Flip-chip assembly process comprising pre-coating interconnect elements
US-2015380395-A1 · Dec 31, 2015 · US
of strap connectors
of strap connectors · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W72/016 |
| Official title | {of strap connectors} |
| Display label | of strap connectors |
| Total patents | 708 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 61 |
| 2016 | 63 |
| 2017 | 72 |
| 2018 | 44 |
| 2019 | 54 |
| 2020 | 77 |
| 2021 | 91 |
| 2022 | 64 |
| 2023 | 64 |
| 2024 | 55 |
| 2025 | 49 |
| 2026 | 14 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Method for manufacturing a semiconductor device having multiple heat sinks
US-9224711-B2 · Dec 29, 2015 · US
3D bond and assembly process for severely bowed interposer die
US-9224712-B2 · Dec 29, 2015 · US
Terminal structure, semiconductor device, and terminal forming method
US-2015371962-A1 · Dec 24, 2015 · US
Bonding Package Components Through Plating
US-2015364449-A1 · Dec 17, 2015 · US
Semiconductor circuit and method for producing the semiconductor circuit
US-2015357303-A1 · Dec 10, 2015 · US
Semiconductor substrate, semiconductor device, imaging element, and imaging device
US-2015357300-A1 · Dec 10, 2015 · US
Electronic component mounting device
US-9210836-B2 · Dec 8, 2015 · US
Semiconductor Module
US-2015342074-A1 · Nov 26, 2015 · US
Package structure and manufacturing method thereof
US-2015325762-A1 · Nov 12, 2015 · US
Semiconductor Module
US-2015289369-A1 · Oct 8, 2015 · US
Lead for connection to a semiconductor device
US-2015287666-A1 · Oct 8, 2015 · US
Novel 3D Integration Method using SOI Substrates and Structures Produced Thereby
US-2015270172-A1 · Sep 24, 2015 · US
Semiconductor Module
US-2015270199-A1 · Sep 24, 2015 · US
Power Semiconductor Package with Conductive Clips
US-2015262960-A1 · Sep 17, 2015 · US
Electromagnetic field assisted self-assembly with formation of electrical contacts
US-9137935-B2 · Sep 15, 2015 · US
Semiconductor device and method for manufacturing same
US-9129840-B2 · Sep 8, 2015 · US
Thermocompression bonding systems and methods of operating the same
US-2015249027-A1 · Sep 3, 2015 · US
Reflow Process and Tool
US-2015249062-A1 · Sep 3, 2015 · US
Semiconductor device and method of manufacturing the same
US-9123709-B2 · Sep 1, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W72/016?
- CPC H10W72/016 is the Cooperative Patent Classification code for “of strap connectors.”
- How many patents are filed under CPC H10W72/016 (of strap connectors)?
- Our database includes 708 publications tagged with this CPC code.
- Is patent activity under CPC H10W72/016 growing?
- Publication counts under this code: 55 in 2024 vs 49 in 2025 (latest complete years).