Circuit element package, manufacturing method thereof, and manufacturing apparatus thereof

Patent metadata

Field	Value
Publication number	US-2016262292-A1
Application number	US-201615061233-A
Country	US
Kind code	A1
Filing date	Mar 4, 2016
Priority date	Mar 6, 2015
Publication date	Sep 8, 2016
Grant date	—

Abstract

A circuit element package, a manufacturing method thereof, and a manufacturing apparatus thereof are provided. The circuit element package includes a circuit element disposed on a printed circuit board, an insulating layer covering the circuit element, a first shielding layer covering a side surface of the insulating layer, and a second shielding layer covering an upper surface of the insulating layer and electrically connected to the first shielding layer.

First claim

What is claimed is:

1 . A circuit element package comprising:
a circuit element disposed on a printed circuit board; an insulating layer covering the circuit element; a first shielding layer covering a side surface of the insulating layer; and a second shielding layer covering an upper surface of the insulating layer and electrically connected to the first shielding layer.

2 . The circuit element package as claimed in claim 1 , wherein the first shielding layer comprises an electromagnetic shielding material having a viscosity greater than a viscosity of the insulating layer.

3 . The circuit element package as claimed in claim 1 , further comprising an edge bridge electrically connecting the first shielding layer to the second shielding layer.

4 . The circuit element package as claimed in claim 3 , wherein the second shielding layer is disposed on an upper surface of the insulating layer and an upper surface of the edge bridge.

5 . The circuit element package as claimed in claim 1 , further comprising:
an epoxy underfill through which the circuit element is disposed on the printed circuit board; and gas discharge holes disposed in portions of the first shielding layer and discharging gas that is generated by the epoxy underfill.

6 . The circuit element package as claimed in claim 1 , further comprising:
a ground pad disposed on the printed circuit board; and a skirt portion disposed on an upper surface of the ground pad, wherein the first shielding layer is disposed on an upper surface of the skirt portion.

7 . The circuit element package as claimed in claim 1 , further comprising an insulating adhesive layer disposed on a bottom surface of the second shielding layer and covering the circuit element having a height greater than a height of the insulating layer.

8 . The circuit element package as claimed in claim 1 , wherein the insulating layer comprises an insulating mold having an open bottom surface and a space disposed in the insulating mold.

9 . The circuit element package as claimed in claim 1 , wherein the insulating layer is disposed on a bottom surface of the second shielding layer, and
an air gap is disposed inside the first shielding layer.

10 . The circuit element package as claimed in claim 1 , wherein the second shielding layer comprises through-holes disposed along sides of the second shielding layer, and
the circuit element package further comprises a connection layer disposed along a circumferential portion of an upper surface of the second shielding layer on which the through-holes are disposed, disposed in the through-holes, and electrically connecting the first shielding layer to the second shielding layer.

11 . A method of manufacturing a circuit element package, the method comprising:
forming a circuit element on a printed circuit board; forming an insulating layer covering the circuit element; and forming a shielding layer covering the insulating layer, wherein the shielding layer comprises:
a first shielding layer covering a side surface of the insulating layer; and
a second shielding layer covering an upper surface of the insulating layer and electrically connected to the first shielding layer.

12 . The method as claimed in claim 11 , wherein the forming the insulating layer comprises:
injecting the insulating layer in the first shielding layer; and curing the insulating layer.

13 . The method as claimed in claim 11 , wherein the forming the shielding layer comprises forming simultaneously an upper portion and a lower portion of the first shielding layer.

14 . The method as claimed in claim 11 , further comprising:
varying a temperature of a material of the insulating layer or vibrate the material of the insulating layer before the forming the insulating layer to vary a viscosity of the material of the insulating layer; and varying a temperature of a material of the shielding layer or vibrate the material of the shielding layer before the forming the shielding layer to vary a viscosity of the material of the shielding layer.

15 . The method as claimed in claim 11 , further comprising forming an edge bridge electrically connecting the first shielding layer to the second shielding layer in response to the forming the shielding layer.

16 . An apparatus for manufacturing a circuit element package, the apparatus comprising:
a dispenser; a driver configured to move the dispenser; and a controller configured to control the dispenser and the driver, wherein the dispenser comprises:
a storage chamber configured to store a material of an insulating layer or a shielding layer;
a material viscosity variator configured to vary a viscosity of the stored material; and
a nozzle configured to discharge the varied material.

17 . The apparatus as claimed in claim 16 , wherein the material viscosity variator comprises a vibrator disposed in the storage chamber and configured to vibrate the stored material, and
the controller is further configured to control the vibrator to apply a shear stress to the material using a thixotropy of the material to vary the viscosity of the material.

18 . The apparatus as claimed in claim 16 , wherein the nozzle comprises:
a first discharger disposed on a side surface of the nozzle and having a height greater than a width of the first discharger; and a second discharger disposed on a lower end of the nozzle and configured to communicate with the first discharger.

19 . The apparatus as claimed in claim 16 , wherein the nozzle comprises:
an upper discharge port disposed on a side surface of the nozzle; and a lower discharge port disposed on the side surface of the nozzle, disposed on a lower side of the upper discharge port, and disposed forward the upper discharge port.

20 . The apparatus as claimed in claim 16 , wherein the nozzle comprises three or more discharge ports on a side surface of the nozzle in upward and downward directions.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Kuk Keon
• Ko Young-Dae
• Beak O-Hyun
• Han Eun-Bong
• KIM Hyeon-hyang
• Jung Yeon-Kyoung
• Mun Il-Ju

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/252

  comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W70/65

  Shapes or dispositions of interconnections · CPC title

• H10W76/47

  Solid or gel fillings · CPC title

• H10W42/284

  shielding resins · CPC title