Electrodeposited copper foil with low repulsive force
US-10190225-B2 · Jan 29, 2019 · US
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Patent family 63556755
This patent family groups 4 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 63556755 |
| Family type | — |
| Earliest priority | Apr 18, 2017 |
| First filing country | US |
| Member publications | 4 |
| Countries | US |
| Representative publication | US10190225B2 — Electrodeposited copper foil with low repulsive force |
Representative publication
Best representative member for this family based on priority and filing country.
US10190225B2 — Electrodeposited copper foil with low repulsive force (published Jan 29, 2019)
Member publications
Related publications in this family.
Electrodeposited copper foil with low repulsive force
US-2018298508-A1 · Oct 18, 2018 · US
Electrodeposited copper foil with low repulsive force
US-2018298509-A1 · Oct 18, 2018 · US
Electrodeposited copper foil with low repulsive force
US-10081875-B1 · Sep 25, 2018 · US