Plated terminal for connector and terminal pair
US-9673547-B2 · Jun 6, 2017 · US
Terminal fitting and connector
US2017302016A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2017302016-A1 |
| Application number | US-201515516857-A |
| Country | US |
| Kind code | A1 |
| Filing date | Oct 16, 2015 |
| Priority date | Oct 30, 2014 |
| Publication date | Oct 19, 2017 |
| Grant date | — |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A terminal fitting having a smaller terminal insertion force than before. The terminal fitting includes a backing material made of a metal material and a plating coating covering a surface of the backing material. The plating coating contains a Sn parent phase and Sn—Pd based particles dispersed in the Sn parent phase and includes an outermost layer having an outer surface in which the Sn parent phase and the Sn—Pd based particles are present. Further, the number of the Sn—Pd based particles present in the outer surface of the plating coating in a state where only the Sn parent phase is removed is 10 to 400 Sn—Pd based particles per 500 μm 2 .
First claim
Opening claim text (preview).
1 . A terminal fitting, comprising: a backing material made of a metal material; and a plating coating covering a surface of the backing material, wherein: the plating coating contains a Sn parent phase and Sn—Pd based particles dispersed in the Sn parent phase and includes an outermost layer having an outer surface in which the Sn parent phase and the Sn—Pd based particles are present; and the number of the Sn—Pd based particles present in the outer surface of the plating coating in a state where only the Sn parent phase is removed is 10 to 400 Sn—Pd based particles per 500 μm 2 . 2 . A terminal fitting according to claim 1 , wherein an area occupation ratio of the Sn—Pd based particles present in the outer surface in the state where only the Sn parent phase is removed is 50 to 80%. 3 . A terminal fitting according to claim 1 , wherein the plating coating includes an inner layer provided between the backing material and the outermost layer and having a composition different from the outermost layer, and the inner layer includes a Ni—Sn layer having a thickness of 0.4 μm or larger. 4 . A terminal fitting according to claim 1 , wherein the terminal fitting integrally includes a terminal connecting portion to be electrically connected to a mating terminal, a board connecting portion to be electrically connected to a circuit board and an intermediate portion present between the terminal connecting portion and the board connecting portion, and at least the terminal connecting portion and the board connecting portion are covered with the plating coating. 5 . A terminal fitting according to claim 4 , wherein the board connecting portion includes a press-fit portion configured to be press-fitted into a through hole of the circuit board and form an electrical connection to the circuit board via a conductive portion provided in the through hole. 6 . A connector, comprising: a terminal fitting according to claim 1 ; and a housing for holding the terminal fitting.
Assignees
Inventors
Classifications
of nickel or cobalt · CPC title
Coupling device supported only by cooperation with PCB · CPC title
at least one layer being of nickel or chromium · CPC title
- H01R13/03Primary
characterised by the material, e.g. plating, or coating materials · CPC title
of platinum group metals · CPC title
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Frequently asked questions
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- What does patent US2017302016A1 cover?
- A terminal fitting having a smaller terminal insertion force than before. The terminal fitting includes a backing material made of a metal material and a plating coating covering a surface of the backing material. The plating coating contains a Sn parent phase and Sn—Pd based particles dispersed in the Sn parent phase and includes an outermost layer having an outer surface in which the Sn paren…
- Who is the assignee on this patent?
- Autonetworks Technologies Ltd, Sumitomo Wiring Systems, Sumitomo Electric Industries
- What technology area does this patent fall under?
- Primary CPC classification H01R13/03. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Oct 19 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).