Copper Foil, Copper-Clad Laminate Board, Method For Producing Printed Wiring Board, Method For Producing Electronic Apparauts, Method For Producing Transmission Channel, And Method For Producing Antenna

Patent metadata

Field	Value
Publication number	US-2017208680-A1
Application number	US-201715404351-A
Country	US
Kind code	A1
Filing date	Jan 12, 2017
Priority date	Jan 15, 2016
Publication date	Jul 20, 2017
Grant date	—

Abstract

To provide a copper foil and a copper-clad laminate board that have a good circuit formability and have a favorably suppressed transmission loss even in the use thereof in a high frequency circuit board. A copper foil comprising a gloss face, a surface roughness Ra of a surface of the copper foil on the gloss face side being 0.25 μm or less measured with a laser microscope and a surface roughness Rz of the surface of the copper foil on the gloss face side being 1.10 μm or less measured with a laser microscope, wherein the copper foil has a layer structure after heating at 200° C. for 30 minutes or after heating at 130° C. for 30 minutes or after heating at 300° C. for 30 minutes.

First claim

1 . A copper foil
comprising a gloss face, a surface roughness Ra of a surface of the copper foil on the gloss face side being 0.25 μm or less measured with a laser microscope and a surface roughness Rz of the surface of the copper foil on the gloss face side being 1.10 μm or less measured with a laser microscope, wherein the copper foil has a layer structure after heating at 200° C. for 30 minutes or after heating at 130° C. for 30 minutes or after heating at 300° C. for 30 minutes.

2 . The copper foil according to claim 1 , wherein the copper foil satisfies two or more of the following conditions (1) to (5):
(1) the copper foil having a layer structure before heating at 200° C. for 30 minutes or before heating at 130° C. for 30 minutes, the layer structure being retained after the heating at 200° C. for 30 minutes or after the heating at 130° C. for 30 minutes; (2) the copper foil having I(220)/I 0 (220) of 1 or more on the surface of the copper foil on the gloss face side after heating the copper foil at 200° C. for 30 minutes or after heating at 130° C. for 30 minutes; (3) the copper foil having a layer structure after heating at 300° C. for 30 minutes; (4) the copper foil having a layer structure before heating at 300° C. for 30 minutes, the layer structure being retained after the heating at 300° C. for 30 minutes; and (5) the copper foil having I(220)/I 0 (220) of 1 or more on the surface of the copper foil on the gloss face side after heating the copper foil at 300° C. for 30 minutes.

3 . The copper foil according to claim 1 , wherein the copper foil satisfies two or more of the following conditions (6) to (11):
(6) the copper foil having a gloss face, after heating at 200° C. for 30 minutes or after the heating at 130° C. for 30 minutes, and then half-etching with a sulfuric acid-hydrogen peroxide etching solution, a surface roughness Ra of a surface of the copper foil on the gloss face side being 0.15 μm or less measured with a laser microscope and a surface roughness Rz of the surface of the copper foil on the gloss face side being 0.80 μm or less measured with a laser microscope; (7) the copper foil having a gloss face, after heating at 200° C. for 30 minutes or after the heating at 130° C. for 30 minutes, and then half-etching with a sodium persulfate etching solution, a surface roughness Ra of a surface of the copper foil on the gloss face side being 0.22 μm or less measured with a laser microscope and a surface roughness Rz of the surface of the copper foil on the gloss face side being 1.30 μm or less measured with a laser microscope; (8) the copper foil having a gloss face, after heating at 300° C. for 30 minutes, and then half-etching with a sulfuric acid-hydrogen peroxide etching solution, a surface roughness Ra of a surface of the copper foil on the gloss face side being 0.15 μm or less measured with a laser microscope and a surface roughness Rz of the surface of the copper foil on the gloss face side being 0.80 μm or less measured with a laser microscope; (9) the copper foil having a gloss face, after heating at 300° C. for 30 minutes, and then half-etching with a sodium persulfate etching solution, a surface roughness Ra of a surface of the copper foil on the gloss face side being 0.22 μm or less measured with a laser microscope and a surface roughness Rz of the surface of the copper foil on the gloss face side being 1.30 μm or less measured with a laser microscope; (10) the copper foil having a gloss face, after heating at 200° C. for 30 minutes or after the heating at 130° C. for 30 minutes, and then half-etching with a sulfuric acid-hydrogen peroxide etching solution, a surface roughness Ra of a surface of the copper foil on the gloss face side being 0.22 μm or less measured with a laser microscope and a surface roughness Rz of the surface of the copper foil on the gloss face side being 1.30 μm or less measured with a laser microscope; and (11) the copper foil having a gloss face, after heating at 300° C. for 30 minutes, and then half-etching with a sulfuric acid-hydrogen peroxide etching solution, a surface roughness Ra of a surface of the copper foil on the gloss face side being 0.22 μm or less measured with a laser microscope and a surface roughness Rz of the surface of the copper foil on the gloss face side being 1.30 μm or less measured with a laser microscope.

