In-situ balancing of plated polymers

US2016145758A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016145758-A1
Application numberUS-201414903915-A
CountryUS
Kind codeA1
Filing dateJul 9, 2014
Priority dateJul 9, 2013
Publication dateMay 26, 2016
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method for balancing a rotatable component is disclosed This method comprises and then plating the component to deposit a metal layer onto the component until the component is balanced. In addition, and alternative method for balancing a rotatable component is disclosed. This method comprises attaching a balancing weight to the rotatable component and rotating the component. This is followed by plating the component and the balancing weight to deposit a metal layer onto the balancing weight and the component until the component is balanced.

First claim

Opening claim text (preview).

What is claimed is: 1 . A method for balancing a rotatable component, the method comprising: rotating the component; and plating the component to deposit a metal layer onto the component until the component is balanced. 2 . The method of claim 1 wherein the plating is selected from the group consisting of brush plating and brush electroplating. 3 . The method of claim 2 wherein the brush plating comprises a brush saturated with plating solution. 4 . The method of claim 3 wherein the brush is selected from the group consisting of stainless steel or graphite. 5 . The method of claim 4 wherein the brush is further wrapped with a cloth material that holds the plating solution and prevents direct contact with the part being plated. 6 . The method of claim 2 wherein the brush electroplating comprises a brush saturated with plating solution. 7 . The method of claim 6 wherein the brush is selected from the group consisting of stainless steel or graphite. 8 . The method of claim 7 wherein the brush is further wrapped with a cloth material that holds the plating solution and prevents direct contact with the part being plated. 9 . A method for balancing a rotatable component, the method comprising: attaching a balancing weight to the rotatable component; rotating the component; and plating the component and the balancing weight to deposit a metal layer onto the balancing weight and the component until the component is balanced. 10 . The method of claim 9 wherein the plating is selected from the group consisting of brush plating and brush electroplating. 11 . The method of claim 10 wherein the brush plating comprises a brush saturated with plating solution. 12 . The method of claim 11 wherein the brush is selected from the group consisting of stainless steel or graphite. 13 . The method of claim 12 wherein the brush is further wrapped with a cloth material that holds the plating solution and prevents direct contact with the part being plated. 14 . The method of claim 10 wherein the brush electroplating comprises a brush saturated with plating solution. 15 . The method of claim 11 wherein the brush is selected from the group consisting of stainless steel or graphite. 16 . The method of claim 12 wherein the brush is further wrapped with a cloth material that holds the plating solution and prevents direct contact with the part being plated. 17 . The method of claim 9 wherein the balancing weight is selected from the group consisting of metals, metal powder filled resins and polymers. 18 . A method for balancing a rotatable fan assembly, the method comprising: attaching a balancing weight to the fan assembly; rotating the fan assembly; and plating the fan assembly and the balancing weight to deposit a metal layer onto the balancing weight and fan assembly until the fan assembly is balanced. 19 . The method of claim 18 wherein the balancing weight is selected from the group consisting of metals, metal powder filled resins and polymers. 20 . The method of claim 18 wherein the plating is selected from the group consisting of brush plating and brush electroplating.

Assignees

Inventors

Classifications

  • with organic materials · CPC title

  • Specifications of the specimen · CPC title

  • 3D structures, e.g. superposed patterned layers · CPC title

  • for producing articles of definite length, i.e. discrete articles · CPC title

  • C25D5/06Primary

    Brush or pad plating · CPC title

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What does patent US2016145758A1 cover?
A method for balancing a rotatable component is disclosed This method comprises and then plating the component to deposit a metal layer onto the component until the component is balanced. In addition, and alternative method for balancing a rotatable component is disclosed. This method comprises attaching a balancing weight to the rotatable component and rotating the component. This is followed …
Who is the assignee on this patent?
United Technologies Corp
What technology area does this patent fall under?
Primary CPC classification C25D5/06. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Thu May 26 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).