Copper Foil, Copper-Clad Laminate Board, Method For Producing Printed Wiring Board, Method For Producing Electronic Apparauts, Method For Producing Transmission Channel, And Method For Producing Antenna
US-2017208680-A1 · Jul 20, 2017 · US
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Patent family 58053971
This patent family groups 1 related publication across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 58053971 |
| Family type | — |
| Earliest priority | Jan 15, 2016 |
| First filing country | US |
| Member publications | 1 |
| Countries | US |
| Representative publication | US2017208680A1 — Copper Foil, Copper-Clad Laminate Board, Method For Producing Printed Wiring Board, Method For Producing Electronic Apparauts, Method For Producing Transmission Channel, And Method For Producing Antenna |
Representative publication
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US2017208680A1 — Copper Foil, Copper-Clad Laminate Board, Method For Producing Printed Wiring Board, Method For Producing Electronic Apparauts, Method For Producing Transmission Channel, And Method For Producing Antenna (published Jul 20, 2017)
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