Carrier substrate, method of manufacturing the same, and method of manufacturing flexible display device using the carrier substrate

Patent metadata

Field	Value
Publication number	US-9355877-B2
Application number	US-201313802385-A
Country	US
Kind code	B2
Filing date	Mar 13, 2013
Priority date	Aug 31, 2012
Publication date	May 31, 2016
Grant date	May 31, 2016

Abstract

A carrier substrate includes: a base substrate; a first coating layer on a first surface of the base substrate; and a second coating layer on a second surface of the base substrate. The thermal expansion coefficients of the first coating layer and the second coating layer are greater than a thermal expansion coefficient of the base substrate, and a thickness of the first coating layer is different from a thickness of the second coating layer.

First claim

What is claimed is:

1. A method of manufacturing a flexible display device, the method comprising:
preparing a carrier substrate;
forming a display unit on the carrier substrate; and
encapsulating the display unit,
wherein the preparing of the carrier substrate comprises:
forming a first coating layer on a first surface of a base substrate so as to cause a warpage of the base substrate; and
forming a second coating layer on a second surface of the base substrate so as to compensate for the warpage of the base substrate,
wherein a thickness of the second coating layer is greater than a thickness of the first coating layer, and the display unit is formed on the second coating layer.

2. The method of claim 1 , wherein the first coating layer and the second coating layer comprise polyimide.

3. The method of claim 1 , wherein the thickness of the first coating layer is from about 6 μm to about 8 μm, and the thickness of the second coating layer is from about 8 μm to about 12 μm.

4. The method of claim 1 , wherein the base substrate comprises glass, and thermal expansion coefficients of the first coating layer and the second coating layer are greater than a thermal expansion coefficient of the base substrate.

5. The method of claim 1 , wherein the display unit comprises an active layer, and the active layer is formed by crystallizing amorphous silicon.

6. The method of claim 1 , further comprising separating the second coating layer having the display unit on an upper surface thereof from the base substrate.

7. The method of claim 6 , wherein the separating the second coating layer from the base substrate comprises irradiating a laser beam having a wavelength of from about 250 nm to about 350 nm and an energy of from about 250 mJ/cm2 to about 350 mJ/cm2 onto an interface between the second coating layer and the base substrate.

Assignees

• Samsung Display Co Ltd

Inventors

• Lee Dong-Min
• Yoon Young-Sik
• Kim Mu-Gyeom
• Kim Mu-Jin
• Park Jae-Hyun

Classifications

• H10P72/7438

  with parts of the auxiliary support remaining in the finished device · CPC title

• H10P72/7426

  used as a support during build up manufacturing of active devices · CPC title

• H10P72/744

  Details of chemical or physical process used for separating the auxiliary support from a device or a wafer · CPC title

• H10P72/10

  using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] · CPC title

• H10P72/74 Primary

  using temporarily an auxiliary support · CPC title