Cooling system for processing chamber
US-2024393018-A1 · Nov 28, 2024 · US
US2016240772A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016240772-A1 |
| Application number | US-201615134840-A |
| Country | US |
| Kind code | A1 |
| Filing date | Apr 21, 2016 |
| Priority date | Nov 18, 2013 |
| Publication date | Aug 18, 2016 |
| Grant date | — |
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This invention provides a manufacturing method of a magnetoresistive effect element having a higher MR ratio than a conventional element. A manufacturing method of a magnetoresistive effect element of an embodiment of the invention includes: a step of forming a tunnel barrier layer on a substrate, on a surface of which one of a magnetization free layer and a magnetization fixed layer is formed; a step of cooling the substrate after the step of forming a tunnel barrier layer; a step of forming an other one of the magnetization free layer and the magnetization fixed layer on the tunnel barrier layer after the step of cooling; and a step of raising a temperature of the substrate after the step of forming the other one of the magnetization free layer and the magnetization fixed layer.
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1 . A manufacturing method of a magnetoresistive effect element comprising: a first step of forming a tunnel barrier layer on a substrate, on a surface of which one of a magnetization free layer and a magnetization fixed layer is formed; a second step of cooling the substrate after the first step; a third step of forming an other one of the magnetization free layer and the magnetization fixed layer on the tunnel barrier layer after the second step; a fourth step of raising a temperature of the substrate after the third step, to a temperature that is higher than a dew-point temperature and is lower than a crystallization temperature of the other one of the magnetization free layer and the magnetization fixed layer; a fifth step of forming a top electrode on the other one of the magnetization free layer and the magnetization fixed layer after the fourth step; and a sixth step of raising the temperature of the substrate after the fifth step, to a temperature equal to or higher than the crystallization temperature. 2 . (canceled) 3 . The manufacturing method according to claim 1 , further comprising a step of forming a pin layer after the fourth step. 4 . The manufacturing method according to claim 1 , further comprising a step of forming a pin layer before the first step. 5 . The manufacturing method according to claim 1 , wherein the second step comprises cooling the substrate to a temperature equal to or below 200 K. 6 . The manufacturing method according to claim 1 , wherein: each of the magnetization free layer and the magnetization fixed layer is a CoFeB layer, the other one of the magnetization free layer and the magnetization fixed layer includes an amorphous phase, and boron content of the other one of the magnetization free layer and the magnetization fixed layer is equal to or below 15 at %. 7 . The manufacturing method according to claim 1 , wherein the magnetoresistive effect element is a perpendicular magnetization-type MTJ element.
characterised by lifting arrangements, e.g. lift pins · CPC title
mainly by convection · CPC title
for applying spin-exchange-coupled multilayers, e.g. nanostructured superlattices (spin-exchange-coupled multilayers H01F10/32) · CPC title
Spin-exchange coupled multilayers having at least one layer with perpendicular magnetic anisotropy · CPC title
having a L10 crystallographic structure, e.g. [Co,Fe][Pt,Pd] thin films · CPC title
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