Process for producing flexible organic-inorganic laminates
US-2018010249-A1 · Jan 11, 2018 · US
US2018187306A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2018187306-A1 |
| Application number | US-201515316661-A |
| Country | US |
| Kind code | A1 |
| Filing date | May 7, 2015 |
| Priority date | Jun 12, 2014 |
| Publication date | Jul 5, 2018 |
| Grant date | — |
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The present invention is in the field of processes for producing flexible organic-inorganic laminates as well as barrier films comprising flexible organic-inorganic laminates by atomic layer deposition. In particular the present invention relates to a process for producing a laminate comprising more than once the sequence comprising: (a) depositing an inorganic layer by performing 4 to 150 cycles of an atomic layer deposition process, and (b) depositing an organic layer comprising sulfur by a molecular layer deposition process.
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1 . A process for producing a laminate, the process comprising, more than once, a sequence comprising: (a) depositing an inorganic layer by performing 4 to 150 cycles of an atomic layer deposition process, and (b) depositing an organic layer comprising sulfur by a molecular layer deposition process. 2 . The process according to claim 1 wherein the molecular layer deposition process comprises depositing the organic layer with a thiol. 3 . The process according to claim 1 , wherein the molecular layer deposition process comprises depositing the organic layer with a dithiol. 4 . The process according to claim 1 , wherein the molecular layer deposition process comprises depositing the organic layer with an aromatic thiol. 5 . The process according to claim 1 , wherein the atomic layer deposition process comprises depositing the inorganic layer with an Al-containing compound. 6 . The process according to claim 1 , wherein the process comprises performing the sequence comprising (a) and (b) at least 30 times. 7 . A laminate comprising, more than once, a sequence comprising (a) an inorganic layer having a thickness of 0.4 to 15 nm and (b) a sulfur-comprising organic layer. 8 . The laminate according to claim 7 wherein the organic layer comprises sulfur in an oxidation state −2, −1 or 0. 9 . The laminate according to claim 7 , wherein the inorganic layer comprises AlO x (OH) y , wherein 0≤x≤1.5; 0≤y≤3 and 2 x+y=3. 10 . The laminate according to claim 7 , comprising at least 30 of the inorganic layers (a) alternating with at least 30 of the organic layers (b). 11 . A barrier film comprising the laminate according to claim 7 . 12 . The barrier film according to claim 11 wherein the barrier film further comprises a polymeric substrate. 13 . The barrier film according to claim 11 wherein the barrier film further comprises a planarization layer. 14 . A method of encapsulating, packaging, or passivating an object, the method comprising: encapsulating, packaging, or passivating the object with the barrier film according to claim 11 . 15 . An electronic device comprising the barrier film according to claim 11 . 16 . The barrier film according to claim 11 , wherein a water vapor transmission rate after drying at 70% relative humidity at 70° C. for 480 h is smaller than 10 −5 g/m 2 d. 17 . The barrier film according to claim 11 , wherein a water vapor transmission rate after bending with a radius of 1.5 cm and drying at 70% relative humidity at 70° C. for 480 h is smaller than 10 −2 g/m 2 d. 18 . The barrier film according to claim 11 , wherein a water vapor transmission rate after bending with a radius of 1.5 cm and drying at 70% relative humidity at 70° C. for 480 h is not more than 1000 times higher than a water vapor transmission rate after drying at 70% relative humidity at 70° C. for 480 h without bending.
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by cleaning or etching · CPC title
specially adapted for making a layer stack of alternating different compositions or gradient compositions · CPC title
Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D · CPC title
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