Customized module lid

Patent metadata

Field	Value
Publication number	US-2019109058-A1
Application number	US-201816205315-A
Country	US
Kind code	A1
Filing date	Nov 30, 2018
Priority date	Nov 7, 2014
Publication date	Apr 11, 2019
Grant date	—

Abstract

A method of forming a custom module lid. The method may include placing a multichip module (MCM) between a module base and a temporary lid, target components are exposed through viewing windows in the temporary lid, a top surface of the target components is measured and mapped to create a target profile, the target profile is used to form custom pockets in a custom lid, and the custom pockets correspond to the target components.

First claim

What is claimed is:

1 . A method comprising:
placing a multichip module (MCM) on a module base, wherein the MCM includes a substrate and a target component, the target component is on a top surface of the substrate, and a bottom surface of the substrate is in direct contact with a top surface of the module base; providing a temporary lid including a viewing window, wherein the viewing window is an opening extending from a top surface of the temporary lid to a bottom surface of the temporary lid; placing the temporary lid on the MCM, wherein the target component fits inside of the viewing window, and the bottom surface of the temporary lid is on the top surface of the substrate; mapping a surface profile of the target component through the viewing window; and providing a custom lid having a custom pocket, wherein the custom pocket is an opening in the custom lid on a bottom surface of the custom lid, the custom pocket has a depth extending into the custom lid that is less than a thickness of the custom lid, and the custom pocket has an inside surface with a same profile as the target component surface profile.

2 . The method of claim 1 , wherein the target component includes an application-specific integrated circuits.

3 . The method of claim 1 , wherein the target component is measured using an optical process.

4 . The method of claim 1 , wherein the custom lid is a cold plate.

5 . The method of claim 1 , wherein the module base includes a slot and the custom lid includes a corresponding fin, and the corresponding fin fits inside of the slot.

6 . The method of claim 1 , wherein the substrate is an organic laminate.

7 . The method of claim 1 , wherein the module base and the custom lid are aluminum.

8 . A method comprising:
placing a multichip module (MCM) on a module base, wherein the MCM includes a substrate and a target component, the target component is on a top surface of the substrate, and a bottom surface of the substrate is in direct contact with a top surface of the module base; providing a temporary lid including a viewing window, wherein the viewing window is an opening extending from a top surface of the temporary lid to a bottom surface of the temporary lid; placing the temporary lid on the MCM, wherein the target component fits inside of the viewing window, and the bottom surface of the temporary lid is on the top surface of the substrate; mapping a surface profile of the target component through the viewing window; and providing a custom lid having a custom pocket, wherein the custom pocket is an opening on a bottom surface of the custom lid, and the custom pocket has an inside surface with a same profile as the target component surface profile.

9 . The method of claim 8 , wherein the target component includes an application-specific integrated circuits.

10 . The method of claim 8 , wherein the target component is measured using an optical process.

11 . The method of claim 8 , wherein the custom lid is a cold plate.

12 . The method of claim 8 , wherein the module base includes a slot and the custom lid includes a corresponding fin, and the corresponding fin fits inside of the slot.

13 . The method of claim 8 , wherein the substrate is an organic laminate.

14 . The method of claim 8 , wherein the module base and the custom lid are aluminum.

15 . A method comprising:
placing a multichip module (MCM) on a module base, wherein the MCM includes an organic substrate and a target component, the target component is on a top surface of the organic substrate, and a bottom surface of the organic substrate is in direct contact with a top surface of the module base; placing a temporary lid on the MCM, wherein the temporary lid includes an opening extending through an entire thickness of the temporary lid, wherein the target component fits inside of the opening, and a bottom surface of the temporary lid directly contacts the top surface of the organic substrate; mapping a surface profile of the target component through the opening; and providing a custom lid having a custom pocket, wherein the custom pocket in a bottom surface of the custom lid, and the custom pocket has an inside surface with a same profile as the target component surface profile.

16 . The method of claim 15 , wherein the target component includes an application-specific integrated circuits.

17 . The method of claim 15 , wherein the target component is measured using an optical process.

18 . The method of claim 15 , wherein the custom lid is a cold plate.

19 . The method of claim 15 , wherein the module base includes a slot and the custom lid includes a corresponding fin, and the corresponding fin fits inside of the slot.

20 . The method of claim 15 , wherein the module base and the custom lid are aluminum.

Assignees

• IBM

Inventors

• Arvelo Amilcar R
• Ellsworth Michael J
• Mckeever Eric J
• Nguyen Thong N
• Seminaro Edward J

Classifications

• H10W40/70

  Fillings or auxiliary members in containers or in encapsulations for thermal protection or control · CPC title

• H10W76/17

  characterised by their materials · CPC title

• H10W76/12 Primary

  characterised by their shape · CPC title

• H10W76/01

  Manufacture or treatment · CPC title

• H10W40/22

  characterised by their shape, e.g. having conical or cylindrical projections · CPC title