Method for Electrophoretically Depositing a Film on an Electronic Assembly
US-2016240449-A1 · Aug 18, 2016 · US
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Patent family 50273290
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 50273290 |
| Family type | — |
| Earliest priority | Sep 14, 2012 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US2016240449A1 — Method for Electrophoretically Depositing a Film on an Electronic Assembly |
Representative publication
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US2016240449A1 — Method for Electrophoretically Depositing a Film on an Electronic Assembly (published Aug 18, 2016)
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