Analysis system and analysis method

Patent metadata

Field	Value
Publication number	US-2017299534-A1
Application number	US-201415516151-A
Country	US
Kind code	A1
Filing date	Oct 9, 2014
Priority date	Oct 9, 2014
Publication date	Oct 19, 2017
Grant date	—

Abstract

A heat source position inside a measurement object is identified with high accuracy by improving time resolution.
An analysis system according to the present invention is an analysis system that identifies a heat source position inside a measurement object, and includes a condition setting unit that sets a measurement point for one surface of the measurement object, a tester that applies a stimulation signal to the measurement object, a light source that irradiates the measurement point of the measurement object with light, a photo detector that detects light reflected from a predetermined measurement point on the surface of the measurement object according to the irradiation of light and outputs a detection signal, and an analysis unit that derives a distance from the measurement point to the heat source position based on the detection signal and the stimulation signal and identifies the heat source position.

First claim

1 . An analysis system identifying a heat source position inside a measurement object, the analysis system comprising:
a setting unit configured to set a measurement point for one surface of the measurement object; an applying unit configured to apply a stimulation signal to the measurement object; a light irradiator configured to irradiate the measurement point with light; a light detector configured to detect light reflected from the measurement point and output a detection signal; and an analyzer configured to identify the heat source position by deriving a distance from the measurement point to the heat source position based on the detection signal and the stimulation signal.

2 . The analysis system according to claim 1 ,
wherein the setting unit is configured to set at least three measurement points for the measurement object, and the analyzer is configured to derive a distance from each of the at least three measurement points to the heat source position to identify the heat source position.

3 . The analysis system according to claim 1 , further comprising:
an infrared camera configured to acquire an infrared image of the measurement object.

4 . The analysis system according to claim 3 ,
wherein the setting unit is configured to set the measurement point based on the infrared image.

5 . The analysis system according to claim 1 ,
wherein the analyzer is configured to derive a phase delay amount of the detection signal relative to the stimulation signal to derive the distance from the measurement point to the heat source position.

6 . The analysis system according to claim 5 ,
wherein the analyzer is configured to derive the distance from the measurement point to the heat source position based on the derived phase delay amount and heat propagation velocity determined according to the measurement object to analyze the heat source position.

7 . The analysis system according to claim 5 ,
wherein the analyzer is configured to store a table defining a correspondence relationship between the phase delay amount of the detection signal and the distance from the measurement point to the heat source position in advance, and derive the distance from the measurement point to the heat source position based on the derived phase delay amount and the table to analyze the heat source position.

8 . The analysis system according to claim 1 ,
wherein the light irradiator comprises a light source configured to output the light and an optical scanner configured to irradiate the measurement point with the light.

9 . An analysis method for identifying a heat source position inside a measurement object, the analysis method comprising:
setting a measurement point for one surface of the measurement object; applying a stimulation signal to the measurement object; irradiating the measurement point with light; converting light reflected from the measurement point into a detection signal; and identifying the heat source position by deriving a distance from the measurement point to the heat source position based on the detection signal and the stimulation signal.

10 . The analysis method according to claim 9 ,
wherein setting a measurement point comprises setting at least three measurement points for the measurement object, and identifying the heat source position comprises deriving a distance from each of the at least three measurement points to the heat source position to identify the heat source position.

11 . The analysis method according to claim 9 , further comprising:
acquiring an infrared image of the measurement object, wherein setting a measurement point comprises setting the measurement point based on the infrared image.

12 . The analysis method according to claim 9 ,
wherein identifying the heat source position comprises deriving a phase delay amount of the detection signal relative to the stimulation signal to derive the distance from the measurement point to the heat source position.

Assignees

• Hamamatsu Photonics Kk

Inventors

• Nakamura Tomonori
• Hirai Nobuyuki

Classifications

• G01R31/30

  Marginal testing, e.g. by varying supply voltage (testing computers during standby operation or idle time G06F11/22) · CPC title

• G01R31/52

  Testing for short-circuits, leakage current or ground faults · CPC title

• G01R31/2656

  using non-ionising electromagnetic radiation, e.g. optical radiation · CPC title

• G01R31/311

  of integrated circuits {(G01R31/31728 takes precedence)} · CPC title

• G01R31/025

  Physics · mapped topic