Electronic device module having a shield layer

Patent metadata

Field	Value
Publication number	US-2016157392-A1
Application number	US-201514822879-A
Country	US
Kind code	A1
Filing date	Aug 10, 2015
Priority date	Dec 1, 2014
Publication date	Jun 2, 2016
Grant date	—

Abstract

An electronic device module includes an electronic unit, a sealing layer covering the electronic unit and containing organic molecules, a shield layer covering the sealing layer and containing inorganic elements on an inner surface thereof, and a bonding layer formed between the sealing layer and the shield layer, and containing molecules that are chemically bonded with the organic molecules of the sealing layer and the inorganic elements of the shield layer.

First claim

What is claimed is:

1 . An electronic device module, comprising:
an electronic unit; a sealing layer covering the electronic unit and containing organic molecules; a shield layer covering the sealing layer and containing inorganic elements on an inner surface thereof; and a bonding layer formed between the sealing layer and the shield layer, and containing molecules that are chemically bonded with the organic molecules of the sealing layer and the inorganic elements of the shield layer.

2 . The electronic device module according to claim 1 , wherein the shield layer contains catalyst elements for metal plating as the inorganic elements.

3 . The electronic device module according to claim 2 , wherein the catalyst elements include at least one of palladium, iron, nickel, and platinum.

4 . The electronic device module according to claim 2 , wherein the shield layer includes metal elements that are chemically bonded with the catalyst elements.

5 . The electronic device module according to claim 4 , wherein the metal elements include copper.

6 . The electronic device module according to claim 1 , wherein
the sealing layer includes a top surface and side surfaces, and the bonding layer is formed on the top surface and the side surfaces of the sealing layer.

7 . The electronic device module according to claim 1 , wherein
an electronic unit is configured to radiate an electromagnetic wave, and the shield layer shields the electromagnetic wave radiated from the electronic unit.

8 . A method for manufacturing an electronic device module, comprising:
preparing a structure including an electronic unit and a sealing layer covering the electronic unit and containing organic molecules; applying a bonding material on the sealing layer, the bonding material containing molecules that are chemically bondable with the organic molecules of the sealing layer; and forming a shield layer on the bonding material, the shield layer containing inorganic elements on an inner surface thereof that are chemically bonded with the molecules of the bonding material.

9 . The method according to claim 8 , further comprising:
prior to applying the bonding material, forming hydroxyl groups on the outer surface of the sealing layer.

10 . The method according to claim 8 , wherein
a dithiol triazine group is generated when the molecules of the bonding material are chemically bonded with the organic molecules of the sealing layer.

11 . The method according to claim 8 , wherein forming the shield layer includes
forming, on the bonding material, catalyst elements for metal plating that are chemically bondable with the molecules of the bonding material, as the inorganic elements, and forming, on the catalyst elements, metal elements that are chemically bondable with the catalyst elements.

12 . The method according to claim 11 , wherein the catalyst elements include at least one of palladium, iron, nickel, and platinum.

13 . The method according to claim 11 , wherein the metal elements include copper.

14 . The method according to claim 11 , wherein
the metal elements are formed by an electroless plating using the catalyst elements.

15 . The method according to claim 8 , wherein
the sealing layer includes a top surface and side surfaces, and the bonding layer is formed on the top surface and the side surfaces of the sealing layer.

16 . The method according to claim 8 , wherein
the electronic unit is configured to radiate an electromagnetic wave, and the shield layer shields the electromagnetic wave radiated from the electronic unit.

17 . A method for shielding an electromagnetic wave radiated from an electronic unit, comprising:
covering an electronic unit with a sealing layer containing organic molecules; applying a bonding material on the sealing layer, the bonding material containing molecules that are chemically bondable with the organic molecules of the sealing layer; and forming a shield layer on the bonding material, the shield layer containing inorganic elements on an inner surface thereof that are chemically bonded with the molecules of the bonding material.

18 . The method according to claim 17 , further comprising:
prior to applying the bonding material, forming hydroxyl groups on the outer surface of the sealing layer.

19 . The method according to claim 17 , wherein the forming of the shield layer includes
forming, on the bonding material, catalyst elements for metal plating that are chemically bondable with the molecules of the bonding material, as the inorganic elements, and forming, on the catalyst elements, metal elements that are chemically bondable with the catalyst elements.

20 . The method according to claim 19 , wherein
the metal elements are formed by an electroless plating using the catalyst elements.

Assignees

• Toshiba Kk

Inventors

• Happoya Akihiko

Classifications

• G06F1/1656 Primary

  Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories (mounting of accessories to a computer display G06F1/1607; display hoods G06F1/1603; cooling arrangements for portable computers G06F1/203) · CPC title

• H10W42/276

  the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H05K9/0084

  comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition · CPC title

• H05K9/0007 Primary

  Casings (standardised racks H05K9/0062) · CPC title