Method of Bonding a Metallic Component to a Non-Metallic Component Using a Compliant Material

Patent metadata

Field	Value
Publication number	US-2018297900-A1
Application number	US-201815979079-A
Country	US
Kind code	A1
Filing date	May 14, 2018
Priority date	Jan 24, 2014
Publication date	Oct 18, 2018
Grant date	—

Abstract

A means for attaching a metallic component to a non-metallic component using a compliant material having thermal properties intermediate those of the metallic component to a non-metallic component is provided. The method can accommodate CTE mismatches and wear-type problems common to many assemblies of dissimilar materials. In particular, the method provides a sufficient wear surface to accommodate relative motion and provide a durable wear surface that does not excessively wear/gall/mico-weld itself together and provides the necessary damping and motion for proper operation in aeronautical applications.

First claim

What is claimed is:

1 . A method of bonding a metallic component to a non-metallic component comprising the steps of:
applying a compliant material between the metallic component and the non-metallic component to create an assembly, the compliant material having one or more thermal properties intermediate those of the metallic component and the non-metallic component; heating the assembly to a first temperature suitable to temporarily liquefy the compliant material without melting the metallic component; and bonding the metallic component and the non-metallic component by maintaining the assembly at a bonding temperature until the compliant material forms a solid bonding layer, wherein the bonding layer has a higher melting point than the first temperature.

2 . The method of claim 1 wherein:
the compliant material is applied by a process selected from the group consisting of foil layup, powder application, plating, chemical vapor deposition, physical vapor deposition, cold spraying, and plasma spraying.

3 . The method of claim 1 wherein:
the heating step is accomplished by a process selected from the group consisting of radiation, conduction, radio-frequency induction, resistance, laser, and infrared heating.

4 . The method of claim 1 wherein:
during the bonding step the compliant material diffuses into both the metallic component and into the non-metallic component.

5 . The method of claim 1 wherein:
during the bonding step the compliant material is precipitation hardened by holding the assembly at a hardening temperature lower than the first temperature for a specified period of time.

6 . The method of claim 1 wherein:
one of the one or more thermal properties is the coefficient of thermal expansion.

7 . The method of claim 6 wherein:
the non-metallic component is a ceramic matrix composite.

8 . The method of claim 1 wherein:
the compliant material consists essentially of a single thin homogenous interlayer.

9 . The method of claim 8 wherein:
the interlayer is a selected from the group consisting of a thin foil, a powder and a paste.

10 . The method of claim 9 wherein:
the interlayer is a thin foil of aluminum.

11 . The method of claim 1 wherein the compliant material comprises a multi-layer interlayer, the method comprising the additional step of:
homogenizing the compliant material that forms the bond by maintaining the assembly at a suitable second temperature.

12 . The method of claim 11 wherein:
the second temperature is different from the first temperature.

13 . The method of claim 3 wherein:
the metallic component is a platform and the non-metallic component is a vane or fin structure mountable to the platform.

14 . A bonded assembly comprising:
a metallic component; a non-metallic component; and a compliant material located in a bonding region between the metallic component and the non-metallic component, the compliant material having one or more thermal properties intermediate those of the metallic component and the non-metallic component.

15 . The bonded assembly of claim 14 wherein:
one of the one or more thermal properties is the coefficient of thermal expansion.

16 . The bonded assembly of claim 15 wherein:
the non-metallic component is a ceramic matrix composite.

17 . The bonded assembly of claim 15 wherein:
the compliant material consists essentially of a single thin homogenous interlayer.

18 . The bonded assembly of claim 17 wherein:
the interlayer is a selected from the group consisting of a thin foil, a powder and a paste.

19 . The bonded assembly of claim 18 wherein:
the interlayer is a thin foil of aluminum.

20 . A method of joining a metallic component to a non-metallic component made of ceramic matrix composite material, the method comprising the steps of:
providing a compliant material having a coefficient of thermal expansion intermediate the coefficient of thermal expansions of the metallic component and the non-metallic component; placing the compliant material between the metallic component and the non-metallic component to create an assembly; liquefying the compliant material at a first temperature; and bonding the metallic component to the non-metallic component by maintaining the assembly at a temperature at which the compliant material forms a diffusion bond with both the metallic component and the non-metallic component.

Assignees

• United Technologies Corp

Inventors

• Fisk Benjamin T
• Cook Iii Grant O

Classifications

• B23K20/16

  with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas · CPC title

• C04B2237/60

  Forming at the joining interface or in the joining layer specific reaction phases or zones, e.g. diffusion of reactive species from the interlayer to the substrate or from a substrate to the joining interface, carbide forming at the joining interface · CPC title

• C04B2237/121

  based on aluminium · CPC title

• B23K20/2333

  one layer being aluminium, magnesium or beryllium · CPC title

• B32B2315/02

  Ceramics · CPC title