Apparatus of alligning substrate and method of alligning substrate

Patent metadata

Field	Value
Publication number	US-2016356597-A1
Application number	US-201514935207-A
Country	US
Kind code	A1
Filing date	Nov 6, 2015
Priority date	Jun 2, 2015
Publication date	Dec 8, 2016
Grant date	—

Abstract

An apparatus and a method for aligning a substrate are disclosed. In one aspect, the substrate aligning apparatus includes a stage configured to support a plurality of substrates, a supporting pin placed in the stage to support the substrates and an alignment clamp configured to respectively move each of the substrates to align the substrates. The alignment clamp can respectively align at least two of the substrates with reference, to an alignment reference position as a two-dimensional coordinate system which includes a first axis and a second axis crossing the first axis and is set on an imaginary plane by the first and second axes.

First claim

What is claimed is:

1 . A substrate aligning apparatus comprising:
a stage configured to support a plurality of substrates; a supporting pin placed in the stage to support the substrates; and an alignment clamp configured to respectively move each of the substrates to align the substrates, wherein the alignment clamp is further configured to respectively align at least two of the substrates with reference to an alignment reference position as a two-dimensional coordinate system which includes a first axis and a second axis crossing the first axis and is set on an imaginary plane by the first and second axes.

2 . The substrate aligning apparatus of claim 1 , wherein the stage is placed so that an upper surface is substantially parallel to the imaginary plane.

3 . The substrate aligning apparatus of claim 1 , wherein the supporting pin is configured to respectively support a lower portion of the substrates.

4 . The substrate aligning apparatus of claim 3 , wherein the supporting pin comprises a plurality of supporting pins that are respectively configured to rise and fall toward the substrates with reference to the stage.

5 . The substrate aligning apparatus of claim 1 , wherein the alignment clamp is configured to move on the stage to clamp and fix a portion of at least one of the substrates, and wherein a moving trajectory of the substrate by the alignment clamp is substantially parallel to the imaginary plane.

6 . The substrate aligning apparatus of claim 5 , wherein the alignment clamp includes
a first clamp configured to axially align the clamped substrate with reference to the first axis; and a second clamp configured to axially align the clamped substrate with reference to the second axis.

7 . A method for aligning a substrate comprising:
mounting a plurality of substrates on a stage; aligning the substrates with reference to an alignment reference position as a two-dimensional coordinate system which includes a first axis and a second axis crossing the first axis and is set on an imaginary plane by the first and second axes; and testing the alignment of the substrates.

8 . The method of claim 7 , further comprising, after at least one of the substrates is mounted on a supporting pin installed on the stage, lowering the supporting pin and the substrate toward the upper surface of the stage.

9 . The method of claim 7 , further comprising clamping and fix a portion of at least one of the substrates.

10 . The method of claim 9 , wherein the aligning includes
first axially aligning the clamped substrate with reference to the first axis; and second axially aligning the clamped substrate with reference to the second axis.

11 . The method of claim 10 , wherein the first axially aligning and the second axially aligning are simultaneously or concurrently performed.

12 . The method of claim 9 , wherein a moving trajectory of the clamped substrate is substantially parallel to the imaginary plane.

13 . The method of claim 9 , wherein the aligning comprises performing a fine alignment for the clamped substrate to be substantially parallel to the imaginary plane.

14 . The method of claim 7 , wherein the aligning comprises detecting an alignment mark formed in the clamped substrate.

15 . A substrate aligning apparatus comprising:
a stage configured to support a plurality of substrates; and an alignment clamp configured to respectively move each of the substrates to align the substrates, wherein the alignment clamp is configured to respectively align at least two of the substrates with reference to an alignment reference position as a two-dimensional coordinate system which includes a first axis and a second axis crossing the first axis and is set on an imaginary plane by the first and second axes.

16 . The substrate aligning apparatus of claim 15 , further comprising a supporting pin placed in the stage to support the substrates.

17 . The substrate aligning apparatus of claim 16 , wherein the supporting pin is configured to respectively support a lower portion of the substrates.

18 . The substrate aligning apparatus of claim 16 , wherein the supporting pin comprises a plurality of supporting pins that are respectively configured to rise and fall toward the substrates with reference to the stage.

19 . The substrate aligning apparatus of claim 15 , wherein the alignment clamp is configured to move on the stage to clamp and fix a portion of at least one of the substrates.

20 . The substrate aligning apparatus of claim 19 , wherein the alignment clamp includes
a first clamp configured to axially align the clamped substrate with reference to the first axis; and a second clamp configured to axially align the clamped substrate with reference to the second axis.

Assignees

• Samsung Display Co Ltd

Inventors

• Park Jin Wan
• Park Ji Hwan

Classifications

• H10P74/203

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• H10P72/7621

  characterised by supporting two or more semiconductor substrates · CPC title

• H10P72/7608

  characterised by a plurality of separate clamping members, e.g. clamping fingers · CPC title

• H10P72/0606

  Position monitoring, e.g. misposition detection or presence detection · CPC title

• H10P72/50 Primary

  for positioning, orientation or alignment · CPC title