4 . The copper foil according to claim 2 , wherein the copper foil satisfies two or more of the following conditions (6) to (11):
(6) the copper foil having a gloss face, after heating at 200° C. for 30 minutes or after the heating at 130° C. for 30 minutes, and then half-etching with a sulfuric acid-hydrogen peroxide etching solution, a surface roughness Ra of a surface of the copper foil on the gloss face side being 0.15 μm or less measured with a laser microscope and a surface roughness Rz of the surface of the copper foil on the gloss face side being 0.80 μm or less measured with a laser microscope; (7) the copper foil having a gloss face, after heating at 200° C. for 30 minutes or after the heating at 130° C. for 30 minutes, and then half-etching with a sodium persulfate etching solution, a surface roughness Ra of a surface of the copper foil on the gloss face side being 0.22 μm or less measured with a laser microscope and a surface roughness Rz of the surface of the copper foil on the gloss face side being 1.30 μm or less measured with a laser microscope; (8) the copper foil having a gloss face, after heating at 300° C. for 30 minutes, and then half-etching with a sulfuric acid-hydrogen peroxide etching solution, a surface roughness Ra of a surface of the copper foil on the gloss face side being 0.15 μm or less measured with a laser microscope and a surface roughness Rz of the surface of the copper foil on the gloss face side being 0.80 μm or less measured with a laser microscope; (9) the copper foil having a gloss face, after heating at 300° C. for 30 minutes, and then half-etching with a sodium persulfate etching solution, a surface roughness Ra of a surface of the copper foil on the gloss face side being 0.22 μm or less measured with a laser microscope and a surface roughness Rz of the surface of the copper foil on the gloss face side being 1.30 μm or less measured with a laser microscope; (10) the copper foil having a gloss face, after heating at 200° C. for 30 minutes or after the heating at 130° C. for 30 minutes, and then half-etching with a sulfuric acid-hydrogen peroxide etching solution, a surface roughness Ra of a surface of the copper foil on the gloss face side being 0.22 μm or less measured with a laser microscope and a surface roughness Rz of the surface of the copper foil on the gloss face side being 1.30 μm or less measured with a laser microscope; and (11) the copper foil having a gloss face, after heating at 300° C. for 30 minutes, and then half-etching with a sulfuric acid-hydrogen peroxide etching solution, a surface roughness Ra of a surface of the copper foil on the gloss face side being 0.22 μm or less measured with a laser microscope and a surface roughness Rz of the surface of the copper foil on the gloss face side being 1.30 μm or less measured with a laser microscope.

5 . The copper foil according to claim 1 ,
wherein the copper foil comprises a gloss face, a surface roughness Ra of a surface of the copper foil on the gloss face side being 0.25 μm or less measured with a laser microscope and a surface roughness Rz of the surface of the copper foil on the gloss face side being 1.10 μm or less measured with a laser microscope, and the copper foil has a layer structure before heating at 200° C. for 30 minutes or before heating at 130° C. for 30 minutes, the layer structure being retained after the heating at 200° C. for 30 minutes or after the heating at 130° C. for 30 minutes.

Assignees

• Jx Nippon Mining & Metals Corp

Inventors

• Fukuchi Ryo

Classifications

• H05K2201/015

  Fluoropolymer, e.g. polytetrafluoroethylene [PTFE] · CPC title

• H05K1/0313

  Organic insulating material · CPC title

• H05K2201/0141

  Liquid crystal polymer [LCP] · CPC title

• H01Q1/38

  formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface  H01Q15/142)} · CPC title

• H05K3/389

  by the use of a coupling agent, e.g. silane · CPC title