Composition for bonding

Patent metadata

Field	Value
Publication number	US-2018230575-A1
Application number	US-201815951424-A
Country	US
Kind code	A1
Filing date	Apr 12, 2018
Priority date	Oct 16, 2015
Publication date	Aug 16, 2018
Grant date	—

Abstract

A composition for bonding incudes tin, germanium, and nickel. A contained amount of germanium is less than or equal to 10 mass %. A contained amount of nickel in mass % is less than or equal to a product of 2.8 multiplied by a term that is the contained amount of germanium in mass % to the power of 0.3.

First claim

What is claimed is:

1 . A composition for bonding comprising tin, germanium, and nickel,
wherein a contained amount of germanium is less than or equal to 10 mass %, and wherein a contained amount of nickel in mass % is less than or equal to a product of 2.8 multiplied by a term that is the contained amount of germanium in mass % to the power of 0.3.

2 . The composition for bonding according to claim 1 , further comprising iridium,
wherein a contained amount of iridium is greater than of equal to 0 mass % and less than or equal to 0.1 mass %.

3 . The composition for bonding according to claim 1 , further comprising iridium,
wherein a contained amount of iridium is greater than or equal to 0 mass % and less than or equal to 0.025 mass %.

4 . The composition for bonding according to claim 1 , further comprising zinc,
wherein a contained amount of zinc is greater than or equal to 0 mass % and less than or equal to 0.5 mass %.

5 . The composition for bonding according to claim 1 ,
wherein the contained amount of germanium is greater than 0.5 mass %, wherein a sum of the contained amount of germanium and the contained amount of nickel is greater than 1.2 mass %, and wherein a value obtained by dividing the contained amount of nickel in mass % by the contained amount of germanium in mass % is less than 2.0.

6 . The composition for bonding according to claim 1 , further comprising oxygen,
wherein a contained amount of oxygen is greater than or equal to 0.0001 mass % and less than or equal to 2 mass %.

7 . The composition for bonding according to claim 1 ,
wherein the composition for bonding is used for bonding a material to be bonded provided with a bonding portion containing an oxide.

8 . The composition for bonding according to claim 7 ,
wherein the bonding portion of the material to be bonded contains at least one type of oxide selected from a group including a glass, a chrome oxide, and an aluminum oxide.

9 . The composition for bonding according to claim 1 ,
wherein in a cross section of the composition for bonding, a number of circles in a region with an area of 1.0×10 6 μm 2 , each circle inscribing an eutectic substance at a minimum diameter that is greater than or equal to 220 μm, is less than or equal to two, or a number of circles in the region with an area of 1.0×10 6 μm 2 , each circle inscribing an eutectic substance at a minimum diameter that is greater than or equal to 350 μm, is less than or equal to one.

Assignees

• Asahi Glass Co Ltd

Inventors

• Yamada Minoru
• Yamada Atsushi
• Shibuya Koichi
• Kikugawa Shinya
• Hanashima Keisuke

Classifications

• B23K35/262 Primary

  Sn as the principal constituent · CPC title

• C22C13/00 Primary

  Alloys based on tin · CPC title

• C03C27/08

  with the aid of intervening metal · CPC title

• B23K35/26

  with the principal constituent melting at less than 400°C · CPC title