Insulating busbar and manufacturing method

Patent metadata

Field	Value
Publication number	US-2017018884-A1
Application number	US-201615203755-A
Country	US
Kind code	A1
Filing date	Jul 6, 2016
Priority date	Jul 14, 2015
Publication date	Jan 19, 2017
Grant date	—

Abstract

To realize an insulating busbar that has both low inductance and high withstand voltage, provided is an insulating busbar that connects to a module on which is mounted a semiconductor chip, including a plurality of circuit conductors; a plurality of connection terminals that respectively electrically connect the circuit conductors to the module; and an insulating resin portion that is formed integrally between each of the circuit conductors and at least a portion of a region around each connection terminal and does not have any gaps between the circuit semiconductors.

First claim

What is claimed is:

1 . An insulating busbar that connects to a module on which is mounted a semiconductor chip, the insulating busbar comprising:
a plurality of circuit conductors; a plurality of connection terminals that respectively electrically connect the circuit conductors to the module; and an insulating resin portion that is formed integrally between each of the circuit conductors and at least a portion of a region around each connection terminal and does not have any gaps between the circuit semiconductors.

2 . The insulating busbar according to claim 1 , wherein
the resin portion has an uneven portion that expands a creepage distance between two of the connection terminals.

3 . The insulating busbar according to claim 2 , wherein
the uneven portion is provided between two of the connection terminals that are connected to different circuit conductors among the plurality of circuit conductors.

4 . The insulating busbar according to claim 3 , wherein
the resin portion does not include the uneven portion between at least two of the connection terminals.

5 . The insulating busbar according to claim 1 , wherein
at least one of the circuit conductors is covered by a material having a higher adhesiveness than nickel relative to the resin portion.

6 . The insulating busbar according to claim 1 , wherein
the resin portion is formed by a catalytic curing resin.

7 . The insulating busbar according to claim 1 , wherein
the resin portion is formed by a polyolefin resin or a maleimide resin.

8 . The insulating busbar according to claim 1 , wherein
each connection terminal includes an insertion hole through which a corresponding terminal is inserted and an elastic portion that presses the corresponding terminal inside the insertion hole.

9 . A method of manufacturing an insulating busbar, comprising:
arranging a plurality of circuit conductors and a plurality of connection terminals at predetermined positions within a resin injection mold; and forming a resin portion that does not have gaps around the plurality of circuit conductors and the plurality of connection terminals, by injecting insulating resin into the resin injection mold in a state where the absolute pressure inside the resin injection mold has been reduced to be less than or equal to 80 kPa.

10 . The method according to claim 9 , wherein
the forming the resin portion includes injecting the resin with a viscosity that is less than or equal to 10 Pa·s.

11 . The method according to claim 9 , wherein
the forming the resin portion includes using a tube to suck up the resin into the resin injection mold from a resin container provided below the resin injection mold.

12 . The method according to claim 9 , wherein
the resin injection mold includes position fixing protrusions that position the connection terminals by engaging with the connection terminals.

13 . The method according to claim 9 , wherein
the forming the resin portion includes forming, integrally with the resin portion, uneven portions that expand a creepage distance between the connection terminals.

Assignees

• Fuji Electric Co Ltd

Inventors

• Hayase Yuji
• Taniguchi Katsumi

Classifications

• H10W72/00 Primary

  Interconnections or connectors in packages · CPC title

• H05K7/1432

  specially adapted for power drive units or power converters · CPC title

• H01R43/24

  Assembling by moulding on contact members · CPC title

• H01R25/162

  Electrical connections between or with rails or bus-bars (rails having primarily a non electrical function H01R4/64) · CPC title

• H01R43/18 Primary

  for manufacturing bases or cases for contact members · CPC title