Substrate processing method

Patent metadata

Field	Value
Publication number	US-2018264492-A1
Application number	US-201815988129-A
Country	US
Kind code	A1
Filing date	May 24, 2018
Priority date	Aug 27, 2013
Publication date	Sep 20, 2018
Grant date	—

Abstract

Productivity can be improved. A substrate processing method includes a processing liquid supplying process of supplying a processing liquid, which contains a volatile component and forms a film on a substrate, onto the substrate on which a pre-treatment, which requires atmosphere management or time management after the pre-treatment, is performed; and an accommodating process of accommodating, in a transfer container, the substrate on which the processing liquid is solidified or cured by volatilization of the volatile component.

First claim

We claim:

1 . A substrate processing method, comprising:
a processing liquid supplying process of supplying a processing liquid, which contains a volatile component and forms a film on a substrate, onto the substrate on which a pre-treatment, which requires atmosphere management or time management after the pre-treatment, is performed; and an accommodating process of accommodating, in a transfer container, the substrate on which the processing liquid is solidified or cured by volatilization of the volatile component.

2 . The substrate processing method of claim 1 ,
wherein the pre-treatment is a process in which a portion to be modified by being exposed to the atmosphere is formed on a surface of the substrate.

3 . The substrate processing method of claim 1 , further comprising:
a unloading process of taking out the substrate accommodated in the transfer container after the processing liquid supplying process; and a removing process of removing the solidified or cured processing liquid from the substrate after the unloading process.

4 . The substrate processing method of claim 3 , further comprising:
a post-treatment process of performing a preset post-treatment on the substrate after the removing process.

5 . The substrate processing method of claim 4 ,
wherein the pre-treatment is a process in which dry etching or ashing is performed on the substrate before the processing liquid supplying process, and the post-treatment is a process in which wet cleaning is performed on the substrate after the removing process.

6 . The substrate processing method of claim 4 ,
wherein the pre-treatment is a process in which dry etching or ashing is performed on the substrate before the processing liquid supplying process, and the post-treatment is a process in which dry etching is performed on the substrate after the removing process.

7 . The substrate processing method of claim 4 ,
wherein the pre-treatment is a process in which a metal film is formed in the substrate before the processing liquid supplying process, and the post-treatment is a process in which a metal film is formed on the substrate after the removing process.

8 . The substrate processing method of claim 4 ,
wherein the pre-treatment is a process in which wet cleaning is performed on the substrate before the processing liquid supplying process, and the post-treatment is a process in which a metal film is formed on the substrate after the removing process.

9 . The substrate processing method of claim 4 ,
wherein the pre-treatment is a process in which wet cleaning is performed on the substrate before the processing liquid supplying process, the processing liquid is a liquid of a sublimation material, and in the removing process, the solidified or cured processing liquid is removed from the substrate by sublimation.

10 . The substrate processing method of claim 1 , further comprising:
an other surface process of processing, in a state that an entire main surface of the substrate is covered with the solidified or cured processing liquid, an other surface of the substrate.

11 . The substrate processing method of claim 1 , further comprising:
a pre-treatment process of performing the pre-treatment on the substrate.

12 . The substrate processing method of claim 3 ,
wherein, in the removing process, the solidified or cured processing liquid is removed from the substrate by supplying a removing liquid.

13 . The substrate processing method of claim 12 ,
wherein the removing liquid contains an anticorrosive material for a metal wiring formed in the substrate.

Assignees

• Tokyo Electron Ltd

Inventors

• Kaneko Miyako
• Orii Takehiko
• Kanno Itaru

Classifications

• H10P72/0448

  Apparatus for applying a liquid, a resin, an ink or the like · CPC title

• H10P70/234 Primary

  the processing being the formation of vias or contact holes · CPC title

• H10W20/081

  by forming openings in the dielectric parts · CPC title

• B05B16/20

  Arrangements for spraying in combination with other operations, e.g. drying; Arrangements enabling a combination of spraying operations · CPC title

• B05B7/2497

  several liquids from different sources being supplied to the discharge device · CPC title