Electronic circuit with guard features for reliability in humid environments

Patent metadata

Field	Value
Publication number	US-2019279945-A1
Application number	US-201815913621-A
Country	US
Kind code	A1
Filing date	Mar 6, 2018
Priority date	Mar 6, 2018
Publication date	Sep 12, 2019
Grant date	—

Abstract

An electronic circuit includes a substrate having functional circuitry configured to realize and carry out at least one functionality. At least one guard feature is positioned between a first feature including a metal that is coupled to a node in the electronic circuit configured for being biased at a first voltage to operate as an anode and a second feature including the metal which is coupled to a node in the circuitry circuit configured for being biased at a second voltage<the first voltage to operate as a cathode to enable dendritic growth of the metal on the cathode. The functional circuitry includes a plurality of interconnected transistors, the anode, and the cathode which are configured for implementing the functionality, wherein the guard feature does not contribute to the functionality of the circuit.

First claim

1 . A method of protecting an electronic circuit from corrosion, comprising:
providing a guard feature positioned between a first metal feature in the electronic circuit comprising a metal that is coupled to a first node in the electronic circuit which is biased at a higher voltage side of a DC bias voltage to operate as an anode which generates mobile cations and a second metal feature in the electronic circuit coupled to a second node in the electronic circuit that is biased at a lower voltage side of the DC bias voltage to operate as a cathode, wherein the electronic circuit includes functional circuitry configured for implementing at least one functionality comprising a plurality of interconnected transistors, the anode, and the cathode, wherein the guard feature does not contribute to the functionality, and applying an alternating current (AC) signal between the guard feature and the cathode, wherein the AC signal generates an electromagnetic field in a migration path of the mobile cations to prevent their migration from reaching the cathode.

2 . The method of claim 1 , wherein an amplitude of the AC signal is less than or equal to a level of the DC bias voltage.

3 . The method of claim 1 , wherein the AC signal comprises a sinusoid, triangular, or square wave waveform.

4 . The method of claim 1 , wherein a frequency of the AC signal is in a range from 10 Hz to 500 Hz.

5 . The method of claim 1 , wherein the guard feature is a trace comprising an electrically conductive material or a via filled with the electrically conductive material.

6 . The method of claim 1 , wherein the electrically conductive material comprises a copper or aluminum.

7 . The method of claim 1 , further comprising determining placement of the guard feature using a simulation of the electronic circuit or a failure analysis of the electronic circuit.

8 . The method of claim 1 , wherein the electronic circuit comprises an integrated circuit (IC) including a semiconductor substrate.

9 . The method of claim 1 , wherein the electronic circuit comprises a printed circuit board (PCB).

10 . The method of claim 1 , wherein the anode and the cathode are spaced apart by ≤100 mm.

11 . The method of claim 1 , wherein the electromagnetic field from the AC signal is sufficient to electrolyze condensed water on a surface of the electronic circuit to form OH − and H + , wherein the OH − combines with the mobile cations to form a compound that precipitates on the electronic circuit.

12 . An electronic circuit, comprising:
a substrate having functional circuitry configured to realize and carry out at least one functionality, and at least one guard feature positioned between a first feature comprising a metal that is coupled to a first node in the electronic circuit configured for being biased at a first voltage to operate as an anode and a second feature comprising the metal which is coupled to a second node in the electronic circuit configured for being biased at a second voltage<the first voltage to operate as a cathode to enable dendritic growth of the metal on the cathode, wherein the functional circuitry comprises a plurality of interconnected transistors, the anode, and the cathode configured for implementing the functionality; wherein the guard feature does not contribute to the functionality.

13 . The electronic circuit of claim 12 , wherein the guard feature is a trace comprising an electrically conductive material or a via filled with the electrically conductive material.

14 . The electronic circuit of claim 12 , wherein the electronic circuit comprises an integrated circuit (IC) including a semiconductor substrate.

15 . The electronic circuit of claim 12 , wherein the electronic circuit comprises a printed circuit board (PCB).

16 . The electronic circuit of claim 12 , wherein the metal comprises copper or aluminum.

17 . The electronic circuit of claim 12 , wherein the guard feature is on a different metal level compared to a metal level for the anode or a metal level for the cathode.

18 . The electronic circuit of claim 12 , wherein the anode and the cathode are spaced apart by ≤100 mm.

19 . The electronic circuit of claim 12 , wherein the anode and the cathode are spaced apart by ≤20 mm.

20 . The electronic circuit of claim 12 , wherein the guard feature comprises the metal.

21 . The electronic circuit of claim 12 , wherein the electronic circuit is adapted to receive an alternating current (AC) signal applied between the guard feature and the cathode to generate an electromagnetic field in a migration path of mobile cations to prevent their migration from the anode to the cathode.

22 . The electronic circuit of claim 12 , wherein the electronic circuit is adapted to receive an alternating current (AC) signal applied between the guard feature and the cathode to generate an electromagnetic field to inhibit migration of mobile cations from the anode to the cathode.

23 . The electronic circuit of claim 12 , further including circuitry for generating an alternating current (AC) signal and coupling it between the guard feature and the cathode to generate an electromagnetic field in a migration path of mobile cations to prevent their migration from the anode to the cathode.

24 . The electronic circuit of claim 12 , further including circuitry for generating an alternating current (AC) signal and coupling it between the guard feature and the cathode for generating an electromagnetic field to inhibit migration of mobile cations from the anode to the cathode.

Assignees

• Texas Instruments Inc

Inventors

• Luan Jiyuan

Classifications

• H10W42/121

  protecting against mechanical damage (H10W76/00, H10W74/00 take precedence) · CPC title

• H10W42/00 Primary

  Arrangements for protection of devices (arrangements for thermal protection H10W40/00) · CPC title

• H10W20/42

  Vias, e.g. via plugs · CPC title

• H10W20/423

  Shielding layers · CPC title

• H05K2201/0769

  Anti metal-migration, e.g. avoiding tin whisker growth · CPC title