Vacuum tweezer and method for manufacturing semiconductor device

US2016247705A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016247705-A1
Application numberUS-201514925297-A
CountryUS
Kind codeA1
Filing dateOct 28, 2015
Priority dateFeb 25, 2015
Publication dateAug 25, 2016
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A vacuum tweezer includes: a tweezer body including a suction distal end portion that performs vacuum suction of an object to be suctioned; and a light source causing a beam to be condensed at a position on an extension of the suction distal end portion on which a vacuum suction force acts.

First claim

Opening claim text (preview).

What is claimed is: 1 . A vacuum tweezer comprising: a tweezer body including a suction distal end portion that performs vacuum suction of an object to be suctioned; and a light source causing a beam to be condensed at a position on an extension of the suction distal end portion on which a vacuum suction force acts. 2 . The vacuum tweezer of claim 1 , wherein the light source is placed inside the suction distal end portion and the beam is radiated from a distal end port of the suction distal end portion. 3 . The vacuum tweezer of claim 1 , wherein the light source is separated from the tweezer body and the beam radiated from the light source is guided to the tweezer body via an optical fiber. 4 . A method for manufacturing a semiconductor device wherein a semiconductor chip is moved by using the vacuum tweezer of claim 1 . 5 . A vacuum tweezer comprising: a tweezer body including a suction distal end portion that performs vacuum suction of an object to be suctioned; and a light source causing a plurality of beams to be crossed each other at a position on an extension of the suction distal end portion on which a vacuum suction force acts. 6 . The vacuum tweezer of claim 5 , wherein the plurality of beams are three beams. 7 . The vacuum tweezer of claim 5 , wherein the plurality of beams have mutually different colors. 8 . The vacuum tweezer of claim 5 , further comprising an optical fiber branching one beam radiated from the light source into the plurality of beams. 9 . The vacuum tweezer of claim 5 , wherein the light source is separated from the tweezer body and the beam radiated from the light source is guided to the tweezer body via an optical fiber. 10 . A method for manufacturing a semiconductor device wherein a semiconductor chip is moved by using the vacuum tweezer of claim 5 .

Assignees

Inventors

Classifications

  • Process monitoring, e.g. flow or thickness monitoring · CPC title

  • H10P72/78Primary

    using vacuum or suction, e.g. Bernoulli chucks · CPC title

  • B25B11/007Primary

    portable, e.g. handheld · CPC title

  • Manipulators transporting wafers · CPC title

  • with vacuum · CPC title

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Frequently asked questions

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What does patent US2016247705A1 cover?
A vacuum tweezer includes: a tweezer body including a suction distal end portion that performs vacuum suction of an object to be suctioned; and a light source causing a beam to be condensed at a position on an extension of the suction distal end portion on which a vacuum suction force acts.
Who is the assignee on this patent?
Mitsubishi Electric Corp
What technology area does this patent fall under?
Primary CPC classification H10P72/78. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Aug 25 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).