Method for manufacturing ceramic electronic component, and ceramic electronic component

Patent metadata

Field	Value
Publication number	US-2016372255-A1
Application number	US-201615175655-A
Country	US
Kind code	A1
Filing date	Jun 7, 2016
Priority date	Jun 16, 2015
Publication date	Dec 22, 2016
Grant date	—

Abstract

A manufacturing method that is capable of forming an electrode on any part of a surface of a sintered ceramic body in accordance with a simple approach, and a ceramic electronic component manufactured by the method. The method for manufacturing a ceramic electronic component includes steps of preparing a sintered ceramic body containing a metal oxide, irradiating an electrode formation region on a surface of the ceramic body with a laser to partially lower resistance of the ceramic body, thereby forming a low-resistance portion, and subjecting the ceramic body to plating to deposit a plated metal serving as an electrode on the low-resistance portion, and growing the plated metal to extend over the entire electrode formation region.

First claim

What is claimed is:

1 . A method for manufacturing a ceramic electronic component, the method comprising the steps of:
preparing a sintered ceramic body containing a metal oxide; locally heating an electrode formation region on a surface of the ceramic body to partially lower resistance of the ceramic body, thereby forming a low-resistance portion; and subjecting the ceramic body to plating to deposit a plated metal serving as an electrode on the low-resistance portion, and causing a growth of the plated metal to extend over the entire electrode formation region.

2 . The method for manufacturing the ceramic electronic component according to claim 1 , wherein the low-resistance portion includes a reduced layer obtained by partially reducing the metal oxide contained in the ceramic body.

3 . The method for manufacturing the ceramic electronic component according to claim 2 , wherein a surface layer of the reduced layer is covered with a reoxidized layer.

4 . The method for manufacturing the ceramic electronic component according to claim 1 , wherein the local heating is any one of laser irradiation, electron beam irradiation, and local heating with an image furnace.

5 . The method for manufacturing the ceramic electronic component according to claim 4 ,
wherein more than one site in the electrode formation region is irradiated with a laser at a predetermined distance, thereby dispersedly forming more than one low-resistance portion in the electrode formation region, and plated metals deposited on the low-resistance portions are grown with the plated metals as nuclei, and the plating is continued until the plated metals are connected to each other.

6 . The method for manufacturing the ceramic electronic component according to claim 4 ,
wherein the electrode formation region is densely irradiated with a laser to form the continuous low-resistance portion in the electrode formation region, and the plated metal deposited on the low-resistance portion is grown with the plated metal as a nucleus, and the plating is continued until the plated metal extends over the entire electrode formation region.

7 . The method for manufacturing the ceramic electronic component according to claim 1 , wherein an electrolytic plating method is used for the plating.

8 . The method for manufacturing the ceramic electronic component according to claim 1 , wherein the ceramic body includes ferrite.

9 . The method for manufacturing the ceramic electronic component according to claim 8 ,
wherein the ceramic body includes Ni—Zn based ferrite, and the low-resistance portion is formed by partially reducing Fe contained in the ferrite.

10 . The method for manufacturing the ceramic electronic component according to claim 8 ,
wherein the ceramic body includes Ni—Cu—Zn based ferrite, and the low-resistance portion is formed by partially reducing at least one of Fe and Cu contained in the ferrite.

11 . A ceramic electronic component comprising:
a sintered ceramic body containing a metal oxide; a low-resistance portion formed on a surface of the ceramic body, and having resistance lowered by partially modifying the metal oxide; and an electrode including a plated metal formed on the low-resistance portion.

12 . The ceramic electronic component according to claim 11 , wherein the low-resistance portion includes a reduced layer obtained by partially reducing the metal oxide contained in the ceramic body.

13 . The ceramic electronic component according to claim 12 , wherein a surface layer of the reduced layer is covered with a reoxidized layer.

14 . The ceramic electronic component according to claim 11 , wherein the ceramic body includes ferrite.

15 . The ceramic electronic component according to claim 11 ,
wherein the ceramic body has a rectangular parallelepiped shape, an internal electrode is provided in the ceramic body, an end of the internal electrode is exposed on any surface of the ceramic body, the low-resistance portion is formed on the surface on which the end of the internal electrode is exposed, and an external electrode serving as the electrode is formed on the low-resistance portion so as to cover the end of the internal electrode.

16 . The ceramic electronic component according to claim 11 ,
wherein the ceramic body is a ferrite core including flanges at both ends, and a winding core therebetween, the low-resistance portion that is a coil-shaped low-resistance portion is formed on a peripheral surface of the winding core, low-resistance portions connected to the coil-shaped low-resistance portion are formed on surfaces of the flanges, and an electrode including the plated metal is continuously formed on the low-resistance portions of the flanges and the coil-shaped low-resistance portion.

17 . The ceramic electronic component according to claim 16 ,
wherein the electrode formed on the coil-shaped low-resistance portion is larger in film thickness, as compared with the electrode formed on the low-resistance portions of the flanges.

18 . The ceramic electronic component according to claim 11 ,
wherein the ceramic body is a ferrite core including flanges at both ends, and a winding core therebetween, a wire is wound around a peripheral surface of the winding core, the low-resistance portion is formed on each of surfaces of the flanges, electrodes including the plated metal are formed on each of the low-resistance portions of the flanges, and the electrodes are connected to both ends of the wire.

Assignees

• Murata Manufacturing Co

Inventors

• Maki Yoshifumi
• Ishida Takuya
• Tomioka Hirotsugu
• Hirai Shinya
• Katayama Daisuke

Classifications

• H01F17/0006 Primary

  Printed inductances (printed coils for dynamo-electric machines H02K3/26; printed circuits H05K) · CPC title

• H01F2027/2809

  on stacked layers · CPC title

• H01F41/041 Primary

  Printed circuit coils (apparatus or processes for manufacturing printed circuits in general H05K3/00) · CPC title

• H01F27/2804 Primary

  Printed windings · CPC title

• H01F27/24

  Magnetic cores · CPC title