Reflow oven liner, system and method

Patent metadata

Field	Value
Publication number	US-2016339486-A1
Application number	US-201615153349-A
Country	US
Kind code	A1
Filing date	May 12, 2016
Priority date	May 21, 2015
Publication date	Nov 24, 2016
Grant date	—

Abstract

A liner for contamination control in a reflow oven, which reflow oven has surfaces, includes a substrate having a length and a width defining an area. The substrate has a thickness defined by first and second sides. An adhesive is positioned on the first side of the substrate. The substrate is removably adhered to the surfaces of the reflow oven, and the liner is configured to accumulate solder reflow contaminants thereon or to repel solder flux vapors and/or fumes, and is configured for removal from the surfaces with any accumulated contaminants. A method of treating the surfaces of a reflow oven is also disclosed.

First claim

1 . A liner for contamination control in a reflow oven, the reflow oven having surfaces, comprising:
a substrate having a length and a width defining an area, the substrate having a thickness, the substrate having first and second sides; and an adhesive positioned on the first side of the substrate, wherein the substrate is removably adhered to the surfaces of the reflow oven, the liner configured to accumulate solder reflow contaminants thereon and configured for removal from the surfaces with the accumulated contaminants.

2 . The liner of claim 1 wherein the liner is in the form of a strip of material removably adhered to the surfaces.

3 . The liner of claim 2 wherein the adhesive is present as strip positioned longitudinally along a length of the strip of material.

4 . The liner of claim 3 wherein the adhesive is positioned longitudinally along the strip of material parallel to longitudinal axis of the strip of material.

5 . The liner of claim 4 wherein three strips of adhesive are positioned along the strip of material, wherein two of the strips of adhesive are positioned at about outer edges of the strip and a third strip of adhesive is positioned therebetween.

6 . The liner of claim 1 wherein the substrate is formed from a heat tolerant material compatible with reflow oven temperatures up to and including about 220° C.

7 . The liner of claim 6 wherein the adhesive is formed from a heat tolerant material compatible with reflow oven temperatures up to and including about 220° C.

8 . The liner of claim 7 wherein the adhesive is non-curing up to the reflow oven temperature of about 220° C., such that the adhesive does not set-up or cure and is readily removable from the surfaces.

9 . The liner of claim 1 including a contaminant absorbing material positioned on the second side of the substrate.

10 . The liner of claim 9 wherein the contaminant absorbing material is formed from a heat tolerant material compatible with reflow oven temperatures up to and including about 220° C.

11 . The liner of claim 1 wherein the adhesive covers less than an entirety of the first side.

12 . A liner for contamination control in a reflow oven, the reflow oven having surfaces, comprising:
a substrate having a length and a width defining an area, the substrate having a thickness, the substrate having first and second sides; and an adhesive positioned on the first side of the substrate, wherein the substrate is removably adhered to the surfaces of the reflow oven, the liner including a flux vapor and fume repelling material on the second side of the substrate and configured for removal from the surfaces of the reflow oven.

13 . A method for treating the surfaces of a reflow oven, the reflow oven having surfaces, comprising:
applying a substrate having a length and a width defining an area, the substrate having a thickness, the substrate having first and second sides on a surface of the reflow oven, the substrate being formed from a heat tolerant material compatible with reflow oven temperatures up to and including about 220° C.; and adhering the substrate to the surface using a heat tolerant adhesive compatible with reflow oven temperatures up to and including about 220° C.

14 . The method of claim 13 wherein the substrate is applied in strips.

15 . The method of claim 15 wherein multiple strips of substrate are applied to the surfaces.

16 . The method of claim 15 wherein edges of the strips overlap edges of adjacent strips.

17 . The method of claim 12 , wherein the substrate includes a contaminant absorbing material on a side opposite of the adhesive, the absorbent material configured to accumulate solder reflow contaminants thereon and wherein the substrate and contaminant absorbing material are configured for removal from the surfaces with the accumulated contaminants.

18 . The method of claim 13 wherein the substrate includes a flux vapor and fume repelling material on a side opposite of the adhesive.

19 . The method of claim 13 wherein the adhesive is discontinuously applied to the substrate.

20 . The method of claim 13 wherein the adhesive is applied to less than an entirety of the first side of the substrate.

Assignees

• Illinois Tool Works

Inventors

• Blair Paul M
• Bailey Elizabeth B

Classifications

• H10P72/3314

  Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers · CPC title

• H10P72/0456

  in-line arrangement · CPC title

• H10P72/0434 Primary

  mainly by convection · CPC title

• F27D7/04

  Circulating atmospheres by mechanical means · CPC title

• F27D9/00

  Cooling of furnaces or of charges therein (casings, linings, walls or roofs incorporating cooling arrangements F27D1/12) · CPC title