Methods of Forming a Mask for Substrate Patterning

Patent metadata

Field	Value
Publication number	US-2016377982-A1
Application number	US-201615188449-A
Country	US
Kind code	A1
Filing date	Jun 21, 2016
Priority date	Jun 24, 2015
Publication date	Dec 29, 2016
Grant date	—

Abstract

Patterning methods for creating features with sub-resolution dimensions that are self-aligned in photoresist materials. Techniques include selectably creating antispacers (or spacers) in soft materials, such as photoresist. A photoresist without a photo acid generator is deposited on a relief pattern of a solubility-neutralized photoresist material having a photo acid generator. A photomask then defines where photo acid is generated from a corresponding activating exposure. Photo acid is then diffused into the photoresist, that is free of the photo acid generator, to cause a solubility shift for subsequent development. These selectably-created antispacers can be line segments having widths defined by acid diffusion lengths, which can be widths of 1 nanometer to tens of nanometers. Moreover, the creation of antispacers, their location, and length, can be controlled using a photomask.

First claim

1 . A method of patterning a substrate, the method comprising:
receiving a substrate having a first relief pattern positioned on a target layer of the substrate, the first relief pattern including one or more structures positioned on the target layer such that portions of the target layer are covered and remaining portions of the target layer are uncovered, the first relief pattern having been at least partially created using a first photomask, the first relief pattern comprised of a first photoresist material that includes a generator compound that generates a solubility-changing agent in response to exposure to actinic radiation; executing a solubility-neutralizing treatment that prevents a subsequent change in solubility of the first relief pattern from actinic radiation; depositing an overcoat material on the substrate, the overcoat material at least filling spaces defined by the one or more structures of the first relief pattern, the overcoat material being free of the generator compound that generates the solubility-changing agent in response to exposure to actinic radiation; transferring the substrate to a photolithographic system that exposes selected portions of the first relief pattern to actinic radiation using a second photomask, the actinic radiation causing the selected portions of the first relief pattern to generate the solubility-changing agent from the generator compound; and causing the solubility-changing agent to diffuse from the selected portions of the first relief pattern into the overcoat material at interfaces between the selected portions of first relief pattern and the overcoat material, the solubility-changing agent changing a solubility of portions of the overcoat material having received sufficient solubility-changing agent.

2 . The method of claim 1 , further comprising:
removing soluble portions of the overcoat material subsequent to diffusion of the solubility-changing agent.

3 . The method of claim 2 , further comprising:
transferring a first combined pattern defined by both the first relief pattern and the overcoat material into the target layer.

4 . The method of claim 2 , further comprising:
transferring a portion of a first combined pattern, defined by both the first relief pattern and the overcoat material, into the target layer by using a keep mask or a defeat mask.

5 . The method of claim 1 , wherein changing a solubility of portions of the overcoat material having received the solubility-changing agent includes the portions of the overcoat material having received the solubility-changing agent becoming soluble in the presence of photo acid.

6 . The method of claim 1 , wherein changing a solubility of portions of the overcoat material having received the solubility-changing agent includes the portions of the overcoat material having received the solubility-changing agent becoming insoluble in the presence of photo destructive base.

7 . The method of claim 1 , wherein causing the solubility-changing agent to diffuse into the overcoat material includes thermally activating diffusion.

8 . The method of claim 7 , wherein causing the solubility-changing agent to diffuse into the overcoat material includes controlling an average diffusion length into the overcoat material.

9 . The method of claim 8 , wherein thermally activating diffusion includes heating the substrate at a predetermined temperature and for a predetermined duration.

10 . The method of claim 1 , wherein executing the solubility-neutralizing treatment includes treating the first relief pattern with a flux of ballistic electrons.

11 . The method of claim 1 , wherein executing the solubility-neutralizing treatment includes creating a conformal film on the first relief pattern having a thickness less than a diffusion-blocking thickness such that the conformal film permits diffusion of the solubility-changing agent.

12 . The method of claim 1 , wherein executing the solubility-neutralizing treatment includes executing a photoresist freeze treatment.

13 . The method of claim 1 , wherein the overcoat material includes a deprotection group that causes the overcoat material to become soluble in the presence of photo acid.

14 . The method of claim 1 , wherein depositing the overcoat material results in an overburden on the first relief pattern.

15 . The method of claim 1 , wherein the generator compound is a photo acid generator (PAG) that generates photo acid in response to exposure to actinic radiation.

16 . The method of claim 1 , wherein the generator compound is a photo destructive base generator that generates photo destructive base in response to exposure to actinic radiation.

17 . The method of claim 1 , further comprising:
prior to transferring the substrate to a photolithographic system, executing an overburden removal process that removes a vertical portion of the overcoat material resulting in top surfaces of the first relief pattern being uncovered.

18 . The method of claim 1 , further comprising:
executing a shrink operation that adjusts critical dimensions of the first relief pattern prior to depositing the overcoat material.

19 . A method of patterning a substrate, the method comprising:
receiving a substrate having a first relief pattern positioned on a target layer of the substrate, the first relief pattern including one or more structures positioned on the target layer such that portions of the target layer are covered and remaining portions of the target layer are uncovered, the first relief pattern having been at least partially created using a first photomask, the first relief pattern comprised of a first polymer material that includes a generator compound that generates a solubility-changing agent in response to exposure to actinic radiation; executing a solubility-neutralizing treatment that prevents a subsequent change in solubility of the first relief pattern from actinic radiation; depositing a second polymer material on the substrate, the second polymer material at least filling spaces defined by the one or more structures of the first relief pattern, the second polymer material being free of the generator compound that generates the solubility-changing agent in response to exposure to actinic radiation; exposing selected portions of the first relief pattern to actinic radiation using a second photomask, the actinic radiation causing the selected portions of the first relief pattern to generate the solubility-changing agent from the generator compound; and causing the solubility-changing agent to diffuse from the selected portions of the first relief pattern into the second polymer material at interfaces between the selected portions of first relief pattern and the second polymer material, the solubility-changing agent changing a solubility of portions of the second polymer material having received sufficient solubility-changing agent.

Assignees

• Tokyo Electron Ltd

Inventors

• Devilliers Anton J

Classifications

• G03F7/11

  having cover layers or intermediate layers, e.g. subbing layers {(G03F7/091 - G03F7/093, B41N3/03 take precedence)} · CPC title

• G03F7/40 Primary

  Treatment after imagewise removal, e.g. baking · CPC title

• G03F7/32

  Liquid compositions therefor, e.g. developers · CPC title

• G03F7/2022 Primary

  Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure · CPC title

• G03F7/2024

  of the already developed image · CPC title