Rf clean system for electrostatic elements

Patent metadata

Field	Value
Publication number	US-2018166261-A1
Application number	US-201715427336-A
Country	US
Kind code	A1
Filing date	Feb 8, 2017
Priority date	Dec 9, 2016
Publication date	Jun 14, 2018
Grant date	—

Abstract

Provided herein are approaches for in-situ plasma cleaning of one or more components of an ion implantation system. In one approach, the component may include a beam-line component, such as an energy purity module, having a plurality of conductive beam optics contained therein. The system further includes a power supply system for supplying a voltage and a current to the beam-line component during a cleaning mode, wherein the power supply system may include a first power plug coupled to a first subset of the plurality of conductive beam optics and a second power plug coupled to a second subset of the plurality of conductive beam optics. During a cleaning mode, the voltage and current may be simultaneously supplied and split between each of the first and second power plugs.

First claim

1 . A system, comprising:
a plurality of electrostatic elements disposed within a chamber; and a power supply system in communication with the plurality of electrostatic elements, the power supply system comprising a first power plug and a second power plug for supplying a voltage and a current to the plurality of electrostatic elements during a cleaning mode, the first power plug coupled to a first subset of the plurality of electrostatic elements and the second power plug coupled to a second subset of the plurality of electrostatic elements.

2 . The system of claim 1 , further comprising:
an inductor; and a first power distribution plate and a second power distribution plate electrically coupled to the inductor.

3 . The system of claim 2 , wherein the first power distribution plate is electrically coupled with the first subset of the plurality of electrostatic elements, and wherein the second power distribution plate is electrically coupled with the second subset of the plurality of electrostatic elements.

4 . The system of claim 2 , further comprising:
a plurality of connection cables coupling the first and second power distribution plates to the first and second power plugs; and an additional distribution plate for powering at least one additional electrostatic element having a different electrical impedance than the plurality of electrostatic elements, wherein the additional distribution plate is disposed in proximity to at least one of: the first power distribution plate, the second power distribution plate, the inductor, and the plurality of connection cables.

5 . The system of claim 4 , wherein the additional distribution plate is electrically coupled with the at least one additional electrostatic element.

6 . The system of claim 4 , wherein the additional distribution plate receives power by capacitive or inductive coupling with at least one of: the first power distribution plate, the second power distribution plate, the inductor, and the plurality of connection cables.

7 . The system of claim 5 , wherein the plurality of electrostatic elements includes a first row of acceleration/deceleration conductive beam optics disposed along a first side of an ion beam-line and a second row of acceleration/deceleration conductive beam optics disposed along a second side of the ion beam-line, and wherein the at least one additional electrostatic element includes a set of focus conductive beam optics disposed between the first and second rows of acceleration/deceleration conductive beam optics.

8 . The system of claim 1 , wherein the first power plug is coupled to a first end of the plurality of electrostatic elements and the second power plug coupled to a second end of the plurality of electrostatic elements.

9 . The system of claim 1 , wherein the first power plug is coupled to a first end of the first subset of the plurality of electrostatic elements and the second power plug is coupled to a second end of the second subset of the plurality of electrostatic elements.

10 . The system of claim 1 , wherein the first power plug includes a first plurality of feedthrough connectors coupled to the first subset of the plurality of electrostatic elements, and wherein the second power plug includes a second plurality of feedthrough connectors coupled to the second subset of the plurality of electrostatic elements.

11 . An ion implantation system, comprising:
an energy purity module (EPM) including a chamber for generating a plasma, the EPM including a plurality of conductive beam optics disposed along an ion beam-line; and a power supply system in communication with the plurality of conductive beam optics, the power supply system comprising a first power plug and a second power plug for supplying a voltage and a current to the plurality of conductive beam optics during a cleaning mode to generate the plasma around the plurality of conductive beam optics, the first power plug coupled to a first subset of the plurality of conductive beam optics and the second power plug coupled to a second subset of the plurality of conductive beam optics.

12 . The ion implantation system of claim 11 , further comprising:
an inductor; and a first power distribution plate and a second power distribution plate electrically coupled to the inductor, wherein the first power distribution plate is further electrically coupled with the first subset of the plurality of electrostatic elements, and wherein the second power distribution plate is further electrically coupled with the second subset of the plurality of conductive beam optics.

13 . The ion implantation system of claim 12 , further comprising:
a plurality of connection cables coupling the first and second power distribution plates to the first and second power plugs; and an additional distribution plate for powering at least one conductive beam optic having a different electrical impedance than the plurality of conductive beam optics, wherein the additional distribution plate is electrically coupled with the at least one conductive beam optic and disposed in proximity to at least one of: the first power distribution plate, the second power distribution plate, the inductor, and the plurality of connection cables.

14 . The ion implantation system of claim 11 , wherein the first power plug is coupled to a first end of the plurality of conductive beam optics and the second power plug is coupled to a second end of the plurality of conductive beam optics.

15 . A method comprising:
providing a plurality of electrostatic elements within a chamber of an energy purity module (EPM), wherein the chamber is operable for generating a plasma; and supplying a voltage and a current to the plurality of electrostatic elements during a cleaning mode to generate the plasma around the plurality of electrostatic elements, wherein the voltage and the current are supplied to a first subset of the plurality of electrostatic elements by a first power plug, and wherein the voltage and the current are supplied to a second subset of the plurality of electrostatic elements by a second power plug.

16 . The method of claim 15 , further comprising simultaneously supplying the voltage and the current to the first subset and the second subset of the plurality of electrostatic elements.

17 . The method of claim 15 , further comprising electrically coupling a first power distribution plate with the first subset of the plurality of electrostatic elements, and electrically coupling a second power distribution plate with the second subset of the plurality of electrostatic elements.

18 . The method of claim 17 , further comprising:
coupling the first and second power distribution plates to the first and second power plugs using a plurality of connection cables; and powering, using an additional distribution plate, at least one additional electrostatic element having a different electrical impedance than the plurality of electrostatic elements, wherein the additional distribution plate is electrically coupled with the at least one additional electrostatic element and disposed in proximity to at least one of: the first power distribution plate, the second power distribution plate, an inductor, and the plurality of connection cables, and wherein just the first and second power distribution plates are directly electrically coupled with the inductor.

19 . The method of claim 18 , further comprising splitting the voltage and the current between the first and second power plugs.

20 . The method of claim 15 , fu

Assignees

• Varian Semiconductor Equipment Ass Inc

Inventors

• Anglin Kevin
• Binns Brant S
• Kurunczi Peter F
• Scheuer Jay T
• Hermanson Eric
• Likhanskii Alexandre

Classifications

• H01J37/3171

  for ion implantation · CPC title

• H01J37/36 Primary

  for cleaning surfaces while plating with ions of materials introduced into the discharge, e.g. introduced by evaporation {(condensing of electrically charged vapour onto a surface for covering materials with metals C23C14/32)} · CPC title

• H01J2237/057

  Energy or mass filtering · CPC title

• B08B5/00

  Cleaning by methods involving the use of air flow or gas flow (cleaning hollow articles by methods or apparatus specially adapted thereto B08B9/00) · CPC title

• H01J37/32862 Primary

  In situ cleaning of vessels and/or internal parts · CPC title