Apparatus for cooling electronic circuitry

Patent metadata

Field	Value
Publication number	US-2020008317-A1
Application number	US-201916534398-A
Country	US
Kind code	A1
Filing date	Aug 7, 2019
Priority date	May 23, 2017
Publication date	Jan 2, 2020
Grant date	—

Abstract

An apparatus cools electronic circuitry. An enclosure surrounds the electronic circuitry and has plural surfaces. Air intake holes are disposed in at least one surface and face at least one first direction. Air exhaust holes are disposed in at least another surface and face at least one second direction different than the first direction. A heat sink is in thermal contact with the circuitry and conducts heat generated by the circuitry. When a fan operates, air is drawn from an exterior of the enclosure through the air intake holes, absorbs heat from the heat sink, and then is directed through the air exhaust holes into the exterior of the enclosure. The heat sink is further in thermal contact with the enclosure so that when the fan does not operate, heat is drawn from the circuitry to the enclosure via the heat sink and is dissipated from the exterior.

First claim

What is claimed is:

1 . An apparatus for cooling electronic circuitry, the apparatus comprising:
an enclosure configured to surround the electronic circuitry, the enclosure having a plurality of surfaces, wherein
a plurality of air intake holes are disposed in at least one of the plurality of surfaces and face at least one first direction, and
a plurality of air exhaust holes are disposed in at least another one of the plurality of surfaces and face at least one second direction that is a different direction than the first direction;
a heat sink configured to be in thermal contact with the electronic circuitry and conduct heat generated by the electronic circuitry; and a fan arranged such that when the fan operates, air is drawn from an exterior of the enclosure through the plurality of air intake holes, absorbs heat from the heat sink, and then is directed through the plurality of air exhaust holes into the exterior of the enclosure; the heat sink being further configured to be in thermal contact with the enclosure so that when the fan does not operate, heat is drawn from the circuitry to the enclosure via the heat sink and is dissipated from the exterior of the enclosure.

2 . The apparatus of claim 1 , wherein the enclosure further comprises
a first portion configured to support a circuit board having the electronic circuitry and having a first surface.

3 . The apparatus of claim 2 , wherein the enclosure further comprises
a second portion having a second surface disposed opposite the first surface, and a plurality of side surfaces disposed between the first surface and the second surface, wherein
the plurality of air intake holes are disposed in at least the second surface, and
the plurality of air exhaust holes are disposed in at least one of the plurality of side surfaces.

4 . The apparatus of claim 1 , further comprising
an air plenum piece that includes a substantially planar portion that is disposed between the first and second surfaces,
the substantially planar portion being configured to divide an interior region of the enclosure into a first volume into which the air intake holes open and a second volume into which the air exhaust holes open, and having an air plenum hole that forms an opening between the first volume and the second volume.

5 . The apparatus of claim 4 , wherein
the fan is disposed atop the heat sink and in coaxial alignment with the air plenum hole such that when the fan operates, cooling air is drawn from an exterior of the enclosure through the plurality of air intake holes into the first volume, then from the first volume into the second volume, and thereafter from the second volume through the plurality of air exhaust holes into the exterior of the enclosure in a direction other than from a direction from which the cooling air is drawn, the movement of the cooling air in the second volume drawing heat away from the heat sink.

6 . The apparatus of claim 4 , wherein the heat sink comprises
a lower portion that is disposed in the second volume, the lower portion having a bottom surface that is in thermal contact with the circuitry.

7 . The apparatus of claim 6 , wherein the heat sink comprises
at least one vertical portion that extends at one end from the lower portion of the heat sink, and then alongside part of an edge of the substantially planar portion of the air plenum piece, and at least one upper portion disposed at another end of the at least one vertical portion, the at least one upper portion being in thermal contact with the enclosure so that when the fan does not operate, heat is drawn from the circuitry to the enclosure via the heat sink and is dissipated into the exterior of the enclosure.

8 . The apparatus of claim 7 , wherein the substantially planar portion of the air plenum piece further comprises
a region having a smaller width than at least another region of the substantially planar portion, the at least one vertical portion of the heat sink extends alongside the region having the smaller width.

9 . The apparatus of claim 6 , wherein the heat sink comprises
a first vertical portion that extends at one end from an edge of the lower portion of the heat sink, and then alongside part of an edge of the substantially planar portion of the air plenum piece, a first upper portion disposed at another end of the first vertical portion, a second vertical portion that extends at one end from an opposing edge of the lower portion of the heat sink, and then alongside part of an opposing edge of the substantially planar portion of the air plenum piece, and a second upper portion disposed at another end of the second vertical portion, the first upper portion and the second upper portion are each in thermal contact with the enclosure so that when the fan does not operate, heat is drawn from the circuitry to the enclosure via the heat sink and is dissipated into the exterior of the enclosure.

10 . The apparatus of claim 9 , wherein the substantially planar portion of the air plenum piece further comprises
a region having a smaller width than at least another region of the substantially planar portion, the first vertical portion of the heat sink extends alongside an edge of the region having the smaller width the second vertical portion of the heat sink extends alongside an opposing edge of the region having the smaller width.

11 . An apparatus for cooling electronic circuitry, the apparatus comprising:
an enclosure configured to surround the electronic circuitry, the enclosure having a plurality of surfaces, wherein
a plurality of air intake holes are disposed in at least one of the plurality of surfaces, and
a plurality of air exhaust holes are disposed in at least another one of the plurality of surfaces;
an air plenum piece disposed within the enclosure and configured to divide an interior region of the enclosure into a first volume into which the air intake holes open and a second volume into which the air exhaust holes open,
the air plenum piece having an air plenum hole that forms an opening between the first volume and the second volume;
a fan located in coaxial alignment with the air plenum hole such that when the fan operates, air is drawn from an exterior of the enclosure through the plurality of air intake holes into the first volume, then through the air plenum hole into the second volume, and thereafter from the second volume through the plurality of air exhaust holes into the exterior of the enclosure; and a heat sink configured to be in thermal contact with both the electronic circuitry and with the enclosure so that when the fan does not operate, heat is drawn from the circuitry to the enclosure via the heat sink and is dissipated from the exterior of the enclosure.

12 . The apparatus of claim 11 , wherein the enclosure further comprises
a first portion configured to support a circuit board having the electronic circuitry and having a first surface, a second portion having a second surface disposed opposite the first surface, and a plurality of side surfaces disposed between the first surface and the second surface, wherein
the plurality of air intake holes are disposed in at least the second surface, and
the plurality of air exhaust holes are disposed in at least one of the plurality of side surfaces.

13 . The apparatus of claim 12 , wherein
the plurality of air intake holes are disposed in the second surface and at least another one of the plurality of side surfaces, and the plurality of air exhaust holes are disposed in an opposing two of the plurality of side surfaces.

14 . The apparatus of

Assignees

• Crestron Electronics Inc

Inventors

• Pedoeem Albert
• Replogle Kriss
• Upasani Sanjay
• Florczak Don

Classifications

• H05K7/20563

  within sub-racks for removing heat from electronic boards · CPC title

• H05K7/20545

  Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards · CPC title

• H05K7/20445 Primary

  the coupling element being an additional piece, e.g. thermal standoff · CPC title

• H05K7/20145

  Means for directing air flow, e.g. ducts, deflectors, plenum or guides · CPC title

• H05K7/20154 Primary

  Heat dissipaters coupled to components · CPC title