Metallized Components And Surgical Instruments

Patent metadata

Field	Value
Publication number	US-2017368357-A1
Application number	US-201715630888-A
Country	US
Kind code	A1
Filing date	Jun 22, 2017
Priority date	Jun 27, 2016
Publication date	Dec 28, 2017
Grant date	—

Abstract

A surgical instrument and related methods are described. The surgical instrument includes a first jaw including a first structural jaw element and a first sealplate fixed to the first structural jaw element and a second jaw including a second structural jaw element and a second sealplate fixed to the second structural jaw element. The second structural jaw element is moveably coupled to the first structural jaw element to facilitate pinching tissue between the first and second sealplates. The first and second sealplates are configured to facilitate sealing tissue pinched therebetween. The first jaw further includes a metallized tie layer between the first sealplate and the first structural jaw element, wherein the first sealplate is fixed to the first structural jaw element via a metal to metal joint between the first sealplate and the metallized tie layer.

First claim

What is claimed is:

1 . A surgical instrument comprising:
a first jaw including a first structural jaw element and a first sealplate fixed to the first structural jaw element; a second jaw including a second structural jaw element and a second sealplate fixed to the second structural jaw element, wherein the second structural jaw element is moveably coupled to the first structural jaw element to facilitate pinching tissue between the first and second sealplates, and wherein the first and second sealplates are configured to facilitate sealing tissue pinched therebetween, wherein the first jaw further includes a metallized tie layer between the first sealplate and the first structural jaw element, wherein the first sealplate is fixed to the first structural jaw element via a metal to metal joint between the first sealplate and the metallized tie layer.

2 . The surgical instrument of claim 1 , wherein the first jaw further comprises a nonmetallic sealplate spacer on an external surface of the first sealplate.

3 . The surgical instrument of claim 2 , wherein the metallized tie layer is a first metallized tie layer, wherein the first jaw further comprises a second metallized tie layer between the nonmetallic sealplate spacer and the first structural jaw element.

4 . The surgical instrument of claim 2 , wherein the nonmetallic sealplate spacer is one of a group consisting of:
a polymeric component; a ceramic component; a ceramic-polymer composite component; an undoped silicon component; a glass component; and an alumina-filled epoxy component.

5 . The surgical instrument of claim 2 , wherein the nonmetallic sealplate spacer has a thickness in the range of about 0.001 inches to about 0.02 inches.

6 . The surgical instrument of claim 1 , wherein the first jaw further comprises a nonmetallic spacer between the first structural jaw element and the first sealplate, wherein the metallized tie layer is between the nonmetallic spacer and the first sealplate.

7 . The surgical instrument of claim 6 , wherein the metallized tie layer is a first metallized tie layer, wherein the first jaw further comprises a second metallized tie layer between the nonmetallic spacer and the first structural jaw element.

8 . The surgical instrument of claim 6 , wherein the nonmetallic spacer is one of a group consisting of:
a polymeric component; a ceramic component; a glass component; and a ceramic-polymer composite component; and a resin plastic injection molded component.

9 . The surgical instrument of claim 1 ,
wherein the metallized tie layer is a first metallized tie layer,
wherein the metal to metal joint is a first metal to metal joint,
wherein the second jaw further includes a second metallized tie layer between the second sealplate and the second structural jaw element,
wherein the second sealplate is fixed to the second structural jaw element via a second metal to metal joint between the second sealplate and the second metallized tie layer.

10 . The surgical instrument of any of claim 1 , wherein the first and second sealplates are configured to facilitate sealing tissue via one of a group consisting of:
electrothermal sealing; and ultrasonic sealing.

11 . A method of manufacture comprising:
forming a metallized tie layer on a surface of a nonmetallic component; positioning the surface of the nonmetallic component to mate with a metallic surface of a second component; and joining the metallized tie layer with the mated metallic surface of the second component using metal to metal joining techniques.

12 . The method of claim 11 , wherein the nonmetallic component is one of a group consisting of:
a polymeric component; a ceramic component; a ceramic-polymer composite component; a resin plastic injection molded component; an undoped silicon component; a glass component; and an alumina-filled epoxy component.

13 . The method of claim 11 , wherein the metal to metal joining techniques include compression fusion welding.

14 . The method of claim 13 , wherein the surfaces of the nonmetallic component and the metallic surface of the second component are gold plated, wherein the compression fusion welding is made by contacting the two gold plated surfaces and applying an energy source.

15 . The method of claim 14 , wherein the energy source is ultrasonic or megasonic in nature.

16 . The method of claim 14 , wherein the gold is held to the surface of the nonmetallic component by another metal forming the metallized tie layer.

17 . The method of claim 11 , wherein forming a metallized tie layer includes electroplating.

18 . The method of claim 11 , wherein forming a metallized tie layer includes electroless plating.

19 . The method of claim 11 , wherein forming a metallized tie layer includes vacuum deposition.

20 . The method of claim 11 , wherein forming a metallized tie layer includes sputtering of a metal.

21 . The method of claim 20 , wherein the metal includes one or more of Ti, Cr, Ta, Ru, NiChrome and NiV.

22 . The method of claim 20 , wherein the metal is selectively deposited utilizing a shadow mask.

23 . The method of claim 11 , wherein forming a metallized tie layer includes vapor deposition.

24 . The method of claim 11 , further comprising modifying the surface of the nonmetallic component by an ion source containing oxygen, or argon or both prior to forming the metallized tie layer on the surface of the nonmetallic component.

25 . The method of claim 11 , further comprising modifying the surface of the nonmetallic component by an plasma source containing oxygen, or argon or both prior to forming the metallized tie layer on the surface of the nonmetallic component.

26 . The method of any of claim 11 wherein the surface of the nonmetallic component is a 3D surface.

27 . The method of claim 26 , further comprising bonding or adhering a gold layer over the metallized tie layer prior to joining the metallized tie layer with the mated metallic surface of the second component using metal to metal joining techniques.

28 . The method of claim 11 , wherein the metal to metal joining techniques include reflow of tin based solder attached to both surfaces.

29 . The method of claim 11 , wherein the nonmetallic component is a resin plastic injection molded component, and the surface of the second component is a metallic 3D curved surface.

30 . The method of claim 11 , wherein the nonmetallic component has a 3D curved surface, and the surface of the second component is a metallic 3D curved surface.

31 . The method of claim 11 , wherein the metal to metal joining techniques include reflow of tin based solder attached to the metallized tie layer.

32 . The method of claim 31 , wherein the solder is bonded to the nonmetallic component with a solderable metal.

33 . The method of claim 32 , wherein the solderable metal includes one or more of Cu, Au, Ag, Ni, Ru, Cd, Sn, Ra, Brass and Pb.

34 . The method of claim 32 , wherein the solderable metal is cohesively bonded to the nonmetallic component by the metallized tie layer.

35 . The method of claim 32 , wherein the solderable metal is chosen from one that forms an inte

Assignees

• Hutchinson Technology

Inventors

• Davis Michael W
• Riemer Douglas P
• Olsen Clark T
• Lagergren Steven R
• Pesavento Paul V

Classifications

• B23K2103/08

  Non-ferrous metals or alloys · CPC title

• B23K20/233

  without ferrous layer · CPC title

• B23K2103/42

  Plastics other than composite materials · CPC title

• B23K2103/52

  Ceramics · CPC title

• C25D7/06

  Wires; Strips; Foils · CPC title