Surface treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device
US-10820414-B2 · Oct 27, 2020 · US
This page is not indexed by search engines while we improve data quality.
Patent family 62243739
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 62243739 |
| Family type | — |
| Earliest priority | Dec 5, 2016 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US10820414B2 — Surface treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device |
Representative publication
Best representative member for this family based on priority and filing country.
US10820414B2 — Surface treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device (published Oct 27, 2020)
Member publications
Related publications in this family.