Optical Fiber Pressure Sensor With Uniform Diaphragm And Method Of Fabricating Same

Patent metadata

Field	Value
Publication number	US-2017191893-A1
Application number	US-201615387919-A
Country	US
Kind code	A1
Filing date	Dec 22, 2016
Priority date	Jun 29, 2009
Publication date	Jul 6, 2017
Grant date	—

Abstract

An optical fiber sensor can be used to measure pressure with high sensitivity and fine resolution. As a cavity at the end of the sensor expands or contracts, the spectrum of a beam reflected from the end of fiber shifts, producing a change linked to pressure exerted on the sensor. Novel aspects of the present inventive sensor include the direct bonding of a silica thin film diaphragm to the optical fiber with localized or confined heating and a uniform thickness of the diaphragm. The resulting sensor has a diameter that matches the diameter of the optical fiber. Because the sensor is all silica, it does not suffer from temperature-induced error. In addition, the sensor can be very sensitive because the diaphragm can be very thin; it can also make highly repeatable measurements due to its very uniform thickness.

First claim

What is claimed is:

1 . A method of making a sensor, comprising the steps of:
(a) forming a thin film having at least one of i) a thickness that varies by up to and including about 10 percent, and ii) a thickness in a range of between about 50 nm and about 750 nm; (b) supporting the thin film on a holder and, while the thin film is being supported on the holder; (c) placing a surface of the thin film directly in contact with a surface of an optical fiber; and (d) heating at least one of the thin film and the optical fiber to at least about 700 degrees Celsius to thermally bond the thin film to the optical fiber and thereby form a sensor with a diaphragm defining one side of a cavity.

2 . The method of claim 1 , wherein the step of forming the thin film includes dry etching.

3 . The method of claim 1 , wherein the step of forming the thin film includes wet etching.

4 . The method of claim 1 , wherein the diaphragm has a thickness that varies by up to and including about ten percent.

5 . The method of claim 4 , wherein the diaphragm has a thickness that varies by up to and including about five percent.

6 . The method of claim 1 , wherein the thin film is a silica thin film.

7 . The method of claim 1 , further including the step of supporting the thin film with a frame structure.

8 . The method of claim 1 , further including the step of forming a recess in the surface of the optical fiber before placing the surface of the thin film directly in contact with the surface of the optical fiber.

9 . The method of claim 8 , wherein forming the recess includes removing part of a core of the optical fiber.

10 . The method of claim 1 , further including the step of forming a recess in the surface of the thin film before placing the surface of the thin film directly in contact with the optical fiber.

11 . The method of claim 1 , further including the step of pushing at least one of the thin film and the optical fiber toward the other of the thin film and the optical fiber.

12 . The method of claim 1 , wherein heating the at least one of the thin film and the optical fiber includes localized heating of the thin film, thereby causing the thin film to bond to the optical fiber.

13 . The method of claim 12 , wherein localized heating of the thin film includes illuminating the surface of the thin film with a laser beam.

14 . The method of claim 1 , further including the step of adjusting a length of the cavity by pushing or pulling on the thin film or the optical fiber while heating at least one of the thin film and the optical fiber.

15 . The method of claim 1 , further including the step of supporting the optical fiber with a ferrule, V-groove, or step-slot.

16 . The method of claim 1 , wherein the optical fiber is a multimode optical fiber and further including the step of bonding the multimode optical fiber to a single-mode optical fiber.

17 . An optical fiber sensor formed by a method comprising the steps of:
(a) forming a thin film having at least one of i) a thickness that varies by up to and including about 10 percent, and ii) a thickness in a range of between about 50 nm and about 750 nm; (b) supporting the thin film on a holder and, while the thin film is being supported on the holder; (c) placing a surface of the thin film directly in contact with a surface of an optical fiber; and (d) heating at least one of the thin film and the optical fiber to at least about 700 degrees Celsius to thermally bond the thin film to the optical fiber and thereby form a sensor with a diaphragm defining one side of a cavity

18 . The optical fiber sensor of claim 17 , wherein the diaphragm is formed of the thin film, and wherein the thin film has a thickness of about two microns or less.

19 . The optical fiber sensor of claim 17 , wherein the thin film is a silica thin film.

20 . The optical fiber sensor of claim 17 , wherein the thin film is formed by dry etching.

21 . An optical fiber sensor formed by a method consisting essentially of the steps of:
(a) forming a thin film having at least one of i) a thickness that varies by up to and including about 10 percent, and ii) a thickness in a range of between about 50 nm and about 750 nm; (b) supporting the thin film on a holder and, while the thin film is being supported in the holder; (c) placing a surface of the thin film directly in contact with a surface of an optical fiber; and (d) heating at least one of the thin film and the optical fiber to thermally bond the thin film to the optical fiber and thereby form a sensor with a diaphragm defining one side of a cavity.

Assignees

• Univ Massachusetts

Inventors

• Wang Wenhui
• Wang Xingwei Vivian
• Sun Kai
• Wu Nan

Classifications

• G01L7/086 Primary

  with optical transmitting or indicating means · CPC title

• Y10T156/1052

  with cutting, punching, tearing or severing · CPC title

• Y10T156/10

  Methods of surface bonding and/or assembly therefor · CPC title

• B23K26/361

  for deburring or mechanical trimming (B23K26/351 takes precedence) · CPC title

• B23K26/362

  Laser etching · CPC title