Multilayer curable resin film, prepreg, laminate, cured product, composite, and multilayer circuit board

Patent metadata

Field	Value
Publication number	US-2017223843-A1
Application number	US-201515123527-A
Country	US
Kind code	A1
Filing date	Mar 4, 2015
Priority date	Mar 7, 2014
Publication date	Aug 3, 2017
Grant date	—

Abstract

A multilayer curable resin film comprising a first resin layer comprising a first curable resin composition including a polyphenylene ether oligomer (A1) with an end modified by an aromatic vinyl group and a curing agent (A2) and a second resin layer comprising a second curable resin composition including an alicyclic olefin polymer (B1) and a curing agent (B2), a prepreg comprised of this including a fiber substrate, and a laminate, cured product, composite, and multilayer circuit board obtained using these are provided.

First claim

1 . A multilayer curable resin film comprising
a first resin layer comprising a first curable resin composition including a polyphenylene ether oligomer (A1) with an end modified by an aromatic vinyl group and a curing agent (A2) and a second resin layer comprising a second curable resin composition including an alicyclic olefin polymer (B1) and a curing agent (B2).

2 . The multilayer curable resin film according to claim 1 wherein the alicyclic olefin polymer (B1) is an alicyclic olefin polymer having a polar group.

3 . The multilayer curable resin film according to claim 1 wherein the first curable resin composition further comprises an elastomer (A3).

4 . The multilayer curable resin film according to claim 1 wherein the first curable resin composition further comprises a polymer (A4) having a triazine structure.

5 . The multilayer curable resin film according to claim 1 wherein the second curable resin composition further comprises an inorganic filler (B3).

6 . The multilayer curable resin film according to claim 1 further comprising a support film on the surface of the second resin layer at the opposite side to the surface where the first resin layer is laminated.

7 . A method of production of a multilayer curable resin film according to claim 1 comprising
forming the second resin layer by coating, spraying, or flow casting the second curable resin composition on a substrate and
forming the first resin layer by coating, spraying, or flow casting the first curable resin composition on the second resin layer.

8 . A method of production of a multilayer curable resin film according to claim 1 comprising
forming the first resin layer by coating, spraying, or flow casting the first curable resin composition on a substrate,
forming the second resin layer by coating, spraying, or flow casting the second curable resin composition on another substrate, and
laminating the respectively formed first resin layer and second resin layer on separate substrates.

9 . A prepreg comprising a multilayer curable resin film according to claim 1 including a fiber substrate.

10 . A laminate obtained by laminating a multilayer curable resin film according to claim 1 on a substrate.

11 . A cured product obtained by curing a multilayer curable resin film according to claim 1 .

12 . A composite obtained by forming a conductor layer on a surface of a cured product according to claim 11 .

13 . A multilayer circuit board comprising
a cured product according to claim 11 and a board having an electrical insulating layer and formed with a conductor circuit layer on one or both surfaces of the electrical insulating layer.

14 . A method of production of a multilayer circuit board comprising
laminating a multilayer curable resin film according to claim 6 on a board having an electrical insulating layer and formed with a conductor circuit layer on one or both surfaces of the electrical insulating layer so that the board and the first resin layer of the multilayer curable resin film contact each other, curing the multilayer curable resin film to obtain a cured product, irradiating the cured product with a laser to form a via hole or through hole, peeling off the support film, and plating the surfaces of the via hole or through hole and cured product to form a conductor layer.

15 . A laminate obtained by laminating a prepreg according to claim 9 on a substrate.

16 . A cured product obtained by curing a prepreg according to claim 9 .

17 . A composite obtained by forming a conductor layer on a surface of a cured product according to claim 16 .

18 . A cured product obtained by curing a laminate according to claim 10 .

19 . A composite obtained by forming a conductor layer on a surface of a cured product according to claim 18 .

Assignees

• Zeon Corp

Inventors

• Kawakami Osamu
• Fujita Shigeru

Classifications

• H05K3/4644 Primary

  by building the multilayer layer by layer, i.e. build-up multilayer circuits (making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602) · CPC title

• B32B37/182

  one or more of the layers being plastic · CPC title

• H05K3/22

  Secondary treatment of printed circuits {(H05K3/1283 takes precedence; embedding circuits in grooves by pressure H05K3/107)} · CPC title

• H05K1/115

  Via connections; Lands around holes or via connections (H05K1/112 takes precedence) · CPC title

• C23C18/31

  Coating with metals · CPC title