Cooling apparatus for electronic components

Patent metadata

Field	Value
Publication number	US-2017192471-A1
Application number	US-201615395954-A
Country	US
Kind code	A1
Filing date	Dec 30, 2016
Priority date	Dec 30, 2015
Publication date	Jul 6, 2017
Grant date	—

Abstract

A cooling apparatus that includes a base plate configured to dissipate heat and including a heat exchange unit, and a cover member coupled to the base plate and at least partially enclosing the heat exchange unit. The cover member and the base plate define a heat exchange chamber that includes the heat exchange unit. The cover member defines a first opening and a second opening, and at least one of the first and second openings are above the heat exchange unit. The cooling apparatus further includes a flow guidance plate disposed on the cover member and a housing disposed on the flow guidance plate.

First claim

What is claimed is:

1 . A cooling apparatus, comprising:
a base plate configured to dissipate heat and including a heat exchange unit; a cover member coupled to the base plate and at least partially enclosing the heat exchange unit, the cover member and the base plate defining a heat exchange chamber that includes the heat exchange unit, the cover member defining a first opening and a second opening, and the cover member being coupled to the base plate such that at least one of the first and second openings is above the heat exchange unit; a flow guidance plate disposed on the cover member; and a housing disposed on the flow guidance plate.

2 . The cooling apparatus of claim 1 , wherein
the heat exchange unit includes a plurality of fins, the first opening is a first elongated slot and the second opening is a second elongated slot parallel to the first elongated slot, the first and second elongated slots having different lengths, and the cover member is coupled to the base plate such that the first and second elongated slots extend perpendicular to the plurality of fins.

3 . The cooling apparatus of claim 2 , wherein the plurality of fins form an array having a width substantially equal to a length of the first elongated slot.

4 . The cooling apparatus of claim 1 , wherein the cover member and the base plate are coupled together by at least one weld.

5 . The cooling apparatus of claim 1 , wherein the flow guidance plate at least partially defines a first cavity and a second cavity separated from the first cavity, and defines a first plate opening in fluid communication with the second cavity and a second plate opening in fluid communication with the first cavity.

6 . The cooling apparatus of claim 5 , wherein the first cavity is in fluid communication with the heat exchange chamber via the first opening.

7 . The cooling apparatus of claim 6 , wherein the flow guidance plate and the housing define a pumping chamber that is in fluid communication with the first cavity via the second plate opening.

8 . The cooling apparatus of claim 7 , wherein the pumping chamber is in fluid communication with second cavity via the first plate opening.

9 . The cooling apparatus of claim 8 , wherein the pumping chamber is further defined by at least two extension portions, the at least two extension portions forming a channel that is in fluid communication with the first cavity via the second plate opening.

10 . The cooling apparatus of claim 8 , wherein the housing defines a first cavity and a second cavity fluidly isolated from each other, and wherein the housing includes at least one inlet that is in fluid communication with the first cavity, and an outlet that is in fluid communication with the second cavity.

11 . The cooling apparatus of claim 10 , wherein the housing further defines a third cavity which at least partially forms the pumping chamber and is sized to receive a rotor unit, and a fourth cavity sized to receive a stator unit.

12 . The cooling apparatus of claim 10 , wherein the second cavity is in fluid communication with the heat exchange chamber via the second opening.

13 . The cooling apparatus of claim 10 , wherein the first cavity of the housing is in fluid communication with the second cavity defined by the flow guidance plate.

14 . The cooling apparatus of claim 1 , further comprising an outer casing secured to the base plate and at least partially enclosing the cover member, the flow guidance plate, and the housing.

15 . The cooling apparatus of claim 1 , wherein the cover member is coupled to the base plate using a plurality of fixing members.

16 . The cooling apparatus of claim 15 , wherein the cover member defines a plurality of first installation holes and the base plate defines a plurality of second installation holes, and the cover member is coupled to the base plate such that the plurality of fixing members are positioned in the first and second installation holes.

17 . The cooling apparatus of claim 16 , wherein the cover member defines a concave portion sized to receive the heat exchange unit.

18 . The cooling apparatus of claim 1 , further comprising a partitioning plate between the cover member and the flow guidance plate, the partitioning plate including a thermally resistive material.

19 . The cooling apparatus of claim 18 , wherein the flow guidance plate includes a plurality of columns, and the partitioning plate defines a plurality of openings corresponding to the plurality of columns and sized to receive the plurality of columns when the flow guidance plate is installed in the partitioning plate.

20 . The cooling apparatus of claim 1 , further comprising a sealing element for sealing an interface between the cover member and the base plate.

Assignees

• Cooler Master Co Ltd

Inventors

• Tsai Shui-Fa
• Lin Fu-Lung

Classifications

• H10W40/611

  Bolts or screws · CPC title

• H10W40/258

  Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title

• H10W40/25

  characterised by their materials · CPC title

• H10W40/47

  by flowing liquids, e.g. forced water cooling · CPC title

• G06F2200/201

  Cooling arrangements using cooling fluid · CPC title