exhaust duct and configured to exhaust the gas in the processing container. 6 . The processing apparatus of claim 5 , wherein each of the plurality of process modules includes a load unit disposed below the heat treatment unit, and configured to accommodate a substrate holder with which the plurality of substrates is delivered between the heat treatment unit and the load unit. 7 . The processing apparatus of claim 6 further comprising a substrate transfer module that includes a substrate transfer mechanism configured to deliver the plurality of substrates between the loader module and the load unit provided in each of the plurality of process modules. 8 . The processing apparatus of claim 7 , wherein the gas supply unit overlaps with the substrate transfer module in a plan view. 9 . The processing apparatus of claim 1 , wherein the heat treatment unit includes a gas introduction port disposed at a side of the gas supply unit and configured to introduce the gas into the processing container. 10 . The processing apparatus of claim 1 , wherein each of the plurality of process modules includes an exhaust duct facing the gas supply unit with the heat treatment unit interposed between the gas supply unit and the exhaust duct, and including an exhaust pipe configured to exhaust the gas in the processing container. 11 . The processing apparatus of claim 1 , wherein each of the plurality of process modules includes a load unit disposed below the heat treatment unit, and configured to accommodate a substrate holder with which the plurality of substrates is delivered between the heat treatment unit and the load unit.

Assignees

Inventors

Classifications

  • Vertical transfer of a batch of workpieces · CPC title

  • Apparatus for thermal treatment · CPC title

  • Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence) · CPC title

  • in-line arrangement · CPC title

  • characterised by the layout of the process chambers · CPC title

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Frequently asked questions

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What does patent US2020227293A1 cover?
A processing apparatus includes: a plurality of process modules concatenated with one another; and a loader module configured to receive a carrier accommodating a plurality of substrates to be processed by the plurality of process modules, wherein each of the plurality of process modules includes: a heat treatment unit including a processing container configured to accommodate the plurality of …
Who is the assignee on this patent?
Tokyo Electron Ltd
What technology area does this patent fall under?
Primary CPC classification H10P72/0456. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Jul 16 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).