Substrate cleaning apparatus and substrate cleaning method

Patent metadata

Field	Value
Publication number	US-2017316960-A1
Application number	US-201515523078-A
Country	US
Kind code	A1
Filing date	Oct 20, 2015
Priority date	Oct 31, 2014
Publication date	Nov 2, 2017
Grant date	—

Abstract

A substrate cleaning apparatus ( 50 ) that cleans a substrate (S) includes: circumference supporting members ( 51 ) that support and rotate the substrate (S); a sponge ( 541 ) having a cleaning surface that is brought into contact with the surface to be cleaned of the substrate (S) being rotated by the circumference supporting members ( 51 ), and cleans the surface to be cleaned; an arm ( 53 ) that moves the sponge ( 541 ) in a radial direction of the substrate (S) while maintaining the cleaning surface in contact with the surface to be cleaned; and a controller ( 60 ) that controls the contact pressure of the cleaning surface on the surface to be cleaned. When the sponge ( 541 ) is located near the edge of the substrate (S), the controller ( 60 ) adjusts the contact pressure to a smaller value than that of when the sponge ( 541 ) is located near the center of the substrate (S).

First claim

1 . A substrate cleaning apparatus that cleans a substrate, the substrate cleaning apparatus comprising:
a substrate rotating supporter configured to support and rotate the substrate; a scrubbing member comprising a cleaning surface configured to clean a surface to be cleaned of the substrate being rotated by the substrate rotating supporter, the cleaning surface being brought into contact with the surface to be cleaned; a movement mechanism configured to move the scrubbing member in a radial direction of the substrate while maintaining the cleaning surface in contact with the surface to be cleaned; and a controller configured to control a contact pressure of the cleaning surface on the surface to be cleaned, wherein the controller sets the contact pressure of when the scrubbing member is located near an edge of the substrate to be smaller than the contact pressure of when the scrubbing member is located near a center of the substrate.

2 . The substrate cleaning apparatus according to claim 1 , wherein the controller further controls movement of the scrubbing member by the movement mechanism, and sets a moving speed of the scrubbing member of when the scrubbing member is located near the edge of the substrate to be smaller than the moving speed of when the scrubbing member is located near the center of the substrate.

3 . The substrate cleaning apparatus according to claim 1 , further comprising a rotation mechanism configured to rotate the scrubbing member,
wherein the controller further controls rotation of the scrubbing member by the rotation mechanism, and sets a rotating speed of the scrubbing member of when the scrubbing member is located near the edge of the substrate to be greater than the rotating speed of when the scrubbing member is located near the center of the substrate.

4 . The substrate cleaning apparatus according to claim 1 , wherein the controller controls rotation of the substrate by the substrate rotating supporter, and sets a rotating speed of the substrate of when the scrubbing member is located near the edge of the substrate to be greater than the rotating speed of when the scrubbing member is located near the center of the substrate.

5 . The substrate cleaning apparatus according to claim 1 , wherein the controller varies the contact pressure while the cleaning surface is in contact with the center of the substrate.

6 . The substrate cleaning apparatus according to claim 1 , wherein
the movement mechanism moves the scrubbing member on a first movement locus comprising a location where the cleaning surface overlaps the edge of the substrate, and the controller sets the contact pressure of when the cleaning surface overlaps the edge of the substrate to be smaller than the contact pressure of when the cleaning surface does not overlap the edge of the substrate.

7 . A substrate cleaning apparatus that cleans a substrate, the substrate cleaning apparatus comprising:
a substrate rotating supporter configured to support and rotate the substrate; a scrubbing member comprising a cleaning surface configured to clean a surface to be cleaned of the substrate being rotated by the substrate rotating supporter, the cleaning surface being brought into contact with the surface to be cleaned; a rotation mechanism configured to rotate the scrubbing member; a movement mechanism configured to move the scrubbing member in a radial direction of the substrate while maintaining the cleaning surface in contact with the surface to be cleaned; and a controller configured to control a contact pressure of the cleaning surface on the surface to be cleaned, wherein, the movement mechanism moves the scrubbing member on a first movement locus comprising a location where the cleaning surface overlaps an edge of the substrate, and the controller sets the contact pressure of when the cleaning surface overlaps the edge of the substrate to be smaller than the contact pressure of when the cleaning surface does not overlap the edge of the substrate.

8 . A substrate cleaning method of cleaning a substrate, the method comprising:
supporting and rotating the substrate; and moving a scrubbing member in a radial direction of the substrate while maintaining a cleaning surface of the scrubbing member in contact with a surface to be cleaned of the substrate, wherein a contact pressure of the cleaning surface on the surface to be cleaned of when the scrubbing member is located near an edge of the substrate is set to be smaller than the contact pressure of when the scrubbing member is located near a center of the substrate.

9 . A substrate cleaning method of cleaning a substrate, the method comprising:
supporting and rotating the substrate; moving a scrubbing member in a radial direction of the substrate on a first movement locus comprising a location where a cleaning surface of the scrubbing member overlaps an edge of the substrate while maintaining the cleaning surface of the scrubbing member in contact with a surface to be cleaned of the substrate; and rotating the scrubbing member, wherein a contact pressure of the cleaning surface on the surface to be cleaned of when the cleaning surface overlaps the edge of the substrate is set to be smaller than the contact pressure of when the cleaning surface does not overlap the edge of the substrate.

10 . (canceled)

Assignees

• Ebara Corp

Inventors

• Ishibashi Tomoatsu

Classifications

• H10P72/7608

  characterised by a plurality of separate clamping members, e.g. clamping fingers · CPC title

• H10P72/0604

  Process monitoring, e.g. flow or thickness monitoring · CPC title

• H10P70/15

  by wet cleaning only (H10P70/52 takes precedence) · CPC title

• H10P52/00

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• H10P72/0412 Primary

  using mainly scrubbing means, e.g. brushes · CPC title