Substrate processing apparatus and control method for a substrate processing apparatus
US-2024120204-A1 · Apr 11, 2024 · US
US2020227293A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2020227293-A1 |
| Application number | US-202016737512-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jan 8, 2020 |
| Priority date | Jan 10, 2019 |
| Publication date | Jul 16, 2020 |
| Grant date | — |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A processing apparatus includes: a plurality of process modules concatenated with one another; and a loader module configured to receive a carrier accommodating a plurality of substrates to be processed by the plurality of process modules, wherein each of the plurality of process modules includes: a heat treatment unit including a processing container configured to accommodate the plurality of substrates and perform a heat treatment on the plurality of substrates; and a gas supply unit disposed on one side surface of the heat treatment unit and configured to supply a gas into the processing container.
Opening claim text (preview).
What is claimed is: 1 . A processing apparatus comprising: a plurality of process modules concatenated with one another; and a loader module configured to receive a carrier accommodating a plurality of substrates to be processed by the plurality of process modules, wherein each of the plurality of process modules comprises: a heat treatment unit including a processing container configured to accommodate the plurality of substrates and perform a heat treatment on the plurality of substrates; and a gas supply unit disposed on one side surface of the heat treatment unit and configured to supply a gas into the processing container. 2 . The processing apparatus of claim 1 , wherein the gas supply unit is spaced apart from a floor. 3 . The processing apparatus of claim 2 , wherein the heat treatment unit includes a gas introduction port disposed at a side of the gas supply unit and configured to introduce the gas into the processing container. 4 . The processing apparatus of claim 3 , wherein each of the plurality of process modules includes an exhaust duct facing the gas supply unit with the heat treatment unit interposed between the gas supply unit and the exhaust duct, and including an exhaust pipe configured to exhaust the gas in the processing container 5 . The processing apparatus of claim 4 , wherein the heat treatment unit includes an exhaust port disposed at a side of the exhaust duct and configured to exhaust the gas in the processing container. 6 . The processing apparatus of claim 5 , wherein each of the plurality of process modules includes a load unit disposed below the heat treatment unit, and configured to accommodate a substrate holder with which the plurality of substrates is delivered between the heat treatment unit and the load unit. 7 . The processing apparatus of claim 6 further comprising a substrate transfer module that includes a substrate transfer mechanism configured to deliver the plurality of substrates between the loader module and the load unit provided in each of the plurality of process modules. 8 . The processing apparatus of claim 7 , wherein the gas supply unit overlaps with the substrate transfer module in a plan view. 9 . The processing apparatus of claim 1 , wherein the heat treatment unit includes a gas introduction port disposed at a side of the gas supply unit and configured to introduce the gas into the processing container. 10 . The processing apparatus of claim 1 , wherein each of the plurality of process modules includes an exhaust duct facing the gas supply unit with the heat treatment unit interposed between the gas supply unit and the exhaust duct, and including an exhaust pipe configured to exhaust the gas in the processing container. 11 . The processing apparatus of claim 1 , wherein each of the plurality of process modules includes a load unit disposed below the heat treatment unit, and configured to accommodate a substrate holder with which the plurality of substrates is delivered between the heat treatment unit and the load unit.
Vertical transfer of a batch of workpieces · CPC title
Apparatus for thermal treatment · CPC title
Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence) · CPC title
in-line arrangement · CPC title
characterised by the layout of the process chambers · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.