Semiconductor chip including digital logic circuit including at least six transistors with some transistors forming cross-coupled transistor configuration and associated methods
US-9213792-B2 · Dec 15, 2015 · US
US2020119048A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2020119048-A1 |
| Application number | US-201916712356-A |
| Country | US |
| Kind code | A1 |
| Filing date | Dec 12, 2019 |
| Priority date | Nov 14, 2017 |
| Publication date | Apr 16, 2020 |
| Grant date | — |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A semiconductor device includes a plurality of standard cells. The plurality of standard cells include a first group of standard cells arranged in a first row extending in a row direction and a second group of standard cells arranged in a second row extending in the row direction. The first group of standard cells and the second group of standard cells are arranged in a column direction. A cell height of the first group of standard cells in the column direction is different from a cell height of the second group of standard cells in the column direction.
Opening claim text (preview).
What is claimed is: 1 . A semiconductor device including a plurality of standard cells, wherein: the plurality of standard cells include a first group of standard cells arranged in a first row extending in a row direction and a second group of standard cells arranged in a second row extending in the row direction, and a third standard cell, the first group of standard cells and the second group of standard cells are arranged in a column direction, a cell height of the first group of standard cells in the column direction is different from a cell height of the second group of standard cells, and the third standard cell is disposed over the first row and the second row. 2 . The semiconductor device of claim 1 , wherein: each of the plurality of standard cells includes a first power supply wiring for supplying a first potential and a second power supply wiring for supplying a second potential different from the first potential, and a cell height of each of the plurality of standard cells is a distance in the column direction between a center line, extending in the row direction, of the first power supply wiring and a center line, extending in the row direction, of the second power supply wiring. 3 . The semiconductor device of claim 2 , wherein a ratio of the cell height of the first group of standard cells and the cell height of the second group of standard cells is N:M, where N and M are different natural numbers. 4 . The semiconductor device of claim 2 , wherein one of the first power supply wiring and the second power supply wiring of the first group of standard cells is shared by the second group of standard cells. 5 . The semiconductor device of claim 4 , wherein each of the plurality of standard cells includes active fin structures extending in the row direction, forming one or more fin field effect transistors (FinFETs). 6 . The semiconductor device of claim 5 , wherein in the first group of standard cells, the active fin structures are aligned with either one of only I virtual lines extending in the row direction, respectively, where I is a natural number of two or more. 7 . The semiconductor device of claim 6 , wherein in the second group of standard cells, the active fin structures are aligned with either one of only J virtual lines extending in the row direction, respectively, where J is a natural number of two or more and different from I. 8 . The semiconductor device of claim 7 , wherein either of I or J is two. 9 . The semiconductor device of claim 5 , wherein each of the plurality of standard cells further includes one or more dummy fin structures extending in the row direction, not functioning as a FinFET. 10 . The semiconductor device of claim 9 , wherein: one of the one or more dummy fin structures is located between two of the active fin structures, and the one of the one or more dummy fin structures and the two of the active fin structures are arranged with a constant pitch in the column direction. 11 . The semiconductor device of claim 5 , wherein: each of the plurality of standard cells further includes dummy fin structures extending in the row direction, not functioning as a FinFET, and one of the dummy fin structures is located under the first power supply wiring, and one of the dummy fin structures is located under the second power supply wiring. 12 . The semiconductor device of claim 11 , wherein at least one of a height and a width of the dummy fin structures is different from that of the active fin structures. 13 . The semiconductor device of claim 4 , wherein: each of the plurality of standard cells has a p-type device region and an n-type device region, and the first group of standard cells and the second group of standard cells are arranged in the column direction such that the p-type region of the first group of standard cells and the p-type region of the second group of standard cells are located between the n-type region of the first group of standard cells and the n-type region of the second group of standard cells. 14 . The semiconductor device of claim 13 , wherein: each of the plurality of standard cells includes active fin structures extending in the row direction, and forming one or more fin field effect transistors (FinFETs), and in the first group of standard cells, a number of the active fin structures included in the p-type region is different from a number of the active fin structures included in the n-type region. 15 . The semiconductor device of claim 14 , wherein in the second group of standard cells, a number of the active fin structures included in the p-type region is equal to a number of the active fin structures included in the n-type region. 16 . The semiconductor device of claim 4 , wherein each of the plurality of standard cells includes metal wirings extending in the row direction, and located at a level closer to a substrate than a level at which the first and second power supply wirings are located. 17 . The semiconductor device of claim 16 , wherein in the first group of standard cells, the metal wirings are aligned with either one of only K virtual lines extending in the row direction, respectively, where K is a natural number of two or more. 18 . The semiconductor device of claim 17 , wherein in the second group of standard cells, the metal wirings are aligned with either one of only L virtual lines extending in the row direction, respectively, where L is a natural number of two or more and different from K. 19 . A semiconductor device including a plurality of standard cells, wherein: the plurality of standard cells include a first group of standard cells arranged in a first row extending in a row direction, a second group of standard cells arranged in a second row extending in the row direction, a third group of standard cells arranged in a third row extending in the row direction, a fourth standard cell and a fifth standard cell, the first group of standard cells, the second group of standard cells and the third group of standard cells are arranged in a column direction, a cell height of the first group of standard cells in the column direction is different from a cell height of the second group of standard cells, the third standard cell is disposed over the first row and the second row, and the fourth standard cell is disposed over the second row and the third row. 20 . A semiconductor device including a plurality of standard cells, wherein: the plurality of standard cells include a first group of standard cells arranged in a first row extending in a row direction, a second group of standard cells arranged in a second row extending in the row direction, and a third group of standard cells arranged in a third row extending in the row direction, the first group of standard cells, the second group of standard cells and the third group of standard cells are arranged in a column direction, and a cell height of the first group of standard cells in the column direction, a cell height of the second group of standard cells in the column direction and a cell height of the third group of standard cells in the column direction are different from each other.
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Related publications grouped by family.
Answers are generated from the same data shown on this page.