Synthesis of superconducting nb-sn

Patent metadata

Field	Value
Publication number	US-2017107636-A1
Application number	US-201615204915-A
Country	US
Kind code	A1
Filing date	Jul 7, 2016
Priority date	Jul 8, 2015
Publication date	Apr 20, 2017
Grant date	—

Abstract

A method comprising:
electrodepositing a film comprising a Nb—Sn material onto a copper substrate surface from an electrolyte bath comprising (a) SnCl 2 , (b) NbCl 5 , and (c) (i) 1-Ethyl-3-methylimidazolium chloride (EMIC), (ii) 1-Butyl-3-methylimidazolium chloride (BMIC), or (iii) a mixture thereof.

First claim

What is claimed is:

1 . A method comprising:
electrodepositing a film comprising a Nb—Sn material onto a copper substrate surface from an electrolyte bath comprising (a) SnCl 2 , (b) NbCl 5 , and (c) (i) 1-Ethyl-3-methylimidazolium chloride (EMIC), (ii) 1-Butyl-3-methylimidazolium chloride (BMIC), or (iii) a mixture thereof.

2 . The method of claim 1 , wherein the bath comprises (a) SnCl 2 , (b) NbCl 5 , and (c) 1-Butyl-3-methylimidazolium chloride (BMIC).

3 . The method of claim 1 , wherein prior to initiation of electrodeposition (a) is present in an amount of 1 mol % to 50 mol %, (b) is present in an amount of 1 mol % to 50 mol %, and (c) is present in an amount of 1 to 99 mol %.

4 . The method of claim 1 , wherein the film comprises Nb 3 Sn.

5 . The method of claim 1 , wherein the electrodeposition occurs at 1 to 1000 mA/cm 2 and 0 to 150° C. for 1 to 7200 seconds.

6 . The method of claim 1 , wherein the Nb—Sn film has a structure of cubic Nb 3 Sn, orthorhombic NbSn 2 , η Cu 6 Sn 5 and ε Cu 3 Sn.

7 . A method comprising:
electrodepositing a seed copper layer onto a surface of a Nb substrate; electrodepositing a tin layer onto the seed copper layer; electrodepositing a copper barrier layer onto the tin layer to form an intermediate construct; and heating the intermediate construct to form a Nb 3 Sn coating.

8 . The method of claim 7 , wherein the heating of the intermediate construct is from 10 to 90° C.

9 . The method of claim 7 , wherein the Nb 3 Sn coating has a structure of cubic Nb 3 Sn, orthorhombic NbSn 2 , η Cu 6 Sn 5 and ε Cu 3 Sn.

Assignees

• Bestetti Massimiliano
• Franz Silvia
• Fermi Res Alliance Llc

Inventors

• Barzi Emanuela
• Bestetti Massimiliano
• Franz Silvia

Classifications

• C25D3/38

  of copper · CPC title

• C23C10/28

  using solids, e.g. powders, pastes · CPC title

• C22C1/00

  Making non-ferrous alloys (by electrothermic methods C22B4/00; by electrolysis C25C1/24, C25C3/36) · CPC title

• C22C27/02

  Alloys based on vanadium, niobium, or tantalum · CPC title

• C25D5/10

  Electroplating with more than one layer of the same or of different metals (for bearings C25D7/10) · CPC title