Phosphor with preferred orientation, fabricating method thereof, and light-emitting element package structure employing the same

Patent metadata

Field	Value
Publication number	US-2016359090-A1
Application number	US-201615162531-A
Country	US
Kind code	A1
Filing date	May 23, 2016
Priority date	Jun 4, 2015
Publication date	Dec 8, 2016
Grant date	—

Abstract

The present invention provides a phosphor with a preferred orientation represented by the following formula: A 2 [MF 6 ]:Mn 4+ , wherein A is selected from a group consisting of Li, Na, K, Rb, Cs, and NH 4 , M is selected from a group consisting of Ge, Si, Sn, Ti, and Zr. The preferred orientation is a (001)/(011) preferred orientation. The present invention also provides a method for fabricating the above phosphor. The present invention further provides a light-emitting element package structure employing the same.

First claim

What is claimed is:

1 . A phosphor with a preferred orientation represented by the following formula:
A 2 [MF 6 ]:Mn 4+ , wherein A is selected from a group consisting of Li, Na, K, Rb, Cs, and NH 4 , M is selected from a group consisting of Ge, Si, Sn, Ti, and Zr, wherein the preferred orientation is a (001)/(011) preferred orientation.

2 . The phosphor with a preferred orientation as claimed in claim 1 , wherein the formula is K 2 [TiF 6 ]:Mn 4+ .

3 . The phosphor with a preferred orientation as claimed in claim 1 , wherein the (001)/(011) preferred orientation is greater than 10.

4 . The phosphor with a preferred orientation as claimed in claim 1 , wherein the phosphor emits a red light having a peak wavelength in a range of about 600 nm to about 650 nm after being excited by a light having a peak wavelength in a range of about 300 nm to about 470 nm.

5 . A method for fabricating a phosphor with a preferred orientation, comprising:
(a) providing a first solution, the first solution is formed by dissolving a hydrofluoride of A and one of K 2 MnF 6 and KMnO 4 in a hydrofluoric acid solution, wherein A is selected from a group consisting of Li, Na, K, Rb, Cs, and NH 4 ; (b) providing a second solution, the second solution is formed by dissolving a surfactant and an alkoxide precursor of M in a solvent at room temperature, wherein M is selected from a group consisting of tetravalent elements of Ge, Si, Sn, Ti, and Zr; (c) mixing the first solution and the second solution to form a precipitation; and (d) collecting the precipitation after step (c).

6 . The method for fabricating the phosphor with a preferred orientation as claimed in claim 5 , wherein the method is performed at a temperature in a range of about 0° C. to about 50° C.

7 . The method for fabricating the phosphor with a preferred orientation as claimed in claim 5 , wherein the molarity of the hydrofluoride of A in the first solution is in a range of about 0.4 mol/L to about 1.35 mol/L.

8 . The method for fabricating the phosphor with a preferred orientation as claimed in claim 5 , wherein the molarity of the surfactant in the second solution is in a range of about 0.5 mol/L to about 10 mol/L based on the total volume of the solvent.

9 . The method for fabricating the phosphor with a preferred orientation as claimed in claim 5 , wherein the solvent comprises isopropanol, methanol, ethanol, acetone, or a combination thereof.

10 . The method for fabricating the phosphor with a preferred orientation as claimed in claim 5 , wherein the surfactant comprises a cationic surfactant, an anionic surfactant, a nonionic surfactant, or a combination thereof.

11 . The method for fabricating the phosphor with a preferred orientation as claimed in claim 10 , wherein the cationic surfactant comprises cetrimonium bromide (CTAB; (C 16 H 33 )N(CH 3 ) 3 Br), the anionic surfactant comprises sodium dodecyl sulfate (SDS; NaC 12 H 25 SO 4 ), and the nonionic surfactant comprises oleic acid (C 18 H 34 O 2 ) or polyvinylpyrrolidone (PVP; (C 6 H 9 NO) n ).

12 . The method for fabricating the phosphor with a preferred orientation as claimed in claim 5 , wherein the surfactant is sodium dodecyl sulfate (SDS; NaC 12 H 25 SO 4 ) and the alkoxide precursor of M is titanium isopropoxide (TiC 12 H 28 O 4 ).

13 . The method for fabricating the phosphor with a preferred orientation as claimed in claim 12 , wherein the preferred orientation is a (001)/(011) preferred orientation.

14 . The method for fabricating the phosphor with a preferred orientation as claimed in claim 5 , wherein the phosphor emits a red light having a peak wavelength in a range of about 600 nm to about 650 nm after being excited by a light having a peak wavelength in a range of about 300 nm to about 470 nm.

15 . A light-emitting element package structure, comprising:
a base; a light-emitting diode chip disposed in the base; a fluorescent layer covering the light-emitting diode chip, wherein a phosphor with a preferred orientation is dispersed in the fluorescent layer; and a conductive structure electrically connected to the light-emitting diode chip, a first electrode, and a second electrode, wherein the phosphor with a preferred orientation is formed by the method as claimed in claim 5 .

16 . The light-emitting element package structure as claimed in claim 15 , further comprising a yellow light-emitting phosphor or a green light-emitting phosphor dispersed in the fluorescent layer.

17 . The light-emitting element package structure as claimed in claim 15 , further comprising a second fluorescent layer disposed above the light-emitting diode chip, wherein a yellow light-emitting phosphor or a green light-emitting phosphor is dispersed in the second fluorescent layer.

18 . The light-emitting element package structure as claimed in claim 15 , wherein the light-emitting element package structure comprises a plastic leaded chip carrier (PLCC), a chip scale package (CSP), an emitter package, a remote-type package, or a white well-type package.

19 . A light-emitting element package structure, comprising
a base; a light-emitting diode chip disposed in the base; a fluorescent layer covering the light-emitting diode chip, wherein a phosphor with a preferred orientation is dispersed in the fluorescent layer; and a conductive structure electrically connected to the light-emitting diode chip, a first electrode, and a second electrode, wherein the phosphor with a preferred orientation is the phosphor with a preferred orientation as claimed in claim 1 .

20 . The light-emitting element package structure as claimed in claim 19 , further comprising a yellow light-emitting phosphor or a green light-emitting phosphor dispersed in the fluorescent layer.

21 . The light-emitting element package structure as claimed in claim 19 , further comprising a second fluorescent layer disposed above the light-emitting diode chip, wherein a yellow light-emitting phosphor or a green light-emitting phosphor is dispersed in the second fluorescent layer.

22 . The light-emitting element package structure as claimed in claim 19 , wherein the light-emitting element package structure comprises a plastic leaded chip carrier (PLCC), a chip scale package (CSP), an emitter package, a remote-type package, or a white well-type package.

Assignees

• Lextar Electronics Corp

Inventors

• Nguyen Hoang Duy
• Wang Ren Hong
• Su Chaochin
• Liu Ru-Shi
• Chen Ching-Yi
• Lee Yu-Chun
• Tsai Tzong-Liang

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/726

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• C09K11/59

  containing silicon · CPC title

• C09K11/66 Primary

  containing germanium, tin or lead · CPC title