Pressure sensor and process of manufacturing said pressure sensor

Patent metadata

Field	Value
Publication number	US-2017030786-A1
Application number	US-201615221812-A
Country	US
Kind code	A1
Filing date	Jul 28, 2016
Priority date	Jul 31, 2015
Publication date	Feb 2, 2017
Grant date	—

Abstract

A pressure sensor includes a sensor assembly and an evaluation unit. The sensor assembly includes a sensor and an electrode arrangement. The sensor generates signals under the action of a pressure profile, and the electrode arrangement transmits the signals to the evaluation unit. The evaluation unit includes an electric circuit board that is connected to the electrode arrangement by material bonding.

First claim

1 . A pressure sensor comprising:
a sensor assembly that includes a sensor that is electrically connected to an electrode arrangement; and an evaluation unit that includes an electric circuit board that is connected by material bonding to the electrode arrangement; and wherein the sensor is configured to generate signals under the action of a pressure profile, and the electrode arrangement is configured to transmit the signals to the evaluation unit.

2 . The pressure sensor according to claim 1 , wherein each of the successive connections enabling the transmission of a signal from the electrode arrangement to the evaluation unit consists only of material bonding.

3 . The pressure sensor according to claim 1 , wherein each of a plurality of successive connections is configured and disposed to enable the transmission of a signal from the sensor to the evaluation unit via the electrode arrangement, and each of these successive connections consists only of material bonding.

4 . The pressure sensor according to claim 1 , wherein:
the pressure sensor is a piezoelectric pressure sensor; the sensor is a piezoelectric sensor; the piezoelectric sensor produces piezoelectric charges under the action of a pressure profile; and the electrode arrangement receives the piezoelectric charges from the piezoelectric sensor and transmits the received piezoelectric charges as signals to the evaluation unit.

5 . The pressure sensor according to claim 1 , wherein:
the electrode arrangement includes a charge output; and the electric circuit board includes an electrical connection element that is connected in certain areas by a material bond to the charge output.

6 . The pressure sensor according to claim 5 , wherein:
the charge output is shaped as a rod; and the electrode arrangement includes a cylindrically shaped charge pick-off that is formed integrally with the charge output.

7 . The pressure sensor according to claim 5 , wherein the charge output extends to an end of the sensor assembly that faces away from the piezoelectric sensor.

8 . The pressure sensor according to claim 1 , wherein:
the electric circuit board includes an electrical signal conductor, a high temperature region, and an electrical connection element arranged in the high temperature region; the electrode arrangement is joined with the electrical connection element in certain areas thereof; and the electrical connection element includes an adapter in the form of a socket that is connected in the high temperature region of the electric circuit board by material bonding to the electrical signal conductor of the electric circuit board.

9 . The pressure sensor according to claim 1 , wherein:
the electric circuit board includes a high temperature region and an electrical connection element arranged in the high temperature region; the electrode arrangement is joined with the electrical connection element in certain areas thereof; and the electrical connection element includes an annular adapter and a compensation element that is integrally formed with the annular adapter.

10 . The pressure sensor according to claim 1 , wherein:
the electric circuit board includes a high temperature region and an electrical connection element arranged in the high temperature region and defining a front end thereof; the electrode arrangement is joined with the electrical connection element in certain areas thereof; and the electrical connection element includes an annular adapter that is arranged at the front end of the electrical connection element.

11 . The pressure sensor according to claim 9 , wherein:
the compensation element includes at least one bend that is configured for compensating for at least one of:
differences in the thermal coefficients of linear expansion of signal transmitting components of the pressure sensor and
manufacturing tolerances along a longitudinal axis of components of the sensor assembly and the evaluation unit.

12 . The pressure sensor according to claim 9 , wherein:
the compensation element generally extends over the entire high temperature region of the electric circuit board and at least one opening is defined through the high temperature region of the electric circuit board; the compensation element includes at least one leg that is inserted into the at least one opening in the high temperature region of the electric circuit board to mechanically attach the high temperature region of the electric circuit board to the compensation element; and the at least one leg being configured to be elastically or plastically deformable upon being inserted in the at least one opening in the high temperature region of the electric circuit board.

13 . The pressure sensor according to claim 9 , wherein:
the electric circuit board includes a normal temperature region and an electrical signal conductor in the normal temperature region; and the compensation element is connected by material bonding to the electrical signal conductor of the electric circuit board in the normal temperature region of the electric circuit board.

14 . The pressure sensor according to claim 1 , wherein:
the electric circuit board includes electronic components, a high temperature region and a normal temperature region; and the electronic components of the electric circuit board are mounted only in the normal temperature region.

15 . The pressure sensor according to claim 1 , wherein:
the evaluation unit includes a reinforcement element that surrounds the electric circuit board and is connected to the electric circuit board in a mechanically detachable manner by at least one of form closure and force closure.

16 . The pressure sensor according to claim 1 , wherein:
the evaluation unit includes a reinforcement element that surrounds the electric circuit board and includes at least two shells; and at least one of the shells is connected to the electric circuit board in a mechanically detachable manner by at least one of form closure and force closure.

17 . A process for manufacturing a pressure sensor, the process comprising the steps of:
providing a sensor assembly as a semi-finished product that includes a sensor and an electrode arrangement; providing an evaluation unit as a semi-finished product that includes an electric circuit board; and using a material bond to join the electrode arrangement with certain areas of the electric circuit board.

18 . The process according to claim 17 , wherein:
the electric circuit board is enclosed by a reinforcement element that includes a window; and the material bond between the charge output and the electrical connecting element is made through the window.

19 . The process according to claim 17 , further comprising the steps of:
after making of the material bond between the electrode arrangement and the electric circuit board, an evaluation unit housing is moved against a sensor flange; and the evaluation unit housing is connected to the sensor flange in certain areas.

20 . The process according to claim 18 , further comprising the steps of:
after making of the material bond between the electrode arrangement and the electric circuit board, an evaluation unit housing is moved against a sensor flange; and the evaluation unit housing is connected to the sensor flange.

Assignees

• Kistler Holding Ag

Inventors

• Buck Reinhold
• Giger Martin
• Graf Philip

Classifications

• G01L19/0069

  from the sensor to its support · CPC title

• B23K20/02

  by means of a press {; Diffusion bonding} · CPC title

• G01L19/148

  Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation · CPC title

• G01L9/08 Primary

  by making use of piezoelectric devices {, i.e. electric circuits therefor} · CPC title

• B23K20/023

  Thermo-compression bonding · CPC title