Conformal 3d non-planar multi-layer circuitry

Patent metadata

Field	Value
Publication number	US-2018192513-A1
Application number	US-201815876552-A
Country	US
Kind code	A1
Filing date	Jan 22, 2018
Priority date	Aug 9, 2012
Publication date	Jul 5, 2018
Grant date	—

Abstract

A method for making conformal non-planar multi-layer circuitry is described. The method can include providing a substrate having a non-planar surface and depositing a first conformal dielectric layer on the substrate, the first conformal dielectric layer conforming to the non-planar surface of the substrate and having a non-planar surface. The method can also include applying a first conformal circuitry layer on the first conformal dielectric layer. The method can include depositing a second conformal dielectric layer on the first conformal circuitry layer, the second conformal dielectric layer conforming to a non-planar surface of the first conformal circuitry layer, and applying a second conformal circuitry layer on the second conformal dielectric layer. Successive layers can be sequentially deposited. Microvias may provide electrical connections between circuit layers.

First claim

1 - 20 . (canceled)

21 . A conformal non-planar multi-layer circuit, comprising:
a substrate having a first non-planar surface; a conformal circuitry layer over the substrate, the conformal circuitry layer conforming to the first non-planar surface of the substrate, and the conformal circuitry layer having a second non-planar surface; and a copper circuitry layer over the conformal circuitry layer, the copper circuitry layer conforming to the second non-planar surface of the conformal circuitry layer, and the copper circuitry layer having a third non-planar surface.

22 . The conformal non-planar multi-layer circuit of claim 21 , further comprising:
a conformal dielectric layer over the copper circuitry layer, the conformal dielectric layer conforming to the third non-planar surface of the copper circuitry layer, and the conformal dielectric layer having a fourth non-planar surface.

23 . The conformal non-planar multi-layer circuit of claim 22 , wherein the conformal dielectric layer has a thickness of about 2 mils.

24 . The conformal non-planar multi-layer circuit of claim 21 , further comprising:
a conformal dielectric layer over the substrate, the conformal dielectric layer conforming to the first non-planar surface of the substrate and the conformal dielectric layer having a fourth non-planar surface.

25 . The conformal non-planar multi-layer circuit of claim 24 , wherein
the conformal dielectric layer includes at least one micro via exposing the conformal circuitry layer, and the copper circuitry layer contacts the conformal circuitry layer through the at least one micro via.

26 . The conformal non-planar multi-layer circuit of claim 21 , wherein the conformal circuitry layer includes a chromium-copper alloy layer.

27 . The conformal non-planar multi-layer circuit of claim 26 , wherein the chromium-copper alloy layer has a thickness of about 1 micron.

28 . The conformal non-planar multi-layer circuit of claim 21 , wherein the copper circuitry layer includes a chromium-copper alloy layer.

29 . The conformal non-planar multi-layer circuit of claim 21 , wherein at least one of the conformal circuitry layer and the copper circuitry layer has a thickness of about 12.7 microns.

30 . A method of forming a multi-layer circuit, comprising:
providing a substrate having a first non-planar surface; forming a conformal circuitry layer over the substrate, the conformal circuitry layer conforming to the first non-planar surface of the substrate, and the conformal circuitry layer having a second non-planar surface; and forming a copper circuitry layer over the conformal circuitry layer, the copper circuitry layer conforming to the second non-planar surface of the conformal circuitry layer, and the copper circuitry layer having a third non-planar surface.

31 . The method of claim 30 , further comprising:
depositing a conformal dielectric layer over the copper circuitry layer, the conformal dielectric layer conforming to the third non-planar surface of the copper circuitry layer, and the conformal dielectric layer having a fourth non-planar surface.

32 . The method of claim 31 , wherein the depositing the conformal dielectric layer includes performing a vapor deposition process until the conformal dielectric layer has a thickness of about 2 mils.

33 . The method of claim 30 , further comprising:
depositing a conformal dielectric layer over the substrate, the conformal dielectric layer conforming to the first non-planar surface of the substrate and the conformal dielectric layer having a fourth non-planar surface.

34 . The method of claim 33 , further comprising:
drilling at least one micro via into the conformal dielectric layer, the at least one micro via exposing the conformal circuitry layer, wherein the copper circuitry layer contacts the conformal circuitry layer through the at least one micro via.

35 . The method of claim 30 , wherein the forming of the conformal circuitry layer includes sputtering or electroplating a chromium-copper alloy layer over the substrate.

36 . The method of claim 35 , wherein the chromium-copper alloy layer has a thickness of about 1 micron.

37 . The method of claim 30 , wherein the forming of the copper circuitry layer includes sputtering or electroplating a chromium-copper alloy layer over the conformal circuitry layer.

38 . The method of claim 30 , wherein at least one of the conformal circuitry layer and the copper circuitry layer has a thickness of about 12.7 microns.

Assignees

• Lockheed Corp

Inventors

• Gonya Stephen
• Twigg Kenn
• Patterson Jim

Classifications

• H05K3/4644 Primary

  by building the multilayer layer by layer, i.e. build-up multilayer circuits (making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602) · CPC title

• H05K1/053

  the metal substrate being covered by an inorganic insulating layer · CPC title

• H05K2201/09018

  Rigid curved substrate · CPC title

• H05K1/0298 Primary

  Multilayer circuits · CPC title

• H05K1/0284

  Details of three-dimensional rigid printed circuit boards (H05K1/119 takes precedence; shaping of the substrate H05K3/0014) · CPC title