Metal-Free Monolithic Epitaxial Graphene-On-Diamond PWB with Optical Waveguide

Patent metadata

Field	Value
Publication number	US-2016262262-A1
Application number	US-201615134624-A
Country	US
Kind code	A1
Filing date	Apr 21, 2016
Priority date	Mar 4, 2015
Publication date	Sep 8, 2016
Grant date	—

Abstract

According to some embodiments, an apparatus includes a circuit board made of polycrystalline diamond. The circuit board is formed by thermolysis of layers of a preceramic polymer. A plurality of tubes are formed within the circuit board and comprise a plurality of terminations at one or more surfaces of the circuit board. Each tube comprises a layer of graphene that is operable to permit each tube to conduct electrical current. Each layer of graphene is formed by thermolysis of the polycrystalline diamond circuit board at a temperature greater than or equal to 900 degrees Celsius. The apparatus also includes a plurality of optical waveguides formed within the circuit board. Each optical waveguide comprises a core of polycrystalline silicon carbide surrounded by polycrystalline diamond. The polycrystalline diamond is formed by thermolysis of poly(hydridocarbyne) and the silicon carbide is formed by thermolysis of poly(methylsilyne).

First claim

1 . An apparatus comprising:
a circuit board made of polycrystalline diamond, the circuit board having been formed by thermolysis of layers of a preceramic polymer; a plurality of tubes formed within the circuit board and comprising a plurality of terminations at one or more surfaces of the circuit board, each tube comprising a layer of graphene that is operable to permit each tube to conduct electrical current, each layer of graphene having been formed by thermolysis of the polycrystalline diamond circuit board at a temperature greater than or equal to 900 degrees Celsius; and a plurality of optical waveguides formed within the circuit board, each optical waveguide comprising a core of polycrystalline silicon carbide surrounded by polycrystalline diamond, the polycrystalline diamond having been formed by thermolysis of poly(hydridocarbyne), and the silicon carbide having been formed by thermolysis of poly(methylsilyne).

2 . The apparatus of claim 1 , wherein the preceramic polymer comprises one or more of poly(hydridocarbyne) and poly(methylsilyne).

3 . The apparatus of claim 1 , wherein at least some of the plurality of terminations are arranged in a pattern on a particular surface of the circuit board to receive connections of a component that is to be mounted to the circuit board.

4 . The apparatus of claim 1 , wherein the polycrystalline diamond comprises hexagonal polycrystalline diamond.

5 . The apparatus of claim 1 , wherein the optical waveguide terminates in a lens comprising polycrystalline silicon carbide.

6 . The apparatus of claim 1 , wherein at least some of the plurality of tubes are configured to be open to the atmosphere in order to equalize pressure between one or more of the plurality of tubes and the atmosphere.

7 . The apparatus of claim 1 , wherein at least some of the plurality of tubes further comprise a layer of polycrystalline diamond that forms an outer surface of the tube, the layer of polycrystalline diamond being deposited over the layer of graphene.

8 . The apparatus of claim 1 , wherein at least one tube further comprises one or more internal support structures.

9 . The apparatus of claim 1 , further comprising a plurality of heat sink fins formed on a surface of the circuit board, the plurality of fins made of polycrystalline diamond, the plurality of fins operable to conduct heat away from the circuit board.

10 . The apparatus of claim 1 , further comprising a capacitor formed within the circuit board, the capacitor comprising:
a first layer of graphene; a second layer of graphene; and a layer of polycrystalline diamond located between the first and second layers of graphene.

11 . The apparatus of claim 1 , further comprising cooling tubes formed within the circuit board, the cooling tubes configured to transmit a liquid through at least a portion of the circuit board in order to conduct heat away from the circuit board.

12 - 15 . (canceled)

16 . An apparatus comprising:
a circuit board made of polycrystalline diamond; and an optical waveguide formed within the circuit board, the waveguide terminating at one or more surfaces of the circuit board, the waveguide comprising a core of polycrystalline silicon carbide surrounded by polycrystalline diamond.

17 . The apparatus of claim 16 , the optical waveguide comprising a plurality of terminations that are arranged in a pattern on a particular surface of the circuit board to receive connections of a component that is to be mounted to the circuit board.

18 . The apparatus of claim 16 , wherein the polycrystalline diamond comprises hexagonal polycrystalline diamond.

19 . The apparatus of claim 16 , wherein the optical waveguide terminates in a lens comprising polycrystalline silicon carbide.

20 . The apparatus of claim 16 , further comprising a plurality of heat sink fins formed on a surface of the circuit board, the plurality of fins made of polycrystalline diamond, the plurality of fins operable to conduct heat away from the circuit board.

Assignees

• Lockheed Corp

Inventors

• Findley David G

Classifications

• G02B6/122

  Basic optical elements, e.g. light-guiding paths · CPC title

• H05K3/0085

  Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor (apparatus specially adapted for manufacturing assemblages of electric components, e.g. printed circuit boards, H05K13/00) · CPC title

• H05K2201/064

  Fluid cooling, e.g. by integral pipes · CPC title

• H05K1/0306 Primary

  Inorganic insulating substrates, e.g. ceramic, glass · CPC title

• C04B35/62645

  Thermal treatment of powders or mixtures thereof other than sintering · CPC title