Absorbing lamphead face

US2016336205A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016336205-A1
Application numberUS-201615220974-A
CountryUS
Kind codeA1
Filing dateJul 27, 2016
Priority dateApr 26, 2013
Publication dateNov 17, 2016
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The embodiments described herein generally relate to a lamphead assembly with an absorbing upper surface in a thermal processing chamber. In one embodiment, a processing chamber includes an upper structure, a lower structure, a base ring connecting the upper structure to the lower structure, a substrate support disposed between the upper structure and the lower structure, a lower structure disposed below the substrate support, a lamphead positioned proximate to the lower structure with one or more fixed lamphead positions formed therein, the lamphead comprising a first surface proximate the lower structure and a second surface opposite the first surface, wherein the first surface comprises an absorptive coating and one or more lamp assemblies each comprising a radiation generating source and positioned in connection with the one or more fixed lamphead positions.

First claim

Opening claim text (preview).

1 . A lamphead, comprising: a radiation source structure, the radiation source structure comprising a first surface with an absorptive coating; and one or more radiation source positions formed in the radiation source structure, wherein the one or more radiation source positions increase in depth extending from an inner radius to an outer radius. 2 . The lamphead of claim 1 , wherein the absorptive coating is a carbon black paint. 3 . The lam phead of claim 1 , wherein the radiation source structure is conical. 4 . The lamphead of claim 1 , wherein the radiation source structure is water cooled. 5 . The lamphead of claim 1 , further comprising a printed circuit board disposed adjacent a second surface, wherein the second surface is opposite the first surface. 6 . The lamphead of claim 1 , wherein the radiation source structure comprises aluminum or copper. 7 . The lamphead of claim 1 , wherein the absorptive coating has a variety of thicknesses across the first surface. 8 . A lamphead, comprising: a conical radiation source structure, the radiation source structure comprising a first surface with an absorptive coating; one or more radiation source positions formed in the radiation source structure, wherein the one or more radiation source positions increase in depth extending from an inner radius to an outer radius; and one or more channels disposed between the one or more radiation source positions. 9 . The lamphead of claim 8 , wherein the absorptive coating is a carbon black paint. 10 . The lamphead of claim 8 , wherein the radiation source structure is water cooled. 11 . The lamphead of claim 8 , further comprising a printed circuit board disposed adjacent a second surface, wherein the second surface is opposite the first surface. 12 . The lamphead of claim 8 , wherein the radiation source structure comprises aluminum or copper. 13 . The lamphead of claim 8 , wherein the absorptive coating is thicker near the inner radius and becomes subsequently thinner toward the outer radius. 14 . A lamphead, comprising: a radiation source structure, the radiation source structure comprising a first surface with an absorptive coating, wherein the radiation source structure has a first thickness located at an outer radius and a second thickness located at an inner radius, and wherein the first thickness is greater than a second thickness; and one or more radiation source positions formed in the radiation source structure. 15 . The lamphead of claim 14 , wherein the absorptive coating is a carbon black paint. 16 . The lamphead of claim 14 , wherein the radiation source structure is water cooled. 17 . The lamphead of claim 14 , further comprising a printed circuit board disposed adjacent a second surface, wherein the second surface is opposite the first surface. 18 . The lamphead of claim 14 , wherein the radiation source structure comprises aluminum or copper. 19 . The lamphead of claim 14 , wherein the absorptive coating has a variety of thicknesses across the first surface. 20 . The lamphead of claim 14 , wherein the radiation source structure is conical.

Assignees

Inventors

Classifications

  • mainly by radiation · CPC title

  • by radiant heating of the substrate · CPC title

  • specially adapted for treating semiconductor wafers · CPC title

  • for semiconductor manufacture · CPC title

  • Supports specially adapted for semi-conductors · CPC title

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What does patent US2016336205A1 cover?
The embodiments described herein generally relate to a lamphead assembly with an absorbing upper surface in a thermal processing chamber. In one embodiment, a processing chamber includes an upper structure, a lower structure, a base ring connecting the upper structure to the lower structure, a substrate support disposed between the upper structure and the lower structure, a lower structure disp…
Who is the assignee on this patent?
Applied Materials Inc
What technology area does this patent fall under?
Primary CPC classification H10P72/0436. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Nov 17 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).