Liquid cooling heat dissipation structure and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-2016309618-A1
Application number	US-201514689131-A
Country	US
Kind code	A1
Filing date	Apr 17, 2015
Priority date	Apr 17, 2015
Publication date	Oct 20, 2016
Grant date	—

Abstract

A liquid cooling heat dissipation structure includes a single heat conduction module and an assembly liquid supply module. The single heat conduction module includes a heat-conducting substrate contacting a heat generation source, a plurality of heat-conducting fins fixedly disposed on the heat-conducting substrate, a heat-conducting fluid-splitting board fixedly disposed on the heat-conducting substrate, and a heat-conducting fluid-conducting board fixedly disposed on the heat-conducting fluid-splitting board. The assembly liquid supply module includes an external cover body detachably disposed on the heat-conducting substrate and a rotary component detachably disposed between the external cover body and the heat-conducting fluid-conducting board. Therefore, cooling liquid passes through at least one liquid inlet and flows into the external cover body to contact the single heat conduction module by driving the rotary component, so that heat transmitted from the heat generation source to the single heat conduction module is absorbed by the cooling liquid.

First claim

What is claimed is:

1 . A liquid cooling heat dissipation structure, comprising:
a single heat conduction module including a heat-conducting substrate contacting a heat generation source, a plurality of heat-conducting fins fixedly disposed on the heat-conducting substrate, a heat-conducting fluid-splitting board fixedly disposed on the heat-conducting substrate to cover the heat-conducting fins, and a heat-conducting fluid-conducting board fixedly disposed on the heat-conducting fluid-splitting board, wherein the heat-conducting fluid-splitting board has a first fluid-conducting opening and a second fluid-conducting opening communicated with the first fluid-conducting opening through a first receiving space, and the heat-conducting fluid-splitting board has a first fluid-splitting opening communicated with the second fluid-conducting opening through a second receiving space and a second fluid-splitting opening communicated with the first fluid-splitting opening through a third receiving space; and an assembly liquid supply module including an external cover body detachably disposed on the heat-conducting substrate and a pump detachably disposed on the external cover body, wherein the heat-conducting fins, the heat-conducting fluid-splitting board, and the heat-conducting fluid-conducting board are received inside the external cover body, and the external cover body has at least one liquid inlet communicated with the first liquid-conducting opening through a fourth receiving space and at least one liquid outlet communicated with the second fluid-splitting opening; wherein heat generated by the heat generation source is transmitted to the heat-conducting substrate, the heat-conducting fins, the heat-conducting fluid-splitting board, and the heat-conducting fluid-conducting board of the single heat conduction module; wherein cooling liquid passes through the at least one liquid inlet and flows into the external cover body to contact the heat-conducting substrate, the heat-conducting fins, the heat-conducting fluid-splitting board, and the heat-conducting fluid-conducting board by driving the pump, so that the heat that has been transmitted to the heat-conducting substrate, the heat-conducting fins, the heat-conducting fluid-splitting board, and the heat-conducting fluid-conducting board of the single heat conduction module is absorbed by the cooling liquid.

2 . The liquid cooling heat dissipation structure of claim 1 , wherein the heat-conducting fluid-splitting board has a first surrounding partition portion disposed on the heat-conducting substrate and a first cover plate portion connected to the first surrounding partition portion and disposed above the heat-conducting fins.

3 . The liquid cooling heat dissipation structure of claim 2 , wherein the first fluid-splitting opening passes through the first cover plate portion, the second fluid-splitting opening passes through the first cover plate portion and is connected to the first surrounding partition portion, and the heat generated by the heat generation source is transmitted to the first cover plate portion through the first surrounding partition portion.

4 . The liquid cooling heat dissipation structure of claim 2 , wherein the heat-conducting fluid-conducting board has a second surrounding partition portion disposed on the first cover plate portion, a second cover plate portion connected to the second surrounding partition portion and disposed above the first cover plate portion, and a plurality of connection portions extended downwardly from a bottom surface of the second cover plate portion to the first cover plate portion.

5 . The liquid cooling heat dissipation structure of claim 4 , wherein both the first fluid-conducting opening and the second fluid-conducting opening pass through the second cover plate portion and is connected to the second surrounding partition portion, and the heat is transmitted from the first cover plate portion to the second cover plate portion through the second surrounding partition portion and the connection portions.

6 . The liquid cooling heat dissipation structure of claim 4 , wherein the first receiving space is formed between the external cover body and the second cover plate portion, both the second receiving space and the fourth receiving space are formed between the heat-conducting fluid-conducting board and the first cover plate portion, and the third receiving space is formed between the heat-conducting fluid-splitting board and the heat-conducting substrate, wherein the second receiving space and the fourth receiving space are isolated from each other through the second surrounding partition portion, some of the connection portions are disposed inside the second receiving space, and the other connection portions are disposed inside the fourth receiving space.

7 . The liquid cooling heat dissipation structure of claim 6 , wherein the first cover plate portion has a plurality of through holes, and each of the through holes has a first through hole portion connected to the second receiving space or the fourth receiving space and a second through hole portion connected between the first through hole portion and the third receiving space, wherein the first through hole portions of the through holes have the same first diameters, and each second through holes portion has a second diameter increased gradually along a direction from the first through hole portion to the third receiving space.

8 . The liquid cooling heat dissipation structure of claim 7 , wherein each connection portion has an embedded portion embedded in the corresponding through hole.

9 . A liquid cooling heat dissipation structure, comprising:
a single heat conduction module including a heat-conducting substrate contacting a heat generation source, a plurality of heat-conducting fins fixedly disposed on the heat-conducting substrate, a heat-conducting fluid-splitting board fixedly disposed on the heat-conducting substrate to cover the heat-conducting fins, and a heat-conducting fluid-conducting board fixedly disposed on the heat-conducting fluid-splitting board; and an assembly liquid supply module including an external cover body detachably disposed on the heat-conducting substrate and a rotary component detachably disposed between the external cover body and the heat-conducting fluid-conducting board, wherein the heat-conducting fins, the heat-conducting fluid-splitting board, and the heat-conducting fluid-conducting board are received inside the external cover body, and the external cover body has at least one liquid inlet and at least one liquid outlet; wherein cooling liquid passes through the at least one liquid inlet and flows into the external cover body to contact the single heat conduction module by driving the rotary component, so that heat transmitted from the heat generation source to the single heat conduction module is absorbed by the cooling liquid.

10 . The liquid cooling heat dissipation structure of claim 9 , wherein the heat-conducting fluid-splitting board has a first surrounding partition portion disposed on the heat-conducting substrate and a first cover plate portion connected to the first surrounding partition portion and disposed above the heat-conducting fins, and the heat generated by the heat generation source is transmitted to the first cover plate portion through the first surrounding partition portion.

11 . The liquid cooling heat dissipation structure of claim 10 , wherein the heat-conducting fluid-conducting board has a second surrounding partition portion disposed on the first cover plate portion, a second cover plate portion connected to the second surrounding partition portion and disposed above t

Assignees

• Cooler Master Co Ltd

Inventors

• Tsai Shui-Fa
• Tsai Chang-Han

Classifications

• H10W40/47

  by flowing liquids, e.g. forced water cooling · CPC title

• B23P15/26 Primary

  heat exchangers {or the like (making heat exchangers by methods covered by other subclasses B21D53/02)} · CPC title

• F28F2250/08

  Fluid driving means, e.g. pumps, fans · CPC title

• G06F1/20

  Cooling means · CPC title

• G06F2200/201

  Cooling arrangements using cooling fluid · CPC title