Phosphor with preferred orientation, fabricating method thereof, and light-emitting element package structure employing the same

Patent metadata

Field	Value
Publication number	US-10020430-B2
Application number	US-201615162531-A
Country	US
Kind code	B2
Filing date	May 23, 2016
Priority date	Jun 4, 2015
Publication date	Jul 10, 2018
Grant date	Jul 10, 2018

Abstract

The present invention provides a phosphor with a preferred orientation represented by the following formula: A 2 [MF 6 ]:Mn 4+ , wherein A is selected from a group consisting of Li, Na, K, Rb, Cs, and NH 4 , M is selected from a group consisting of Ge, Si, Sn, Ti, and Zr. The preferred orientation is a (001)/(011) preferred orientation. The present invention also provides a method for fabricating the above phosphor. The present invention further provides a light-emitting element package structure employing the same.

First claim

What is claimed is:

1. A phosphor with a preferred orientation represented by the following formula:
A 2 [MF 6 ]:Mn 4+ ,
wherein A is selected from a group consisting of Li, Na, K, Rb, Cs, and NH 4 , M is selected from a group consisting of Ge, Si, Sn, Ti, and Zr, wherein an intensity measured by an X-ray powder diffractometer of (001) oriented crystal surfaces is greater than that of (011) oriented crystal surfaces in the preferred orientation of the phosphor.

2. The phosphor with a preferred orientation as claimed in claim 1 , wherein the formula is K 2 [TiF 6 ]:Mn 4+ .

3. The phosphor with a preferred orientation as claimed in claim 1 , wherein a ratio of the intensity measured by an X-ray powder diffractometer of (001) oriented crystal surfaces relative to (011) oriented crystal surfaces in the preferred orientation of the phosphor is greater than 10.

4. The phosphor with a preferred orientation as claimed in claim 1 , wherein the phosphor emits a red light having a peak wavelength in a range of about 600 nm to about 650 nm after being excited by a light having a peak wavelength in a range of about 300 nm to about 470 nm.

5. A light-emitting element package structure, comprising
a base;
a light-emitting diode chip disposed in the base;
a fluorescent layer covering the light-emitting diode chip, wherein a phosphor with a preferred orientation is dispersed in the fluorescent layer; and
a conductive structure electrically connected to the light-emitting diode chip, a first electrode, and a second electrode,
wherein the phosphor with a preferred orientation is the phosphor with a preferred orientation as claimed in claim 1 .

6. The light-emitting element package structure as claimed in claim 5 , further comprising a yellow light-emitting phosphor or a green light-emitting phosphor dispersed in the fluorescent layer.

7. The light-emitting element package structure as claimed in claim 5 , further comprising a second fluorescent layer disposed above the light-emitting diode chip, wherein a yellow light-emitting phosphor or a green light-emitting phosphor is dispersed in the second fluorescent layer.

8. The light-emitting element package structure as claimed in claim 5 , wherein the light-emitting element package structure comprises a plastic leaded chip carrier (PLCC), a chip scale package (CSP), an emitter package, a remote-type package, or a white well-type package.

Assignees

• Lextar Electronics Corp

Inventors

• Nguyen Hoang Duy
• Wang Ren Hong
• Su Chaochin
• Liu Ru-Shi
• Chen Ching-Yi
• Lee Yu-Chun
• Tsai Tzong-Liang

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/726

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• C09K11/66 Primary

  containing germanium, tin or lead · CPC title

• C09K11/60

  containing iron, cobalt or nickel · CPC title