Method and apparatus for automatically adjusting dispensing units of a dispenser

Patent metadata

Field	Value
Publication number	US-2016270235-A1
Application number	US-201615165120-A
Country	US
Kind code	A1
Filing date	May 26, 2016
Priority date	Sep 30, 2013
Publication date	Sep 15, 2016
Grant date	—

Abstract

A dispensing apparatus includes a frame having a gantry configured to provide movement in the X axis and Y axis directions, and first and second dispensing units coupled to the gantry and configured to dispense material onto a substrate. The second dispensing unit is coupled to the gantry by an automatic adjustment mechanism. The dispensing apparatus further includes a controller configured to control the operation of the gantry, the first dispenser, the second dispenser, and the automatic adjustment mechanism. The automatic adjustment mechanism is configured to move the second dispenser in the X axis and Y axis directions to manipulate a spacing between the first dispensing unit and the second dispensing. Methods of dispensing material on the substrate are further disclosed.

First claim

What is claimed is:

1 . A method of dispensing viscous material on an electronic substrate, the method comprising:
delivering a first electronic substrate pattern to a dispense position; delivering a second electronic substrate pattern to a dispense position; moving first and second dispensing units over the first and second electronic substrate patterns with a gantry configured to move the first and second dispensing units in an X axis direction and a Y axis direction; aligning the first electronic substrate pattern with the first dispensing unit and the second electronic substrate pattern with the second dispensing unit with an automatic adjustment mechanism configured to move the second dispensing unit in the X axis direction and the Y axis direction a predetermined distance from the first dispensing unit; dispensing material from the first dispensing unit at desired locations on the first electronic substrate pattern; and dispensing material from the second dispensing unit at desired locations on the second electronic substrate pattern.

2 . The method of claim 1 , wherein dispensing material from the first dispensing unit at desired locations on the first electronic substrate pattern includes lowering the first dispensing unit toward the first electronic substrate pattern.

3 . The method of claim 2 , wherein dispensing material from the second dispensing unit at desired locations on the second electronic substrate pattern includes lowering the second dispensing unit toward the second electronic substrate pattern.

4 . The method of claim 1 , wherein the predetermined distance is determined by identifying a first point of reference associated with the first electronic substrate pattern and a second point of reference associated with the second electronic substrate pattern.

5 . The method of claim 4 , further comprising calibrating a distance between first and second dispensing units and a camera.

6 . The method of claim 1 , wherein if the at least two patterns are not properly positioned, simultaneously performing a first dispense operation on a first pattern of the at least two patterns and performing a second dispense operation on a second pattern of the at least two patterns.

7 . The method of claim 6 , wherein simultaneously performing first and second dispense operations includes dynamically positioning the second dispensing unit with the automatic adjustment mechanism.

Assignees

• Illinois Tool Works

Inventors

• Reid Scott A
• Read Hugh R
• Prentice Thomas C

Classifications

• H05K3/4644

  by building the multilayer layer by layer, i.e. build-up multilayer circuits (making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602) · CPC title

• B05C11/1021

  responsive to presence or shape of target (B05C11/1018 takes precedence) · CPC title

• H05K3/0085 Primary

  Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor (apparatus specially adapted for manufacturing assemblages of electric components, e.g. printed circuit boards, H05K13/00) · CPC title

• B05C5/0212

  only at particular parts of the articles (at particular part of web, band, strip, belt or ribbon B05C5/025) · CPC title

• H05K13/0469 Primary

  by applying a glue or viscous material · CPC title